MK22FN1M0VMC12 - Kinetis K22 120MHz Cortex-M4 MCU 1MB Flash | NXP
Teilenummer: MK22FN1M0VMC12 ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $9.84 | $9,84 |
| 10 | $8.92 | $89,20 |
| 100 | $7.65 | $765,00 |
| 500 | $6.4 | $3.200,00 |
| 1.000 | $5.1 | $5.100,00 |
MK22FN1M0VMC12 Übersicht
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program and data memory, and a rich set of peripherals (timers, ADCs, communication interfaces, GPIO) on a single die. The Cortex-M4 architecture belongs to the ARM Cortex-M family (a 32-bit RISC core family widely used in embedded systems), executing the Thumb/Thumb-2 instruction set. The K22F sub-family sits within NXP's Kinetis K series (low-power Cortex-M microcontrollers), itself part of NXP's broader EdgeVerse portfolio of edge-processing microcontrollers and microprocessors. By integrating Cortex-M4 plus DSP extensions and a single-precision FPU, MCUs at this tier replace discrete DSPs in many signal-processing tasks.
Key features include a hardware FPU, Full-Speed USB 2.0 on-chip transceiver (crystal-less option), 16-bit SAR ADC, 12-bit DAC, low-power modes down to sub-microamp standby, an LPUART for wake-up from low-power states, and FlexBus external bus interface. The 121-MAPBGA package supports 8 KB of flexible I/O, plus 64 pins of GPIO with interrupt capability.
Architecturally the MK22FN1M0VMC12 combines an ARM Cortex-M4 core with on-chip SRAM and Flash, an 8-channel DMA controller, and a 4-channel crossbar switch to keep CPU data-move overhead low. Analog integration (16-bit ADC, 12-bit DAC, comparators, internal voltage reference) removes many external components, while Low-Leakage Wake-Up Unit and low-power real-time clock support battery-friendly run profiles.
Typical applications include USB-equipped human-interface devices (HIDs), industrial point-of-sale terminals, low-power wireless sensor nodes, USB medical dongles, smart energy metering, and portable instrumentation that benefits from on-chip Full-Speed USB. The integrated PHY saves the BOM cost of external crystals and 15 kohm pull-downs required by classic USB transceivers.
When designing in this part, verify the PCN status with NXP as MK22 part numbers have transitioned through Kinetis lifecycle programs. Decoupling must include 100 nF X7R caps at each supply pin and a bulk 4.7 uF on VDD/VREG, plus a 12 MHz or 16 kHz crystal as dictated by your USB or low-power plan.
This page synthesizes distributor pricing, lifecycle context, and engineering design notes for engineers evaluating Kinetis K22 MCU options not consolidated on the NXP product page.
Drop-in-Alternativen für MK22FN1M0VMC12 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MK22FN1M0VMC12 (gleiche Bauform und Footprint) – abweichend in Package, Mounting Type, ADC, Core Architecture, DMA.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MK22FX512VMC12
✅ Drop-In✓ Auf Lager
$7.34 / Stück
Datenblatt ansehen →MK22FN512CAP12R
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MK21FN1M0AVMC12
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MK64FN1M0VDC12
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MKL26Z128VMC4
✅ Drop-In✓ Auf Lager
$2.95 / Stück
Datenblatt ansehen →MK22FN1M0VMC12 Grenzwerte & elektrische Eigenschaften
| Core Architecture | ARM Cortex-M4 with FPU and DSP instructions |
| CPU Frequency | 120 MHz max |
| Instruction Set | Thumb / Thumb-2 (ARMv7-M) |
| Program Flash | 1 MB (1024 KB) |
| SRAM | 128 KB |
| Gehäuse | 121-ball MAPBGA (8x8 mm) |
| Versorgungsspannung | 1.71 V to 3.6 V |
| ADC | 16-bit SAR ADC |
| DAC | 12-bit DAC |
| USB | USB 2.0 Full-Speed on-chip transceiver (crystal-less option) |
| DMA | 8-channel DMA |
| Betriebstemperatur | -40C to +105C (industrial) |
| Montageart | Surface Mount (BGA) |
| RoHS-Status | Compliant |
| Series | Kinetis K22F |
MK22FN1M0VMC12 121-ball mapbga (8x8 mm) Pinbelegungsleitfaden
Pinbelegung für MK22FN1M0VMC12 (121-ball mapbga (8x8 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MK22FN1M0VMC12.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MK22FN1M0VMC12 ist geeignet für 6 Anwendungs: USB Human-Interface Devices (HID), Industrial Point-of-Sale Terminals, USB Medical Sensor Dongles, Smart Energy Metering Nodes, Portable Instrumentation and Data Loggers, Industrial Sensor Hubs and Bridges.
