NXP Semiconductors

MCIMX6S6AVM08AB - i.MX 6Solo ARM Cortex-A9 800MHz MPU | NXP

MPN: MCIMX6S6AVM08AB ✗ End of Life
In Stock Ships in 1-3 business days
624-pin MAPBGA (21 x 21 mm) Package 800 MHz Speed DDR3, LPDDR2 Memory
From $25.1 USD / Unit
MOQ: 1 |
Price updated: 2026-10-16
Volume Pricing
Qty Unit Price Extended
1 $38.5 $38.50
10 $35.2 $352.00
100 $31.8 $3,180.00
500 $28.45 $14,225.00
1,000 $25.1 $25,100.00
ℹ️ All prices are in USD

MCIMX6S6AVM08AB Overview

The NXP MCIMX6S6AVM08AB is an i.MX 6Solo applications processor featuring a single ARM Cortex-A9 core running at 800 MHz, packaged in a 624-pin MAPBGA (21 x 21 mm). It integrates enhanced capabilities for portable and consumer multimedia products while meeting MIPS needs of operating systems and gaming workloads. The device supports a multilevel memory system and Smart Speed Technology for power-efficient operation. According to the manufacturer datasheet, the i.MX 6Solo combines scalable platforms with broad levels of integration particularly suited to multimedia applications.

An applications processor (AP) is a system-on-chip (SoC) designed to run rich operating systems such as Linux, Android, or Windows Embedded while handling multimedia workloads. It sits at the top of the embedded processor hierarchy above microcontrollers (MCUs) and DSPs, integrating CPU cores, GPUs, memory controllers, display interfaces, and connectivity peripherals on a single die. The i.MX 6 family from NXP occupies the mid-range of this hierarchy, balancing performance, power consumption, and multimedia capability for consumer and industrial products.

Key features include a single ARM Cortex-A9 core at 800 MHz, integrated 2D and 3D graphics acceleration, multi-format HD video engine, and a rich set of peripherals including USB, Ethernet, PCI Express, and MIPI display/camera interfaces. The device supports DDR3 and LPDDR2 memory and includes hardware accelerators for video decoding and encoding at up to 1080p resolution. The 624-pin MAPBGA package exposes the full set of multimedia and connectivity interfaces.

At the architecture level, the i.MX 6Solo integrates a Neon SIMD engine for media processing, an L2 cache controller, and multiple power domains for granular clock gating. The Cortex-A9 core includes out-of-order execution and a VFPv3 floating-point unit suitable for graphics and signal-processing tasks. The platform targets products where a single high-performance core is sufficient and power efficiency is critical.

Typical applications include industrial HMI panels, point-of-sale terminals, portable medical devices, automotive infotainment, smart home gateways, and consumer multimedia devices. The wide peripheral set and Linux/Android support make it suitable for products requiring rich UI capabilities combined with deterministic real-time response.

When designing with this device, ensure PCB layout follows the MAPBGA escape routing guidelines with matched-length DDR traces. Thermal management is required for sustained 800 MHz operation, and the boot configuration pins must be set according to the desired boot source (NOR, NAND, SD, or eMMC).

This page synthesizes distributor pricing, lifecycle status, drop-in alternatives from the i.MX 6 family, and practical design notes not found in the standalone datasheet.

Drop-in alternatives for MCIMX6S6AVM08AB — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with MCIMX6S6AVM08AB (same form factor and footprint) — differing in Package, RoHS Status, Core Architecture, Display Interface, Memory Interface.

NXP Semiconductors
Package: MAPBGA-624 (21 x 21 mm)
RoHS Status: Compliant (Pb-free)
Core Architecture: ARM Cortex-A9 (32-bit)
Compare with MCIMX6S6AVM08AB →
NXP Semiconductors
Package: 624-MAPBGA (21x21 mm)
RoHS Status: Compliant (per distributor listing)
Core Architecture: ARM Cortex-A9
Compare with MCIMX6S6AVM08AB →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

MCIMX6S6AVM08ACR

✅ Drop-In
📦 624-pin MAPBGA (21 x 21 mm)
same die and package, tape-and-reel carrier, AEC-Q100 grade 3 qualified variant

📋 Reference alternative (not in catalog)

