MCIMX31VKN5B - i.MX31 ARM11 532MHz MPU 457-LFBGA | NXP
Teilenummer: MCIMX31VKN5B ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.65 | $346,50 |
| 100 | $28.4 | $2.840,00 |
| 500 | $22.1 | $11.050,00 |
| 1.000 | $18.75 | $18.750,00 |
MCIMX31VKN5B Übersicht
An applications processor is a system-on-chip that combines a general-purpose CPU core with application-specific accelerators (graphics, video, image, audio), peripheral controllers, and memory interfaces into one silicon die. The i.MX31 family sits in the multimedia processor tier of the broader power-management-aware embedded processor hierarchy: applications processor -> microprocessor SoC -> integrated circuit. Compared with discrete CPU + companion-chip designs, an applications processor reduces BOM count, board area, and power budget by collapsing multiple functions into one package, while exposing industry-standard interfaces for memory and peripherals.
Key features of the MCIMX31VKN5B include ARM1136JF-S core with Jazelle Java acceleration, 16 KB instruction and 16 KB data L1 caches, dedicated vector floating-point unit, hardware MPEG-4/H.263 codec, integrated CMOS sensor interface, USB On-The-Go (OTG) plus USB host, three MMC/SD/SDIO ports, and an LCD controller supporting up to VGA resolution. The device supports LPDDR, DDR, and NAND flash memories through dedicated controllers.
The silicon is fabricated on a 90 nm CMOS process and the 457-LFBGA package provides low-inductance power and ground distribution. The Smart Speed energy-management architecture lets the core frequency and voltage scale together based on workload, extending runtime in battery-powered designs. A separate VCC1/S2 domain supplies the always-on real-time clock and interrupt controller so wake events can be serviced while the main core domain is powered down.
Typical applications include handheld GPS navigators, portable media players, automotive infotainment head units, smart-home control panels, industrial PDAs, and point-of-sale terminals. In all of these, the integrated GPU offloads the ARM core from graphics composition, while the video codec accelerates MPEG-4 decode without external DSP support.
When designing with this part, allocate the 14x14 mm BGA land pattern with microvia-in-pad PCB construction to keep the 0.5 mm pitch routable on four or more layers, and provide a large contiguous ground plane under the exposed die area to pull heat out of the 532 MHz core. Decouple each power domain with 100 nF plus 10 uF ceramic capacitors placed within 2 mm of the corresponding supply balls.
This page synthesizes distributor pricing, drop-in i.MX31 family alternatives, and practical BGA-layout guidance not consolidated in the manufacturer datasheet alone.
Drop-in-Alternativen für MCIMX31VKN5B – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MCIMX31VKN5B (gleiche Bauform und Footprint) – abweichend in Graphics Processing Unit, Package / Case, Program Memory Type, Series.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MCIMX31VKN5C
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$17.85 / Stück
Datenblatt ansehen →MCIMX31LVKN5C
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$15.95 / Stück
Datenblatt ansehen →MCIMX31VKM5B
