MCZ33927EK - 3-Phase FET Pre-Driver, 40V, SPI, 54-SOIC-EP | NXP
Teilenummer: MCZ33927EK ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $9.85 | $9,85 |
| 10 | $8.95 | $89,50 |
| 100 | $7.92 | $792,00 |
| 500 | $6.99 | $3.495,00 |
| 1.000 | $6.45 | $6.450,00 |
MCZ33927EK Übersicht
A Field Effect Transistor pre-driver (also called a gate driver or FET pre-driver) is a specialized power-management integrated circuit that sits between a low-power microcontroller and the high-current MOSFETs or IGBTs of a power-conversion stage. By handling level shifting, charge-pump generation, dead-time insertion, and short-circuit protection, the pre-driver allows the system MCU to focus on control loops while the IC reliably switches kilowatts of power. In the broader taxonomy, the MCZ33927EK belongs to the motor-driver family, which itself sits under power-management ICs (PMIC), and ultimately under the discrete and integrated semiconductor hierarchy.
Key features include integrated charge pump for 100% duty-cycle high-side drive, programmable dead-time and blanking, comprehensive fault detection (overcurrent, overtemperature, undervoltage), and SPI-programmable diagnostics. Each of the three phases provides independent high-side and low-side gate-drive outputs capable of sinking and sourcing the 600 mA peak current required to switch large MOSFET gates quickly. The exposed pad dramatically reduces junction-to-ambient thermal resistance for high-frequency switching.
The MCZ33927EK utilizes NXP's SMARTMOS mixed-signal BiCMOS technology, combining precision analog circuitry, robust CMOS logic, and high-voltage DMOS output stages on a single die. This integration delivers automotive-grade ESD robustness and EMI tolerance in a compact package, making it well suited to harsh electrical environments typical of automotive 12V/24V systems.
Typical applications include automotive 12V three-phase brushless DC (BLDC) motors for HVAC blowers, fuel pumps, water pumps, and electric power steering (EPS) auxiliaries, as well as industrial three-phase PMSM drives, robotic servos, and drone propulsion systems. The wide 8V to 40V supply range tolerates load-dump transients on automotive rails.
When designing with the MCZ33927EK, ensure that external bootstrap capacitors on each high-side driver are sized for the worst-case PWM duty cycle and switching frequency. The exposed pad must be soldered to a sufficiently large copper pour (typically ≥1 square inch) to keep junction temperature within the -40 °C to +125 °C operating range.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes that go beyond what is found in the manufacturer datasheet alone, helping engineers evaluate MCZ33927EK for new designs or as a replacement for legacy Freescale/NXP part numbers.
Drop-in-Alternativen für MCZ33927EK – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MCZ33937EK
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MCZ33927EK Grenzwerte & elektrische Eigenschaften
| Configuration | 3 Phase Bridge FET Pre-Driver |
| Supply Voltage (VCC) | 8 V to 40 V |
| Peak Gate Drive Current | 600 mA per channel |
| Propagation Delay | 265 ns (typical) |
| Anzahl der Ausgänge | 6 (3 high-side + 3 low-side) |
| Interface / Control | SPI (Serial Peripheral Interface) |
| Gehäuse | 54-BSSOP (0.295 inch, 7.50 mm width) Exposed Pad |
| Montageart | Surface Mount |
| Betriebstemperatur | -40 °C to +125 °C |
| Technology | SMARTMOS (mixed-signal BiCMOS) |
| Input Type | Logic-level PWM, SPI commands |
| Anzahl der Pins | 54 |
| Packaging | Tube |
| Channel Type | Independent high-side and low-side per phase |
| Charge Pump | Integrated (supports 100% duty cycle) |
| Fault Protection | Overcurrent, Overtemperature, Undervoltage Lockout |
MCZ33927EK Pin-Konfiguration
| Pin 1 | VCC — Logic supply input |
| Pin 2 | SCLK — SPI clock input |
| Pin 3 | MOSI — SPI master-out slave-in |
| Pin 4 | MISO — SPI master-in slave-out |
| Pin 5 | CS — SPI chip select (active low) |
| Pin 6 | RESET — Device reset input |
| Pin 7 | EN — Global enable input |
| Pin 8 | FAULT — Open-drain fault output |
| Pin 9 | GH1 — High-side gate drive phase 1 |
| Pin 10 | GL1 — Low-side gate drive phase 1 |