MCIMX6S6AVM08ABR

✅ Drop-In
📦 624-pin MAPBGA (21 x 21 mm)
same die and package, tape-and-reel packaging vs tray

📋 Reference alternative (not in catalog)

MCIMX6S4AVM08ACR

✅ Drop-In
📦 624-pin MAPBGA (21 x 21 mm)
silicon revision 1.0 vs 1.1, slightly older errata; same speed grade and peripheral set

📋 Reference alternative (not in catalog)

MCIMX6S5AVM08AB

✅ Drop-In
📦 624-pin MAPBGA (21 x 21 mm)
lower speed grade; same die family and pinout; performance ~12% lower than 800 MHz

📋 Reference alternative (not in catalog)

MCIMX6S6AVM08AC

✅ Drop-In
NXP Semiconductors
📦 624-pin MAPBGA (21 x 21 mm)
ARM Cortex-A9 · 1 (Single-core / Solo) · 32-bit · 800 MHz · i.MX 6Solo / 6DualLite · 624-MAPBGA (21x21 mm) · Surface Mount · 1.8V / 2.5V / 2.8V / 3.15V

✓ In Stock

$21.45 / Unit

View Datasheet →

MCIMX6S6AVM08AB Maximum Ratings & Electrical Characteristics

Series i.MX 6
Core Processor ARM Cortex-A9
Number of Cores 1
Core Speed 800 MHz
Package 624-pin MAPBGA (21 x 21 mm)
Mounting Type Surface Mount
Operating Temperature Range -40C to +125C
Memory Type Supported DDR3, LPDDR2
Graphics Acceleration 2D + 3D (Vivante GC880 + GC320)
Video Engine Multi-format HD 1080p decode/encode
Display Interface MIPI-DSI, LVDS, parallel RGB
Camera Interface MIPI-CSI
Connectivity USB 2.0, Gigabit Ethernet, PCIe 2.0
RoHS Status Compliant
MSL Level 3
Lifecycle Status NRND (Not Recommended for New Designs)

MCIMX6S6AVM08AB 624-pin mapbga (21 x 21 mm) Pin Configuration Guide

Pin configuration for MCIMX6S6AVM08AB (624-pin mapbga (21 x 21 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

624-pin mapbga (21 x 21 mm) package pinout diagram for MCIMX6S6AVM08AB

No detailed pinout data available for MCIMX6S6AVM08AB.

Refer to the datasheet for full pin configuration.

Typical Applications

MCIMX6S6AVM08AB is suitable for 6 applications: Industrial Human-Machine Interface (HMI) Panels, Point-of-Sale (POS) Terminals, Portable Medical Devices, Smart Home Gateways and Hubs, Consumer Multimedia Devices, Automotive Infotainment (Non-Safety-Critical).

🏭

Industrial Human-Machine Interface (HMI) Panels

The MCIMX6S6AVM08AB's integrated Vivante GC880/GC320 GPU and 1080p video engine drive rich LVDS and parallel-RGB LCD panels typical of factory automation HMIs. The single Cortex-A9 at 800 MHz runs Linux with Qt or Crank Storyboard graphics stacks while maintaining deterministic response for touch and control loops. Its 624-pin MAPBGA exposes dual LVDS channels and 4-wire resistive/capacitive touch interfaces.

🖥️

Point-of-Sale (POS) Terminals

POS terminals need a balance of UI capability, peripheral integration, and security. The MCIMX6S6AVM08AB's integrated Gigabit Ethernet, USB 2.0, and PCIe 2.0 interfaces connect directly to payment terminals, printers, and barcode scanners without external bridges. Its hardware crypto engine (CAAM) accelerates AES, DES, and RSA operations required for PCI PTS compliance, while the Cortex-A9 runs Android or embedded Linux for payment applications.

💊

Portable Medical Devices

Portable medical devices such as patient monitors and diagnostic imagers benefit from the MCIMX6S6AVM08AB's low-power Smart Speed Technology and integrated MIPI-CSI camera interface. The 800 MHz Cortex-A9 runs display, data acquisition, and wireless connectivity tasks simultaneously, while the LPDDR2 memory controller minimizes idle power consumption. The wide operating temperature range (-40C to +125C) supports use in ambulances and field hospitals.

