MCIMX6X4EVM10AB - i.MX 6SoloX A9+M4 MPU, 1GHz/227MHz, MAPBGA-529
Teilenummer: MCIMX6X4EVM10AB ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $46.6 | $46,60 |
| 10 | $42.5 | $425,00 |
| 100 | $38.2 | $3.820,00 |
| 500 | $33.95 | $16.975,00 |
| 1.000 | $29.4 | $29.400,00 |
MCIMX6X4EVM10AB Übersicht
A microprocessor (MPU) is a single-chip computer integrating CPU cores, memory controllers, peripherals, and I/O on one die. The i.MX 6SoloX sits within the ARM Cortex application-processor taxonomy (Cortex-A = application, Cortex-M = microcontroller) and the broader embedded processor hierarchy: MPU -> SoC -> semiconductor. Its heterogeneous A9+M4 architecture allows real-time control tasks on Cortex-M4 while Linux/Android runs on Cortex-A9, a common pattern in industrial HMI and IoT gateways.
Key features include dual-core heterogeneous processing (A9 up to 1 GHz, M4 up to 227 MHz), hardware-accelerated graphics (GC400T-like 2D/3D via the GPU block), dual Gigabit Ethernet with IEEE 1588 support, two USB 2.0 ports (one with PHY), PCIe 2.0, multiple display interfaces (LCD, LVDS), ECC on DDR3/LPDDR2 memory interface, and hardware cryptographic accelerators (AES, SHA, RNG). Industrial-grade temperature range and AEC-Q100 awareness make it suitable for harsh-environment products.
The 6SoloX architecture pairs a high-throughput A9 application core with a deterministic M4 real-time core, communicating through shared OCRAM and message-unit interrupts. This AMP design lets OEM code time-critical motor or sensor loops on Cortex-M4 while running a rich OS on Cortex-A9 without RTOS jitter. ECC-protected external memory and hardware crypto offload improve reliability for industrial and edge-compute designs.
Typical applications include industrial HMI panels, building automation controllers, smart energy gateways, automotive infotainment companions, IoT edge nodes, and point-of-sale terminals. The dual-Ethernet + dual-USB + PCIe combination also targets connected industrial routers and ruggedized tablets. Automotive and consumer-grade siblings share the silicon but differ in qualification and feature mix.
When designing with this MPU, allocate proper PCB layer stack for the 529-ball MAPBGA with 0.8 mm pitch and follow NXP's Hardware Design Guide for DDR3/LPDDR2 routing. Power sequencing of the multiple supply rails must follow the datasheet power-up sequence to avoid latch-up, and unused interfaces should be tied per the reference schematic.
Drop-in-Alternativen für MCIMX6X4EVM10AB – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MCIMX6X4EVM10AB (gleiche Bauform und Footprint) – abweichend in Connectivity, Package, Series, GPU, Memory Interface.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MCIMX6X4EVM10AC
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MCIMX6X4CVM08AC
✅ Drop-In✓ Auf Lager
$41.5 / Stück
Datenblatt ansehen →MCIMX6X4CVM10AC
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MCIMX6Q4AVT10AD
✅ Drop-In✓ Auf Lager
$48.74 / Stück
Datenblatt ansehen →MCIMX6X4EVM10AB Grenzwerte & elektrische Eigenschaften
| Series | i.MX 6SoloX |
| Core Architecture | ARM Cortex-A9 + ARM Cortex-M4 |
| A9 Core Count | 1 |
| M4 Core Count | 1 |
| A9 Max Frequency | 1 GHz (per DigiKey listing); 800 MHz referenced in some distributor descriptions |
| M4 Max Frequency | 227 MHz (per DigiKey listing); 166 MHz referenced in some distributor descriptions |
| Bit Width | 32-bit |
| Gehäuse | 529-MAPBGA, 19x19 mm, 0.8 mm pitch |
| Package Code | MAPBGA-529 |
| Montageart | Surface Mount |
| Betriebstemperatur | -40C to +105C (industrial grade, EVM suffix) |
| L1 Cache (A9) | 32 KB I-cache + 32 KB D-cache per core |
| External Memory Interface | DDR3 / DDR3L / LPDDR2 with ECC support |
| Display Interfaces | LCD controller, LVDS (single-link) |
| Connectivity | 2x Gigabit Ethernet with IEEE 1588, 2x USB 2.0 (one with PHY), PCIe 2.0, UART, SPI, I2C, I2S, CAN |
| Hardware Crypto | AES, SHA-1/256, RNG (per i.MX 6SoloX datasheet) |
| Graphics | 2D/3D GPU (GC400T-class) |
| RoHS-Status | Compliant |
| MSL-Level | 3 (per JEDEC J-STD-020 for MAPBGA) |
MCIMX6X4EVM10AB mapbga-529 Pinbelegungsleitfaden
Pinbelegung für MCIMX6X4EVM10AB (mapbga-529-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MCIMX6X4EVM10AB.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MCIMX6X4EVM10AB ist geeignet für 6 Anwendungs: Industrial HMI Panels, Building Automation Controllers, Smart Energy Gateways, Automotive Infotainment Companion, IoT Edge Gateways and Routers, Point-of-Sale Terminals.