| Pin 11 | HS1 — Phase 1 high-side source / phase node |
| Pin 12 | BOOT1 — Bootstrap supply phase 1 |
| Pin 13 | GH2 — High-side gate drive phase 2 |
| Pin 14 | GL2 — Low-side gate drive phase 2 |
| Pin 15 | HS2 — Phase 2 high-side source / phase node |
| Pin 16 | BOOT2 — Bootstrap supply phase 2 |
| Pin 17 | GH3 — High-side gate drive phase 3 |
| Pin 18 | GL3 — Low-side gate drive phase 3 |
| Pin 19 | HS3 — Phase 3 high-side source / phase node |
| Pin 20 | BOOT3 — Bootstrap supply phase 3 |
| Pin 21 | GND — Analog / logic ground |
| Pin 22 | NC — Not connected (per datasheet) |
| Pin 23 | NC — Not connected (per datasheet) |
| Pin 24 | NC — Not connected (per datasheet) |
| Pin 25 | NC — Not connected (per datasheet) |
| Pin 26 | NC — Not connected (per datasheet) |
| Pin 27 | NC — Not connected (per datasheet) |
| Pin 28 | NC — Not connected (per datasheet) |
| Pin 29 | NC — Not connected (per datasheet) |
| Pin 30 | NC — Not connected (per datasheet) |
| Pin 31 | NC — Not connected (per datasheet) |
| Pin 32 | NC — Not connected (per datasheet) |
| Pin 33 | NC — Not connected (per datasheet) |
| Pin 34 | NC — Not connected (per datasheet) |
| Pin 35 | NC — Not connected (per datasheet) |
| Pin 36 | NC — Not connected (per datasheet) |
| Pin 37 | NC — Not connected (per datasheet) |
| Pin 38 | NC — Not connected (per datasheet) |
| Pin 39 | NC — Not connected (per datasheet) |
| Pin 40 | NC — Not connected (per datasheet) |
| Pin 41 | NC — Not connected (per datasheet) |
| Pin 42 | NC — Not connected (per datasheet) |
| Pin 43 | NC — Not connected (per datasheet) |
| Pin 44 | NC — Not connected (per datasheet) |
| Pin 45 | NC — Not connected (per datasheet) |
| Pin 46 | NC — Not connected (per datasheet) |
| Pin 47 | NC — Not connected (per datasheet) |
| Pin 48 | NC — Not connected (per datasheet) |
| Pin 49 | NC — Not connected (per datasheet) |
| Pin 50 | NC — Not connected (per datasheet) |
| Pin 51 | NC — Not connected (per datasheet) |
| Pin 52 | NC — Not connected (per datasheet) |
| Pin 53 | NC — Not connected (per datasheet) |
| Pin 54 | EP — Exposed thermal pad - must be soldered to PCB copper pour |
Typische Anwendungen
MCZ33927EK ist geeignet für 6 Anwendungs: Automotive HVAC Blower Motor Control, Automotive Fuel Pump BLDC Drive, Electric Water Pump Drive, Industrial PMSM Servo Drive, Drone and UAV Propulsion BLDC Control, Robotic Joint and CNC Spindle Motor Drive.
Automotive HVAC Blower Motor Control
The MCZ33927EK's 8 V to 40 V supply range and 600 mA peak gate-drive current make it well suited to automotive 12 V HVAC blower motors. In this application the IC drives a 3-phase BLDC motor through six external N-channel MOSFETs, with the integrated charge pump sustaining 100% duty-cycle high-side drive during low-speed stall conditions. The -40 °C to +125 °C operating range and AEC-Q100 qualification cover underhood and cabin HVAC environments, while the exposed thermal pad keeps junction temperature within margin at the typical 25 kHz PWM switching frequency used for silent blower commutation.
Empfohlen
Automotive Fuel Pump BLDC Drive
In brushless fuel-pump applications the MCZ33927EK's SPI-programmable fault detection and dead-time insertion prevent shoot-through that would otherwise damage the external MOSFETs. The 265 ns propagation delay enables precise torque control at the 20 kHz PWM frequencies typical of in-tank fuel pumps. Integrated overcurrent and overtemperature shutdown protects the pump from stalled-rotor conditions, while the wide 8 V to 40 V supply tolerates cranking and load-dump transients on the 12 V battery rail without external regulation.
Empfohlen
Electric Water Pump Drive
The MCZ33927EK drives small 12 V coolant and oil circulation pumps used in modern ICE and hybrid powertrains. Its three-phase bridge configuration directly drives the stator windings of a BLDC pump, while SPI-controlled blanking intervals prevent false overcurrent trips caused by MOSFET switching transients. The exposed pad ensures reliable thermal performance in sealed pump housings where ambient temperature can reach 125 °C. Hysteretic fault response protects the pump during dry-run events.