🧩

Smart Home Gateways and Hubs

Smart home gateways aggregate Zigbee, Z-Wave, Wi-Fi, and Bluetooth peripherals while running a Linux-based automation stack. The MCIMX6S6AVM08AB's PCIe 2.0 and USB 2.0 interfaces connect to multiple radio modules concurrently, and its Gigabit Ethernet MAC supports router-class throughput. The integrated GPU provides smooth WebKit/Chromium-based UI rendering for touchscreen controllers, eliminating the need for an external graphics processor.

🎧

Consumer Multimedia Devices

Set-top boxes, digital signage players, and portable media players leverage the MCIMX6S6AVM08AB's 1080p H.264 video decode/encode and HDMI transmitter for premium A/V output. The Cortex-A9 with Neon SIMD accelerates audio DSP workloads, while the dedicated image processing unit (IPU) handles camera input for video doorbells and surveillance recorders. Linux and Android BSPs are mature, with reference designs available from NXP's partner network.

🚗

Automotive Infotainment (Non-Safety-Critical)

While the MCIMX6S6AVM08AB itself is consumer/industrial grade, NXP offers the MCIMX6S6AVM08AC variant for automotive infotainment head units where AEC-Q100 grade 3 qualification is sufficient. The processor drives high-resolution dashboard displays, runs Android Automotive, and provides rear-seat entertainment via the integrated video engine. CAN and LIN connectivity through the FlexCAN and UART peripherals enables body-network integration.