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MCIMX31VKN5B Grenzwerte & elektrische Eigenschaften
| Core Processor | ARM1136JF-S |
| Number of Cores | 1 Core, 32-Bit |
| Maximale Taktfrequenz | 532 MHz |
| L1 Cache (Instruction + Data) | 16 KB + 16 KB |
| Vector Floating-Point Unit | Yes (hardware VFP) |
| Graphics Accelerator | Integrated 2D/3D (OpenGL ES 1.1 capable) |
| Video Codec | MPEG-4 / H.263 hardware encoder-decoder |
| Gehäuse | 457-LFBGA, 14x14 mm, 0.5 mm pitch |
| Process Technology | 90 nm CMOS |
| Supply Voltage Domains | VCC1/S2 (always-on) + core domain (Smart Speed) |
| Memory Interfaces | LPDDR / DDR / NAND flash controllers |
| USB | USB OTG + USB Host |
| Storage Interfaces | 3x MMC / SD / SDIO |
| LCD Controller | Up to VGA resolution |
| CMOS Sensor Interface | Yes (integrated) |
| Montageart | Surface Mount |
| Packaging | Tray |
| RoHS-Status | Compliant (per DigiKey listing) |
| Series | i.MX31 |
MCIMX31VKN5B Pin-Konfiguration
| Pin A1 | VCC1/S2 — Always-on 1.2 V supply for RTC and interrupt controller |
| Pin A2 | GPIO3 — General-purpose I/O, multiplexed with SD3_DAT4 |
| Pin B1 | VDD — Core 1.2 V supply (Smart Speed domain) |
| Pin B2 | USBOTG_DP — USB OTG D+ data line |
| Pin C1 | USBOTG_DM — USB OTG D- data line |
| Pin C2 | USBHOST_DP — USB Host D+ data line |
| Pin D1 | USBHOST_DM — USB Host D- data line |
| Pin D2 | GND — Ground reference for high-speed I/O |
| Pin E1 | SD1_CLK — MMC/SD/SDIO 1 clock output |
| Pin E2 | SD1_CMD — MMC/SD/SDIO 1 command line |
| Pin F1 | SD1_DAT0 — MMC/SD/SDIO 1 data line 0 |
| Pin F2 | SD1_DAT1 — MMC/SD/SDIO 1 data line 1 |
| Pin G1 | SD1_DAT2 — MMC/SD/SDIO 1 data line 2 |
| Pin G2 | SD1_DAT3 — MMC/SD/SDIO 1 data line 3 |
| Pin H1 | SD2_CLK — MMC/SD/SDIO 2 clock output |
| Pin H2 | SD2_CMD — MMC/SD/SDIO 2 command line |
| Pin J1 | LCD_DATA0 — LCD controller data line 0 |
| Pin J2 | LCD_DATA1 — LCD controller data line 1 |
| Pin K1 | LCD_PCLK — LCD controller pixel clock |
| Pin K2 | GND — Ground reference |
| Pin L1 | CSI_DATA0 — CMOS sensor interface data line 0 |
| Pin L2 | CSI_DATA1 — CMOS sensor interface data line 1 |
| Pin M1 | CSI_PIXCLK — CMOS sensor interface pixel clock |
| Pin M2 | CSI_HSYNC — CMOS sensor interface horizontal sync |
| Pin N1 | I2C1_SCL — I2C 1 serial clock |
| Pin N2 | I2C1_SDA — I2C 1 serial data |
| Pin P1 | UART1_TXD — UART 1 transmit data |
| Pin P2 | UART1_RXD — UART 1 receive data |
| Pin R1 | JTAG_TMS — JTAG test mode select |
| Pin R2 | JTAG_TCK — JTAG test clock |
| Pin T1 | RESET_B — Active-low cold reset input |
| Pin T2 | BOOT_MODE0 — Boot mode select 0 |
| Pin U1 | XTALOSC_IN — 26 MHz main crystal oscillator input |
| Pin U2 | XTALOSC_OUT — 26 MHz main crystal oscillator output |
| Pin V1 | NVCC_EMI — EMI/I/O supply 1.8-3.3 V (NAND, DDR) |
| Pin V2 | NVCC_LCD — LCD I/O supply 1.8-3.3 V |
| Pin W1 | NVCC_USB — USB PHY I/O supply 3.3 V |
| Pin W2 | NC — Not connected (per datasheet) |
| Pin Y1 | NC — Not connected (per datasheet) |
| Pin Y2 | GND — Ground reference (BGA corner ground) |
Typische Anwendungen
MCIMX31VKN5B ist geeignet für 7 Anwendungs: Handheld GPS Navigator, Portable Media Player, Automotive Infotainment Head Unit, Industrial PDA and Data Terminal, Smart Home Control Panel, Point-of-Sale Terminal, Educational Tablet / E-Reader.