Industrial HMI Panels
The NXP MCIMX6X4EVM10AB fits industrial HMI panels because its 1 GHz Cortex-A9 + 227 MHz Cortex-M4 heterogeneous cores let Linux/Qt run the graphical user interface on A9 while the M4 handles deterministic touch-controller polling, backlight PWM, and safety-monitor loops without OS jitter. The integrated LVDS/LCD controller and 2D/3D GPU drive 7-15 inch panels with smooth 60 fps graphics. Dual Gigabit Ethernet with IEEE 1588 hardware timestamping enables PROFINET/EtherCAT slave connectivity on the factory floor. Industrial temperature grade (-40C to +105C) and ECC-protected DDR3L memory interface suit 24/7 factory use where single-bit memory upsets would otherwise corrupt log data.
Empfohlen
Building Automation Controllers
Building automation gateways benefit from the MCIMX6X4EVM10AB's combination of Linux on Cortex-A9 (for BACnet/Modbus/OPC UA stacks and HTML5 dashboards) and real-time control on Cortex-M4 (for HVAC damper loops, lighting DALI bus, and access-control timing). The dual Gigabit Ethernet supports segregated IT/OT networks, while the hardware crypto accelerators (AES/SHA/RNG) secure TLS 1.3 links to cloud BMS platforms. Industrial temperature grade and ECC memory protect against the elevated ambient temperatures and soft-error rates typical in mechanical rooms. PCIe 2.0 lets designers add Wi-Fi 6 or LTE modems for wireless site connectivity without external bridges.
Empfohlen
Smart Energy Gateways
Smart energy gateways require the deterministic metering MCIMX6X4EVM10AB offers: the Cortex-M4 can sample CT/PT sensors and run IEC 62056-21 / DLMS/COSEM protocols at fixed 1 kHz rates, while the Cortex-A9 manages HTTPS push to utility head-ends and local LCD display rendering. Hardware AES-256 and SHA-256 offload secures signed meter-readings per IEC 62351, and the ECC-capable DDR3L interface protects against soft errors in high-EMI switchgear cabinets. Dual isolated Ethernet plus CAN-FD enables HAN/LAN bridging plus EV-charging coordination in a single gateway.
Empfohlen
Automotive Infotainment Companion
The MCIMX6X4EVM10AB serves as a companion processor to a primary head-unit SoC, offloading CAN/LIN gateway, HVAC control, and instrument-cluster rendering via its Cortex-M4 real-time core while the Cortex-A9 runs a lightweight Android Auto projection or rear-seat display UI. Hardware crypto accelerators secure V2X message signing, and the dual USB 2.0 with PHY supports direct iPhone CarPlay or Android Auto hand-off. AEC-Q100 awareness and industrial temperature grade suit cabin and behind-dash mounting where ambient temperature can exceed 85C. Note: for full automotive infotainment, NXP i.MX 8 or i.MX 6 automotive-grade SKUs are recommended.
Empfohlen
IoT Edge Gateways and Routers
IoT edge gateways leverage the MCIMX6X4EVM10AB's mix of Linux-grade Cortex-A9 throughput for MQTT/CoAP/HTTPS protocol translation and Cortex-M4 determinism for time-sensitive sensor-fusion pre-processing before cloud upload. Dual Gigabit Ethernet with hardware timestamping (IEEE 1588) supports TSN for industrial-edge deployments, while PCIe 2.0 enables AI/ML accelerator cards (e.g., edge inference modules) at the gateway. Hardware AES/SHA/RNG engines accelerate TLS 1.3 handshakes required for zero-trust edge architectures, and the 529-MAPBGA package's industrial temperature rating allows sealed IP65 enclosure operation.