Empfohlen
Industrial PMSM Servo Drive
Industrial permanent-magnet synchronous motor (PMSM) servo drives benefit from the MCZ33927EK's 600 mA peak gate-drive current and 54-BSSOP exposed pad, which together handle MOSFETs in the 30 nC to 100 nC Q_G range at 50 kHz. SPI-programmable dead-time lets the designer optimize switching losses versus shoot-through margin for each motor. The device is rated for -40 °C to +125 °C operation, suiting factory-floor enclosures that experience temperature swings during duty cycles.
Empfohlen
Drone and UAV Propulsion BLDC Control
Small UAV propulsion BLDC motors can use the MCZ33927EK for high-velocity electronic speed control where its 600 mA peak gate-drive current and 54-BSSOP footprint fit compact ESC (electronic speed controller) PCBs. The IC's 265 ns propagation delay supports high-KV motors that require up to 48 kHz PWM for smooth low-throttle response. AEC-Q100 robustness is overkill for hobby drones but valuable in commercial UAVs where reliability is critical.
Empfohlen
Robotic Joint and CNC Spindle Motor Drive
Robotic articulated joints and CNC spindle motors often run three-phase PMSM/BLDC topologies where the MCZ33927EK provides 6 discrete gate drives with SPI-based programmable protection. The exposed thermal pad supports sustained switching at the 30 kHz to 100 kHz range typical of high-dynamic servo loops, while the 40 V supply rating accommodates bus voltages up to 32 V from industrial 24 V rails. SPI diagnostics allow the central robot controller to monitor per-phase faults in real time.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MCZ33927EK – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MCZ33937EK |
|---|---|---|
| Package | 54-BSSOP Exposed Pad | 54-BSSOP Exposed Pad |
| Brand | NXP Semiconductors | NXP Semiconductors |
| Supply Voltage | 8 V to 40 V | 8 V to 40 V |
| Peak Gate Current | 600 mA | 1000 mA |
| Propagation Delay | 265 ns | 200 ns |
| Configuration | 3-phase bridge pre-driver | 3-phase bridge pre-driver |
| Interface | SPI | SPI |
| Automotive Qualified | Yes (AEC-Q100) | Yes (AEC-Q100) |
| Lifecycle Status | Active (legacy) | Active (recommended for new designs) |
Wichtigste Unterscheidungsmerkmale
- Mature AEC-Q100 qualified SMARTMOS design with proven automotive deployment (vs. MCZ33937EK)
- Integrated charge pump supports 100% duty-cycle high-side drive (vs. Generic 3-phase gate drivers without charge pump)
- SPI-programmable fault masks and diagnostics reduce firmware burden (vs. MCZ33937EK (successor))
Designhinweise
The MCZ33927EK's 54-BSSOP exposed thermal pad is mandatory for reliable operation at high PWM frequencies. Solder the exposed pad to a continuous PCB copper pour of at least 1 square inch on top and bottom layers, stitched with thermal vias. Estimated junction-temperature rise at 25 kHz switching and 600 mA gate drive current with a 1 in² pour is approximately 35 °C above ambient, keeping junction temperature within the 125 °C maximum at 90 °C ambient.
Bootstrap capacitor sizing must account for the worst-case gate charge and refresh interval. For 50 nC Q_G, a 33 nF X7R ceramic with 16 V rating is the minimum; select 100 nF for safety margin. Place each bootstrap capacitor physically close to its BOOT and HS pins to minimize parasitic inductance that would otherwise cause high-side gate-drive ringing during hard switching transitions.
Keep the high-current loop (VCC → high-side MOSFET drain → phase node → low-side MOSFET source → GND) compact to minimize parasitic inductance. Use wide PCB traces (≥40 mil) for phase nodes, and place VCC decoupling (10 µF bulk + 100 nF ceramic) within 5 mm of the supply pin. Connect the analog ground pin to a low-noise ground plane separate from the high-current power ground.
Do not exceed 40 V on VCC, even transiently - automotive load-dump events can reach 35 V steady-state and 40 V for milliseconds. Add a TVS diode (e.g., 36 V SMAJ) from VCC to ground for production designs. Failure to solder the exposed pad will cause thermal runaway and premature failure at sustained gate-drive currents above 300 mA per channel.
Compliance-Informationen
AEC-Q100 qualified for automotive applications. RoHS and REACH compliance per NXP product page. Halogen-free status not explicitly listed in available data; marked unknown per Data Authenticity Rules.
