MCIMX6X4CVM08AC - i.MX6SX A9+M4 SoC 800MHz 529-MAPBGA | NXP
Teilenummer: MCIMX6X4CVM08AC ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $58.79 | $58,79 |
| 10 | $54.5 | $545,00 |
| 100 | $49.2 | $4.920,00 |
| 500 | $44.8 | $22.400,00 |
| 1.000 | $41.5 | $41.500,00 |
MCIMX6X4CVM08AC Übersicht
An SoC (System-on-Chip) integrates CPU cores, GPU, memory controller, and I/O peripherals onto a single die, enabling compact embedded designs. Heterogeneous multicore SoCs pair a high-performance application core (Cortex-A9, capable of running Linux) with a low-power real-time core (Cortex-M4, capable of bare-metal/RTOS control) on the same silicon, eliminating the need for a discrete MCU companion. Within NXP's taxonomy this part sits under i.MX 6 family -> i.MX 6SoloX sub-family -> industrial applications processor category.
Key features include up to 800 MHz Cortex-A9 with Neon SIMD, up to 200 MHz Cortex-M4 with FPU, integrated 2D/3D GPU (Vivante GC400T), 24-bit parallel LCD interface, dual CAN, dual USB, dual Ethernet, and an industrial-grade operating temperature range. The SoC also includes hardware cryptographic acceleration, multiple ADC channels, and a flexible boot architecture supporting eMMC, SD, NAND, and SPI flash.
The heterogeneous architecture allows Linux to run on the Cortex-A9 while the Cortex-M4 executes deterministic real-time control loops, sensor I/O, or low-latency motor control. Shared OCRAM (on-chip SRAM) provides fast inter-core data exchange via a hardware semaphore mechanism. This architecture is well-suited to industrial automation, where deterministic response times must coexist with rich HMI/connectivity stacks.
Typical applications include industrial HMI panels, factory automation controllers, smart energy gateways, building automation, machine vision edge nodes, and ruggedized IoT gateways. The industrial temperature rating and long-lifecycle NXP program make this part appropriate for designs requiring 10+ year availability.
When designing with this part, pay attention to PCB layout: the 529-ball MAPBGA requires microvia stack-up and controlled-impedance routing for DDR3/LPDDR2 traces. Power-rail sequencing between A9 and M4 cores must follow NXP reference manual guidelines to avoid latch-up during cold-start. The 'AC' suffix in the part number denotes the 800 MHz / 200 MHz speed grade with industrial-grade temperature range (-40C to +105C Tj).
This page synthesizes distributor pricing, datasheet pinout, and same-package alternatives not bundled in the official datasheet, enabling faster PCB bring-up and sourcing decisions.
Drop-in-Alternativen für MCIMX6X4CVM08AC – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MCIMX6X4CVM08AC (gleiche Bauform und Footprint) – abweichend in Package, Core Architecture, Mounting Type, Series, Connectivity.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MCIMX6X4CVM08AB
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MCIMX6X4AVM08AC
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MCIMX6X4AVM08AB
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MCIMX6X4EVM08AC
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MCIMX6X2CVM08AC
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MCIMX6X4CVM08AC Grenzwerte & elektrische Eigenschaften
| Manufacturer | NXP Semiconductors |
| Series | i.MX 6SoloX |
| Core Architecture | ARM Cortex-A9 + ARM Cortex-M4 |
| Number of Cores | 2 (heterogeneous: 1x A9 + 1x M4) |
| Datenbusbreite | 32-bit |
| A9 Core Speed | up to 800 MHz |
| M4 Core Speed | up to 200 MHz |
| GPU | Vivante GC400T (2D/3D/OpenGL ES 2.0/OpenVG 1.1) |
| Gehäuse | 529-MAPBGA (19x19 mm, 0.8 mm pitch) |
| Montageart | Surface Mount (BGA) |
| Operating Temperature (Industrial) | -40C to +105C (Tj) |
| Versorgungsspannung | 0.95 V to 3.6 V (multiple rails) |
| Display Interface | Parallel 24-bit LCD, MIPI-DSI |
| Connectivity | 2x USB 2.0, 2x CAN, 2x Ethernet (10/100/1000), PCIe 2.0, UART, SPI, I2C, I2S |
| Memory Interface | 16/32-bit DDR3, LPDDR2, NAND, eMMC, SD |
| Security | Hardware crypto (AES, SHA, RNG), Secure Boot, HAB |
| RoHS-Status | Compliant |
| Speed Grade Suffix | AC = 800 MHz A9 / 200 MHz M4 |
MCIMX6X4CVM08AC 529-mapbga (19x19 mm, 0.8 mm pitch) Pinbelegungsleitfaden
Pinbelegung für MCIMX6X4CVM08AC (529-mapbga (19x19 mm, 0.8 mm pitch)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MCIMX6X4CVM08AC.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MCIMX6X4CVM08AC ist geeignet für 6 Anwendungs: Industrial HMI Panel, Factory Automation Controller, Smart Energy Gateway, Building Automation Controller, Machine Vision Edge Node, Ruggedized IoT Gateway.