Empfohlen
Point-of-Sale Terminals
POS terminals benefit from the MCIMX6X4EVM10AB's heterogeneous cores: Cortex-A9 runs the Android/Linux POS application stack (UI, payment SDK, inventory DB) while Cortex-M4 handles PCI-PTS compliant PIN-pad encryption, secure display/keypad debouncing, and tamper-detection loops with bounded latency. Hardware AES and SHA accelerate EMV chip-card cryptography without loading the application CPU. Dual USB 2.0 ports support PIN pad + receipt printer, and the LCD controller drives the main cashier-facing display while LVDS feeds the customer-facing display. Industrial temperature grade tolerates kitchen and outdoor kiosk thermal environments.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MCIMX6X4EVM10AB – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MCIMX6X4EVM10AC | MCIMX6X4CVM08AC | MCIMX6X4CVM10AC | MCIMX6Q4AVT10AD |
|---|---|---|---|---|---|
| Package | 529-MAPBGA (19x19 mm) | 529-MAPBGA (19x19 mm) - same | 529-MAPBGA (19x19 mm) - same | 529-MAPBGA (19x19 mm) - same | 624-FCPBGA (21x21 mm) - different |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Family | i.MX 6SoloX (A9+M4) | i.MX 6SoloX | i.MX 6SoloX | i.MX 6SoloX | i.MX 6Quad (4x A9) |
| Core Architecture | 1x Cortex-A9 + 1x Cortex-M4 | 1x A9 + 1x M4 | 1x A9 + 1x M4 | 1x A9 + 1x M4 | 4x Cortex-A9 |
| A9 Max Frequency | 1 GHz | 1 GHz | 800 MHz | 1 GHz | 1 GHz |
| M4 Max Frequency | 227 MHz | 227 MHz | 166 MHz | 227 MHz | N/A (no M4) |
| Temperature Grade | Industrial -40C to +105C | Industrial -40C to +105C | Commercial 0C to +70C | Commercial 0C to +70C | Automotive AEC-Q100 |
| Hardware Crypto | AES, SHA, RNG | AES, SHA, RNG | AES, SHA, RNG | AES, SHA, RNG | AES, SHA, RNG + enhanced crypto |
Wichtigste Unterscheidungsmerkmale
- Heterogeneous A9 + M4 cores in i.MX 6 family (vs. MCIMX6Q4AVT10AD (i.MX 6Quad))
- Lower cost than i.MX 6Quad with similar software stack (vs. MCIMX6Q4AVT10AD (i.MX 6Quad))
- Industrial temperature grade at A-class performance (vs. MCIMX6X4CVM08AC (commercial grade))
Designhinweise
Estimated: the 529-ball MAPBGA at 0.8 mm pitch requires a 4-layer (recommended 6-layer) PCB stack-up with laser-drilled microvias on the top layer and 0.4 mm via-in-pad for the BGA fan-out. Follow NXP's i.MX 6SoloX Hardware Design Guide for trace length matching on the DDR3/LPDDR2 interface (data byte lanes within +/-25 mil, CLK to DQS within +/-10 mil). Plan at least 4 signal layers plus 2 ground/power planes for clean reference return paths on the high-speed SerDes lines.
Power up the MCIMX6X4EVM10AB rails in the exact sequence specified in the NXP datasheet (typically VDD_SOC_IN -> VDD_ARM_IN -> VDD_HIGH_IN -> VDD_PU -> peripheral rails). Use the NXP-recommended PMIC such as PF3000/3003 or ROHM BD71815 to avoid latch-up. Failure to sequence correctly can cause permanent device damage or inrush currents that trigger brown-out on the upstream 5V rail.
Estimated: the i.MX 6SoloX at full 1 GHz Cortex-A9 + 227 MHz Cortex-M4 dual-core load can dissipate 3-4 W, which is within the 529-MAPBGA's thermal envelope using only PCB copper. For sealed industrial enclosures without forced airflow, design a 4-layer PCB with at least 4 thermal vias under the BGA thermal balls and 10 sq cm of top-layer copper. Avoid placing the MPU directly above heat-generating PMICs or DDR.
Do not assume all 529-MAPBGA i.MX 6 devices share identical ball maps: i.MX 6Solo, 6DualLite, 6Dual, 6Quad, and 6SoloX have different silicon despite sharing the same package footprint family. Verify the exact pinmap against your specific MPN's datasheet before PCB layout. Also note the boot configuration pins (BOOT_MODE, BOOT_CFG) must be set per the chosen boot source (SD/eMMC/NAND/QSPI) before first power-up.
Compliance-Informationen
RoHS and REACH compliance per NXP product environmental compliance disclosures. The 'EV' suffix denotes industrial temperature grade but does not imply AEC-Q100 automotive qualification - for automotive infotainment use AEC-Q100-qualified i.MX 6 automotive SKUs instead.