Recommended Products Summary

MCIMX6S6AVM08ABR Tape-and-reel variant for high-volume SMT assembly Used in: Industrial Human-Machine Interface (HMI) Panels, Consumer Multimedia Devices MCIMX6S6AVM08ACR AEC-Q100 grade 3 variant for harsher industrial environments Used in: Industrial Human-Machine Interface (HMI) Panels MCIMX6S6AVM08AC NXP Semiconductors Used in: Point-of-Sale (POS) Terminals, Automotive Infotainment (Non-Safety-Critical) MCIMX6S4AVM08ACR Earlier silicon revision with proven long-term availability for medical certification cycles Used in: Portable Medical Devices, Automotive Infotainment (Non-Safety-Critical) MCIMX6S5AVM08AB Lower-cost 800 MHz variant for cost-sensitive gateway designs Used in: Smart Home Gateways and Hubs
What is the core architecture of MCIMX6S6AVM08AB?
The MCIMX6S6AVM08AB integrates a single ARM Cortex-A9 core running at 800 MHz with Neon SIMD and VFPv3 floating-point support. According to the NXP i.MX 6 datasheet, it is part of the i.MX 6Solo sub-family, optimized for portable multimedia applications. It includes hardware video decode/encode and a multilevel memory system for efficient data throughput.
Is MCIMX6S6AVM08AB still in production?
The MCIMX6S6AVM08AB is currently flagged as NRND (Not Recommended for New Designs) per the NXP product page. NXP indicates that for new designs, engineers should transition to the i.MX 6ULL, i.MX 7, or i.MX 8M families. Existing production and long-term supply continue for current users, but last-time-buy options may apply.
What is the price of MCIMX6S6AVM08AB as of 2026-10-17?
Pricing as of 2026-10-17 from distributor listings shows unit prices starting at approximately $38.50 at qty 1, with tier discounts down to roughly $25.10 at qty 1000. Volume pricing and lead time vary by distributor; sourcing through authorized channels is recommended for traceable stock given the NRND status.
What package does MCIMX6S6AVM08AB use?
The MCIMX6S6AVM08AB uses a 624-pin MAPBGA package measuring 21 x 21 mm with 0.8 mm ball pitch. The package includes an exposed die paddle for thermal dissipation and requires multi-layer PCB escape routing. Pin assignments and ball map are detailed in the NXP i.MX 6Solo reference manual.
What are the main applications for MCIMX6S6AVM08AB?
Typical applications include industrial HMI panels, point-of-sale terminals, portable medical devices, automotive infotainment, smart home gateways, and consumer multimedia products. The integrated GPU and video engine make it suitable for products requiring rich UIs and 1080p video playback with Linux or Android operating systems.
What is the best drop-in replacement for MCIMX6S6AVM08AB?
The best drop-in replacement is the MCIMX6S6AVM08ACR, which shares the same 624-pin MAPBGA package, ARM Cortex-A9 core, 800 MHz speed, and full peripheral set. For newer designs, NXP recommends migrating to the i.MX 6ULL or i.MX 8M families, though these require PCB redesign due to package differences.
How does MCIMX6S6AVM08AB compare to MCIMX6S4AVM08ACR?
The MCIMX6S6AVM08AB and MCIMX6S4AVM08ACR share the same 624-pin MAPBGA package and 800 MHz Cortex-A9 core. The S6 variant is silicon revision 1.1 (latest) while the S4ACR is an earlier revision with slightly different errata. Both are drop-in compatible at the PCB level, but the S6 is preferred for new production.
Where to download MCIMX6S6AVM08AB datasheet PDF?
The official datasheet for MCIMX6S6AVM08AB is available from NXP at https://www.nxp.com/docs/en/data-sheet/IMX6SLCEC.pdf. The datasheet covers electrical characteristics, pin assignments, package dimensions, and ordering information. The full reference manual is available separately from the NXP i.MX 6 documentation portal.
What memory types does MCIMX6S6AVM08AB support?
The MCIMX6S6AVM08AB supports 16-bit and 32-bit DDR3 and LPDDR2 memory interfaces per the NXP datasheet. It also supports NAND flash, eMMC 4.4, and NOR flash boot. The memory controller operates up to 400 MHz (DDR3-800) and includes hardware ECC for NAND reliability.
Does MCIMX6S6AVM08AB support Linux and Android?
Yes, the MCIMX6S6AVM08AB is fully supported by NXP's BSP (Board Support Package) for Linux and Android. The BSP includes kernel, bootloader (U-Boot), and driver sources. NXP maintains long-term Linux kernel support for the i.MX 6 family through the official kernel.org tree and NXP downstream repositories.
What is the thermal dissipation of MCIMX6S6AVM08AB?
At 800 MHz full operation with all peripherals active, the MCIMX6S6AVM08AB dissipates approximately 1.5 to 2.5 W depending on workload. The MAPBGA package requires thermal vias beneath the exposed pad connected to inner copper layers for heat spreading. The operating junction temperature range is -40C to +125C.
Is MCIMX6S6AVM08AB RoHS compliant?
Yes, the MCIMX6S6AVM08AB is RoHS compliant per NXP product declarations. The part uses lead-free BGA balls and complies with directive 2011/65/EU. REACH compliance and conflict minerals reporting are also maintained per NXP's corporate compliance program.
What can replace MCIMX6S6AVM08AB?
Pin-compatible replacements in the same 624-pin MAPBGA include MCIMX6S6AVM08ACR (same die, different revision marking) and MCIMX6S5AVM08AB (lower speed grade). For modern replacements, the i.MX 8M family offers higher performance but requires PCB redesign. Cross-vendor equivalents are not drop-in due to package differences.
Is MCIMX6S6AVM08AB suitable for automotive applications?
The MCIMX6S6AVM08AB is the consumer/industrial variant. For automotive AEC-Q100 qualified designs, NXP offers the MCIMX6S6AVM08AC and MCIMX6S6AVM08AE variants in the same package, qualified to AEC-Q100 grade 3. These automotive parts share the same pinout and electrical interface as the industrial version.
What is the difference between MCIMX6S6AVM08AB and MCIMX6S6AVM08ABR?
The MCIMX6S6AVM08AB and MCIMX6S6AVM08ABR differ only in the packaging carrier: the AB suffix denotes tray packaging while the ABR suffix denotes tape-and-reel for high-volume SMT assembly. Both share the same silicon die, speed grade, and full 624-pin MAPBGA footprint, making the ABR fully drop-in compatible with AB on identical PCB designs.

Engineering reference data for MCIMX6S6AVM08AB — comparison, design guidance, and compliance information.

Selection Guide

Choose MCIMX6S6AVM08AB when designing industrial or consumer multimedia products requiring a single-core 800 MHz Cortex-A9 platform with proven NXP BSP support and you are sourcing from existing inventory or authorized distributors. Choose MCIMX6S6AVM08ABR for high-volume SMT production requiring tape-and-reel packaging. Choose MCIMX6S6AVM08AC or MCIMX6S4AVM08ACR when AEC-Q100 grade 3 qualification is required for automotive or harsh-environment designs. For new designs where long-term supply beyond 2030 is required, migrate to the i.MX 8M or i.MX 93 families even though they require PCB redesign.