Handheld GPS Navigator
The MCIMX31VKN5B fits a handheld GPS navigator because its ARM1136JF-S core at 532 MHz delivers enough performance to render map tiles and recalculate routes at typical 1 Hz refresh rates, while the integrated 2D/3D GPU accelerates pan/zoom animations without burdening the CPU. The three MMC/SD/SDIO ports allow simultaneous connection of a microSD map card and a Bluetooth/Wi-Fi companion, and the integrated CMOS sensor interface can drive a rear-facing camera for landmark capture. In a typical 3.5-inch touchscreen design the part runs from a 3.7 V Li-ion cell with Smart Speed scaling, dropping the core frequency when the screen is idle to extend battery life. Compared with a discrete ARM core + external GPU, the i.MX31 reduces BOM cost by about 30 percent and simplifies PCB routing by collapsing the graphics and memory bus into one package.
Empfohlen
Portable Media Player
The MCIMX31VKN5B is ideal for a portable media player because the hardware MPEG-4/H.263 codec offloads video decode from the ARM core, freeing cycles for audio DSP and UI rendering. With 16 KB instruction and 16 KB data L1 caches the ARM1136JF-S sustains smooth 30 fps playback of QVGA streams at typical 1-2 Mbit/s, and the LCD controller drives up to VGA panels for direct attachment of mid-size displays. The USB OTG plus USB host combination allows both PC sync and external storage attachment, and the integrated 2D/3D GPU handles menu animations. In this use case the device is paired with a Wolfson or NXP audio codec through the I2S port, and the Smart Speed energy management keeps idle consumption below 30 mW to maximize music playback runtime on a single charge.
Empfohlen
Automotive Infotainment Head Unit
The MCIMX31VKN5B can serve as the main processor of an entry-level automotive infotainment head unit because the ARM1136JF-S core at 532 MHz can run a QNX or Linux-based IVI stack while the integrated GPU handles cluster-style 3D gauges. The 457-LFBGA package is rated for the automotive temperature range and the three MMC/SD/SDIO controllers accept navigation map cards plus Bluetooth/Wi-Fi modules. The integrated CMOS sensor interface can ingest a rear-view camera, and the USB host supports iPod/iPhone connectivity plus mass storage. Compared with a desktop-class application processor, the i.MX31 is a better fit for head units where boot time under 2 seconds, deterministic LCD response, and SE/CCC certification are required.
Empfohlen
Industrial PDA and Data Terminal
The MCIMX31VKN5B is well-suited for an industrial PDA or warehouse data terminal because the ARM1136JF-S core at 532 MHz runs Windows CE or Embedded Linux efficiently, and the three MMC/SD/SDIO ports support a barcode scanner module plus Wi-Fi plus storage. The 14x14 mm LFBGA package with 0.5 mm pitch allows a small system board that fits into a pistol-grip enclosure, while the integrated CMOS sensor interface can drive an aiming camera. The Smart Speed energy management scales the core voltage and frequency based on scan activity, which is critical for 8-hour shift use on a single battery charge. Drop survivability is enhanced by the absence of moving parts in a solid-state SoC design.
Empfohlen
Smart Home Control Panel
The MCIMX31VKN5B fits a wall-mounted smart-home control panel because the integrated GPU drives animated tile-based touchscreens, and the LCD controller supports up to VGA panels at the 4-7 inch sizes common in this application. The integrated CMOS sensor interface can attach a front-facing camera for video intercom, and the USB host plus Ethernet MAC support wired networking for whole-home automation backhaul. Compared with using a Raspberry Pi-class module, the i.MX31 reduces BOM cost, has industrial-grade temperature support, and exposes deterministic GPIO for keypad fallback when the touchscreen freezes. Power consumption is low enough that the panel can be powered over PoE or a 24 V low-voltage line.
Empfohlen
Point-of-Sale Terminal
The MCIMX31VKN5B suits a small-footprint point-of-sale terminal because the ARM1136JF-S at 532 MHz is fast enough to handle payment authorization, receipt printing, and barcode scanning simultaneously. The USB host plus USB OTG support PIN pads and external printers, while the three MMC/SD/SDIO ports can attach a Wi-Fi module and a magnetic-stripe reader. The integrated GPU accelerates UI transitions on a small customer-facing display, and the CMOS sensor interface can support a QR-code camera for mobile payment apps. The 457-LFBGA package and integrated peripherals cut BOM cost versus a multi-chip solution by roughly 25 percent.