Industrial HMI Panel
The MCIMX6X4CVM08AC drives industrial HMI panels with its 800 MHz Cortex-A9 running Linux/Qt for rich UIs combined with the 200 MHz Cortex-M4 handling real-time touch and key scanning. The integrated Vivante GC400T GPU accelerates 2D/3D graphics while the 24-bit parallel LCD interface and MIPI-DSI output support displays up to WXGA resolution. The -40C to +105C industrial temperature range tolerates cabinet thermal rise, and hardware crypto acceleration enables secure OTA updates. Power dissipation at 800 MHz A9 + 200 MHz M4 active load is approximately 2-3 W, requiring a thermal copper pour but no active heatsink. Compared with a single-core Cortex-A8 design, the heterogeneous M4 offload eliminates UI jitter from real-time touch processing.
Empfohlen
Factory Automation Controller
The MCIMX6X4CVM08AC is suited for factory automation controllers running Linux on the A9 core for SCADA/HMI integration while the M4 core handles deterministic PLC-style I/O scanning. Dual CAN-FD interfaces enable fieldbus connectivity (CANopen, DeviceNet) and the dual Ethernet MAC supports EtherCAT/Ethernet/IP slave stacks. Hardware crypto and Secure Boot protect against unauthorized firmware tampering in OT environments. Operating junction temperature up to +105C tolerates enclosed cabinet deployment. Compared with discrete A9 + external MCU designs, the integrated M4 reduces BOM by approximately $3-5 and eliminates inter-chip SPI latencies for control loop synchronization.
Empfohlen
Smart Energy Gateway
For smart energy gateways, the MCIMX6X4CVM08AC's A9 runs Linux with TCP/IP stacks for HAN/WAN uplink while the M4 handles metering peripherals with deterministic timing. The 32-bit DDR3/LPDDR2 interface supports up to 2 GB for protocol stacks (DLMS/COSEM, IEC 61850). Hardware AES/SHA acceleration secures TLS/DTLS sessions for grid communication. Power consumption scales between 0.5 W (M4-only metering mode) and 2.5 W (full A9+M4 Linux mode), suiting both battery-backed and line-powered meters. The industrial temperature grade supports outdoor cabinet deployment. Compared with separate MCU + application processor designs, the SoC integration cuts PCB area by 40-50%.
Empfohlen
Building Automation Controller
The MCIMX6X4CVM08AC fits BACnet/Modbus building controllers where the A9 runs BACnet/IP stack and HTML5 dashboard while the M4 reads sensors and drives HVAC actuators with millisecond latency. Dual Ethernet MAC supports daisy-chained BACnet/IP topology. PCIe 2.0 interface enables expansion with Wi-Fi 6 or LoRa modules for wireless sensor integration. The 529-MAPBGA package is footprint-compatible across the i.MX 6SoloX family, allowing board revisions to upgrade to faster speed grades without redesign. Compared with Cortex-A8 single-core gateways, the M4 offload cuts HVAC control-loop jitter from >500 us to <50 us.
Empfohlen
Machine Vision Edge Node
The MCIMX6X4CVM08AC can serve as a machine vision edge node preprocessing camera frames via MIPI-CSI input, with the A9 running OpenCV or TensorFlow Lite while the M4 handles time-critical trigger I/O for industrial vision synchronization. The 800 MHz A9 delivers approximately 1-2 GFLOPS, sufficient for QC defect-detection inference on 640x480 frames at 5-10 fps. MIPI-DSI and parallel LCD outputs drive local preview displays. Power dissipation of approximately 2 W at full load fits fanless edge enclosures. Compared with PC-class vision systems, the SoC reduces BOM by $50-100 per node at 1/10th the power draw.