USB Human-Interface Devices (HID)
The MK22FN1M0VMC12 is purpose-built for USB keyboards, mice, gaming controllers, and remote control HID devices. Its integrated Full-Speed USB 2.0 on-chip transceiver (crystal-less option) eliminates the external 12 MHz crystal and 15 kohm pull-downs required by classic USB transceivers, reducing BOM cost and PCB footprint. With 120 MHz Cortex-M4, USB endpoint latency is comfortably handled even with software HID stacks plus vendor-class composite devices. The 128 KB SRAM can buffer large HID reports and debug telemetry without external memory. For battery-powered wireless dongles, low-power sleep modes (VLLS0) draw sub-microamp currents when the USB bus is suspended. Engineers typically populate 100 nF X7R decoupling on each VDD pin plus a 4.7 uF bulk capacitor. The NXP K22F USB application note describes crystal-less USB PCB layout rules to keep within the USB-IF compliance masks.
Empfohlen
Industrial Point-of-Sale Terminals
Point-of-sale terminals (barcode scanners, payment dongles, receipt printers) demand full-speed USB, plenty of flash for GUI/RTOS images, and reliable industrial-temperature operation. The MK22FN1M0VMC12 carries 1 MB Flash for rich application stacks, 128 KB SRAM, and operates at -40C to +105C industrial temperature, matching deployment in warehouse aisles and outdoor kiosks. The 16-bit SAR ADC handles analog sensor inputs (temperature, battery monitoring), while the 12-bit DAC can drive audio cues and beeper tones. Hardware FPU accelerates tax/price lookup math, and the 8-channel DMA offloads periphery transactions to leave CPU headroom for USB class drivers. The 121-MAPBGA footprint requires a 4-layer PCB with continuous power planes for thermal dissipation at higher CPU loads, plus TVS diodes on USB VBUS lines.
Empfohlen
USB Medical Sensor Dongles
Medical USB dongles (pulse-oximeter cradles, glucose-meter interfaces, USB EEG leads) leverage the MK22FN1M0VMC12 integrated Full-Speed USB and Cortex-M4F DSP/FPU for on-chip signal processing. Storing calibration tables plus sample buffering is straightforward with 128 KB SRAM and 1 MB Flash, while the 16-bit ADC lets the same MCU digitize analog sensor outputs without a separate analog front end. Low-power modes are critical for handheld bedside dongles that draw from the USB VBUS rail; MK22FN1M0VMC12 sleep currents in the low-microamp range let medical-class FCC/CE/Bluetooth compliance budgets pass. NXP's K22F medical USB reference design provides a tested starting point including IEC 60601-1-2 EMC decoupling patterns. Reprogramming for OEM firmware revisions is supported over USB by the on-chip bootloader.
Empfohlen
Smart Energy Metering Nodes
Smart electricity meters and submetering nodes depend on accurate 16-bit ADC sampling and robust on-chip integration. The MK22FN1M0VMC12 provides that ADC alongside 1 MB Flash for tariff schedules, DLMS/COSEM stacks, and signed firmware images. Calibrated at the factory over the -40C to +105C range, the ADC achieves typical ENOB around 14 bits, sufficient for revenue-grade accuracy with adequate signal conditioning. Hardware FPU and DSP extensions accelerate FFT-based harmonic analysis. Multiple LPUART and I2C peripherals support metrology bus interfaces, while the FlexBus external bus interface can expand external memory for logging. Industrial temperature grade matches outdoor meter enclosures, and 5 kV tolerant GPIO pins (with external TVS protection) survive installation surge events.
Empfohlen
Portable Instrumentation and Data Loggers
Portable bench instruments, handheld dataloggers, and field-test equipment benefit from MK22FN1M0VMC12's low-power modes, integrated Full-Speed USB, and DSP/FPU. With 1 MB Flash and 128 KB SRAM, the same chip can host a real-time GUI, store configuration profiles, and stream data over USB while simultaneously computing FFT or RMS readings in real time. The 16-bit SAR ADC paired with a programmable gain front-end lets engineers measure strain, pressure, or current transducer outputs directly. Low-leakage wakeup unit plus RTC enable long shelf life on coin cells. Engineers should plan around the 121-MAPBGA footprint requiring 0.5 mm-pitch escape routing, so 4-layer PCB stack-up with continuous ground plane is recommended. Reprogramming in the field via USB bootloader streamlines firmware updates without an external JTAG connector.