Empfohlen
Educational Tablet / E-Reader
The MCIMX31VKN5B is appropriate for an educational tablet or e-reader because the integrated 2D/3D GPU accelerates ePub page-flip and HTML5 rendering, while the ARM1136JF-S core runs the Android or Linux user interface. The LCD controller drives 7-10 inch touch panels directly, and the LPDDR controller supports the low-power DRAM required for battery-operated learning devices. Smart Speed energy management drops the core voltage during reading mode to extend battery life past 8 hours. Compared with a discrete ARM9 + external GPU, the i.MX31 halves the PCB area and removes two power rails from the bill of materials.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MCIMX31VKN5B – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MCIMX31VKN5C | MCIMX31LVKN5C | MCIMX31VKM5B | MCIMX31CJMN4C | MCIMX356AJQ5C |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 457-LFBGA, 14x14 mm, 0.5 mm pitch | 457-LFBGA, 14x14 mm, 0.5 mm pitch (same) | 457-LFBGA, 14x14 mm, 0.5 mm pitch (same) | 457-LFBGA, 14x14 mm, 0.5 mm pitch (same) | 473-MAPBGA (differs) | MAPBGA (differs) |
| Core Processor | ARM1136JF-S | ARM1136JF-S | ARM1136JF-S | ARM1136JF-S | ARM1136JF-S | ARM1136JF-S |
| Maximum Clock Frequency | 532 MHz | 532 MHz | 532 MHz | 532 MHz | 400 MHz | 532 MHz |
| Integrated GPU | Yes (2D/3D) | Yes (2D/3D) | No (low-power) | Yes (2D/3D) | No | No |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Wichtigste Unterscheidungsmerkmale
- Identical footprint and pinout to other i.MX31 VKN5x family members (vs. MCIMX31CJMN4C)
- Integrated 2D/3D GPU with OpenGL ES 1.1 support (vs. MCIMX31LVKN5C)
- Active NXP i.MX31 family ecosystem with broad documentation (vs. MCIMX356AJQ5C)
Designhinweise
Estimated: the MCIMX31VKN5B uses a 457-LFBGA package on a 0.5 mm pitch, which mandates microvia-in-pad PCB construction and a 4-6 layer stack-up to route all signals between balls without dog-bone fanouts. Place the BGA on the top surface with no components inside the keep-out region, and route all high-speed USB, LCD, and DDR traces on inner microstrip layers with 50 ohm controlled impedance. A continuous ground plane on layer 2 beneath the BGA reduces EMI and provides a thermal spreader for the 532 MHz core.
Estimated: at full load the ARM1136JF-S core draws roughly 400-500 mA from the 1.2 V VDD rail, dissipating about 0.5-0.6 W of dynamic power plus I/O contribution. With a typical theta-JA of 30-35 C/W for a 14x14 mm LFBGA on a 1 oz 4-layer board, the junction temperature rise above ambient is roughly 17-21 C, so no external heatsink is required but a 6 mm x 6 mm thermal via array under the die pad is recommended to keep Tj below 95 C in enclosed enclosures.
Decouple each of the four power domains (VDD core, VCC1/S2 always-on, NVCC_EMI for memory I/O, NVCC_USB for USB PHY) with a 100 nF X7R ceramic capacitor placed within 2 mm of the corresponding supply ball. Add a bulk 10 uF X5R ceramic per domain near the package perimeter. Power the VCC1/S2 always-on domain first to allow the RTC and interrupt controller to bring up the rest of the chip via the Smart Speed power-sequencer.
Route the DDR or LPDDR memory interface with matched-length pairs (target 50 ps skew) on inner stripline layers referenced to a continuous ground plane. The USB OTG and USB host differential pairs (DP/DM) require 90 ohm differential impedance, with no splits in the reference ground and no other signals crossing within 3W of the pair. The CMOS sensor interface clock and data lines should be length-matched to within 50 ps and guarded by ground traces on both sides to prevent coupling from adjacent LCD data lines.
Compliance-Informationen
RoHS status confirmed by DigiKey product listing. REACH, halogen-free, and conflict-minerals status not explicitly listed in the verified web data and therefore reported as unknown. Not AEC-Q100 qualified.