Empfohlen
Ruggedized IoT Gateway
The MCIMX6X4CVM08AC powers ruggedized IoT gateways in outdoor or industrial environments. The A9 runs Linux with containerized workloads (Docker, K3s) while the M4 monitors system health, watchdog, and secure-element communication. Hardware Secure Boot and HAB (High Assurance Boot) prevent unauthorized firmware execution. Dual USB 2.0 ports support cellular modems; PCIe 2.0 supports Wi-Fi 6/Bluetooth modules. Industrial temperature range (-40C to +105C) tolerates outdoor enclosure thermal extremes. Compared with Raspberry Pi class gateways, the i.MX 6SoloX delivers 5-10x MTBF and NXP's 10-15 year product longevity commitment.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MCIMX6X4CVM08AC – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MCIMX6X4CVM08AB | MCIMX6X4AVM08AC | MCIMX6X4AVM08AB | MCIMX6X4EVM08AC | MCIMX6X2CVM08AC |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 529-MAPBGA (19x19) | 529-MAPBGA (19x19) - same | 529-MAPBGA (19x19) - same | 529-MAPBGA (19x19) - same | 529-MAPBGA (19x19) - same | 529-MAPBGA (19x19) - same |
| Cores | 1x A9 + 1x M4 | 1x A9 + 1x M4 | 1x A9 + 1x M4 | 1x A9 + 1x M4 | 1x A9 + 1x M4 | 1x A9 + 1x M4 |
| A9 Speed | 800 MHz | 800 MHz | 800 MHz | 800 MHz | 800 MHz | 800 MHz |
| M4 Speed | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Temperature Grade | Industrial -40C to +105C | Industrial -40C to +105C | Automotive AEC-Q100 | Automotive AEC-Q100 | Industrial -40C to +105C | Industrial -40C to +105C |
| Silicon Revision | AC (current) | AB (earlier) | AC automotive | AB automotive | AC enhanced security | AC reduced peripheral set |
| AEC-Q100 Qualified | No | No | Yes | Yes | No | No |
| Lifecycle Status | Active | Active (limited) | Active | Active (limited) | Active | Active |
Wichtigste Unterscheidungsmerkmale
- Industrial-grade speed grade with current silicon revision (vs. MCIMX6X4CVM08AB)
- Industrial temperature rating vs automotive qualification (vs. MCIMX6X4AVM08AC)
- Full peripheral set vs reduced set (vs. MCIMX6X2CVM08AC)
Designhinweise
The 529-ball MAPBGA with 0.8 mm pitch requires HDI PCB stack-up with microvias (typically 4-6 layer PCB). Per NXP design guide, route DDR3/LPDDR2 traces on inner layers with matched length within +/- 25 mil and 100 ohm +/- 10% differential impedance. Place decoupling capacitors (100 nF + 10 uF) within 5 mm of each power pin. The exposed die pad (if any) must be soldered to ground plane with thermal vias (9+ vias under the BGA) for heat dissipation. Without proper stack-up, signal integrity failures occur above 533 MHz DDR rate.
The i.MX 6SoloX requires multiple power rails sequenced per NXP reference manual: VDD_ARM (0.95-1.25 V), VDD_SOC (1.05-1.15 V), VDD_HIGH (1.65-2.1 V), VDD_SNVS (1.65-3.6 V). NXP recommends the PF3000 or PCA9450 PMIC companion part. Power sequencing must avoid latch-up: VDD_SNVS first, then VDD_HIGH, then VDD_SOC, then VDD_ARM. Use the NXP power sequencing tool to validate timing against datasheet tSEQ parameters. Estimated: at 800 MHz A9 + 200 MHz M4 active, total SoC power is approximately 2-3 W.
At full-load (800 MHz A9 + 200 MHz M4 + GPU), the MCIMX6X4CVM08AC dissipates approximately 2-3 W. The 529-MAPBGA has theta_JA around 15-20 C/W on a JEDEC 4-layer test board. Without a thermal copper pour, junction temperature could exceed 105C Tj at 70C ambient. Design rule: maintain at least 4 thermal vias (0.3 mm drill) under the BGA thermal pad, connected to inner ground plane. In enclosed industrial cabinets at 55C ambient, derate SoC clock by 20% to keep Tj below 100C margin.
Do NOT use the M4 core from boot without configuring its boot ROM image in eMMC/QSPI - the M4 firmware must be loaded by U-Boot before Linux boot completes. Failing to do this causes the M4 to enter a halted state with cryptic HAB (High Assurance Boot) errors. Another common pitfall: do NOT route the MIPI-CSI/DSI lanes across discontinuous reference planes - this destroys signal integrity. Always reference NXP Hardware Development Guide (IMX6SXHDG) for routing rules. Failing to initialize the CCM (Clock Controller Module) correctly is the most common cause of 'no boot' failures.
Route the Cortex-M4 JTAG (SWD) signals on inner layers to avoid crosstalk with the Cortex-A9 JTAG signals. Keep MIPI lanes length-matched within +/- 0.5 mm (0.02 inch) and at 100 ohm differential impedance. The USB 2.0 data lines require 90 ohm differential impedance. Place the 24 MHz system oscillator within 5 mm of the SoC with guard-ring ground pour. Keep high-speed signals (DDR, MIPI, USB) at least 3H (3x dielectric height) away from noisy switching rails.
Compliance-Informationen
RoHS and REACH compliant per NXP product page. Not AEC-Q100 qualified - choose MCIMX6X4AVM08AC for automotive. Halogen-free status not explicitly stated in retrieved data.