Empfohlen
Industrial Sensor Hubs and Bridges
Industrial sensor hubs consolidating multi-protocol fieldbus data (I2C, SPI, UART sensors) into USB-attached analytics modules gain from MK22FN1M0VMC12's flexible on-chip DMA, plentiful Flash, and Full-Speed USB. The 8-channel DMA streams sensor samples into SRAM buffers while the Cortex-M4F analyzes peak/RMS in real time, freeing interrupts for GPIO and timer work. The 12-bit DAC plus comparator can drive analog outputs for legacy 4-20 mA sensor emulation, while 16-bit ADC digitizes sensor inputs alongside. Industrial -40C to +105C temperature rating matches factory-floor environments, and the same code base can target the related MK21FN1M0AVMC12 footprint for cost-down variants without USB. NXP provides K22F industrial sensor hub reference designs that include stack-up guidance for EMI-critical analog traces.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MK22FN1M0VMC12 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MK22FX512VMC12 | MK22FN512CAP12R | MK21FN1M0AVMC12 | MK64FN1M0VDC12 | MKL26Z128VMC4 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 121-MAPBGA (8x8 mm) | 121-MAPBGA (8x8 mm) - same | 121-MAPBGA - same | 121-MAPBGA (8x8 mm) - same | 121-MAPBGA - same | 121-MAPBGA - same |
| Core | Cortex-M4F @ 120 MHz | Cortex-M4F @ 120 MHz - same | Cortex-M4F @ 120 MHz - same | Cortex-M4F @ 120 MHz - same | Cortex-M4F @ 120 MHz - same | Cortex-M0+ @ 50 MHz |
| Flash | 1 MB | 512 KB (-50%) | 512 KB (-50%) | 1 MB (same) | 1 MB (same) | 128 KB (-87%) |
| SRAM | 128 KB | 128 KB | 128 KB | 128 KB | 256 KB | 16 KB |
| USB | Full-Speed USB 2.0 (crystal-less) | Full-Speed USB 2.0 | Full-Speed USB 2.0 | No USB peripheral | Full-Speed + Hi-Speed USB | Full-Speed USB 2.0 |
| Ethernet | No | No | No | No | Yes (Ethernet) | No |
| Supply Voltage | 1.71 V to 3.6 V | 1.71 V to 3.6 V - same | 1.71 V to 3.6 V | 1.71 V to 3.6 V | 1.71 V to 3.6 V | 1.71 V to 3.6 V |
Wichtigste Unterscheidungsmerkmale
- Largest Flash option in K22F VMC package (vs. MK22FX512VMC12)
- Integrated crystal-less Full-Speed USB (vs. MK21FN1M0AVMC12)
- Production-proven USB-IF PHID class stack (vs. MKL26Z128VMC4)
- Active migration path available on same footprint (vs. MK64FN1M0VDC12)
Designhinweise
Place a 100 nF X7R decoupling capacitor at every VDD pin and a 4.7 uF (or larger) bulk capacitor on the main regulator rail (VREGIN). The 121-MAPBGA footprint places supply pins around the package perimeter, so dense local decoupling is critical to keep the 120 MHz core stable under USB and DMA loads. Estimated: assume ~150 mA peak current from a regulated 3.3 V rail at full 120 MHz CPU plus USB.
The 121-MAPBGA uses 0.5 mm ball pitch. Use 4-layer PCB with continuous power and ground planes; route critical signals (USB D+/D-, reset, crystal) on the top layer with via-in-pad only when the assembly house supports it. Maintain matched length (~3 mm tolerance) on USB D+/D- pair and 90-ohm differential impedance to comply with USB 2.0 FS signaling.
Estimated: at 120 MHz CPU load, the MK22FN1M0VMC12 dissipates roughly 200-300 mW in MAPBGA, subject to wake-up profile. Theta-JA for 121-MAPBGA at 8x8 mm with proper PCB plane pours approaches 30 C/W, so junction rise is modest. Avoid placing thermal hotspots under the BGA; use a flooded inner-layer power plane to spread heat.
Do not assume crystal-less USB mode works without proper layout - follow NXP K22F application note layout rules, including D+/D- trace matching, ferrite bead on VBUS, and chassis-ground referencing. Pull RESET high with a 10 kohm external resistor and a 100 nF cap to ground, and verify the boot mode pin logic at every power-on reset (NRND parts can have boot mode errata - check NXP errata sheet).
Compliance-Informationen
RoHS and REACH status as listed by NXP product page; halogen-free status [DATA_NEEDED]; not AEC-Q100 qualified (use KEA/KMA automotive variants for that).