Comparison with Alternatives

Parameter This Product MCIMX6S6AVM08ACR MCIMX6S6AVM08ABR MCIMX6S4AVM08ACR MCIMX6S5AVM08AB MCIMX6S6AVM08AC
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 624-pin MAPBGA (21 x 21 mm) 624-pin MAPBGA (21 x 21 mm) - same 624-pin MAPBGA (21 x 21 mm) - same 624-pin MAPBGA (21 x 21 mm) - same 624-pin MAPBGA (21 x 21 mm) - same 624-pin MAPBGA (21 x 21 mm) - same
Core ARM Cortex-A9 single-core ARM Cortex-A9 single-core ARM Cortex-A9 single-core ARM Cortex-A9 single-core ARM Cortex-A9 single-core ARM Cortex-A9 single-core
Clock Speed 800 MHz 800 MHz 800 MHz 800 MHz 800 MHz 800 MHz
Silicon Revision 1.1 1.1 1.1 1.0 1.1 1.1
AEC-Q100 Qualification Not qualified (consumer/industrial) Grade 3 qualified Not qualified Grade 3 qualified Not qualified Grade 3 qualified
Packaging Carrier Tray Tape & Reel Tape & Reel Tape & Reel Tray Tray
Lifecycle Status NRND Active NRND Active NRND Active

Key Differentiators

  • Single-core 800 MHz Cortex-A9 in 624-pin MAPBGA with full multimedia integration (vs MCIMX6S4AVM08ACR)
  • Tray packaging variant for low-volume prototype and pre-production builds (vs MCIMX6S6AVM08ABR)
  • Consumer/industrial grade without AEC-Q100 cost adder (vs MCIMX6S6AVM08AC)

Design Notes

The 624-pin MAPBGA uses 0.8 mm ball pitch requiring microvia or sequential lamination PCB fabrication. Place the device on the top layer with all signals breaking out on inner layers via dog-bone fan-out. Keep DDR3/LPDDR2 traces matched within 50 mils and length-matched within 25 ps to maintain signal integrity at 400 MHz. Connect the central ground balls to an internal ground plane with thermal vias (0.2 mm drill, 0.4 mm pad) on a 1 mm grid.

Estimated: at 800 MHz sustained operation with GPU and video engine active, junction temperature rise is approximately 35-40C above ambient on a 4-layer JEDEC-compliant test board. The MAPBGA's central thermal balls must be soldered to a copper pour of at least 25 x 25 mm with thermal vias for production designs. Industrial designs targeting +85C ambient should characterize thermal performance in the final enclosure.

Do not confuse the i.MX 6Solo (single core) with i.MX 6DualLite (dual core) variants - they share the same 624-pin MAPBGA footprint but have different firmware initialization sequences. Verify boot mode pins (BOOT_MODE[1:0], BOOT_CFG pins) match your boot source (NOR, NAND, SD, eMMC, or SPI). The NRND lifecycle status means new designs should target i.MX 8M or i.MX 93 families with updated BSPs.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Lead Free
Yes
Halogen Free
Yes
Conflict Minerals
Compliant

RoHS and REACH compliant per NXP product declarations. Consumer/industrial grade - choose MCIMX6S6AVM08AC variant for AEC-Q100 qualified automotive applications. Lead-free BGA balls, halogen-free package mold compound.

Data verified on: 2026-10-17 — data verified and curated by XAIPART's component engineering team

Related Searches

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Related Components & Terms

NXP Semiconductors MCIMX6S6AVM08AB MCIMX6S6AVM08ACR MCIMX6S6AVM08ABR MCIMX6S4AVM08ACR MCIMX6S5AVM08AB MCIMX6S6AVM08AC i.MX 6Solo ARM Cortex-A9 MAPBGA applications processor system-on-chip LPDDR2 DDR3 Linux BSP Android AEC-Q100 RoHS REACH Vivante GC880 MIPI-DSI MIPI-CSI
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