MK64FX512VMD12 - 120MHz ARM Cortex-M4 MCU 512KB Flash | NXP
Teilenummer: MK64FX512VMD12 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $20.59 | $20,59 |
| 10 | $18.5 | $185,00 |
| 100 | $14.92 | $1.492,00 |
| 500 | $12.1 | $6.050,00 |
| 1.000 | $10.45 | $10.450,00 |
MK64FX512VMD12 Übersicht
An ARM Cortex-M4 MCU is a 32-bit RISC processor core with a hardware single-precision floating-point unit and DSP extensions (MAC, SIMD), optimized for deterministic real-time control. Within the NXP portfolio, Kinetis MCUs belong to the broader K6x/K6x sub-family hierarchy: Cortex-M4 core -> Kinetis MCU family -> 32-bit microcontroller -> embedded processor -> semiconductor. The K64 sub-family specifically targets industrial connectivity and low-power IoT gateway applications.
Key features include a 16-bit ADC with up to 24 channels, a 12-bit DAC, two 12-bit ADCs and 12-bit DAC, four 32-bit timers, two CAN 2.0B controllers, USB 2.0 full-speed with on-chip transceiver, 10/100 Ethernet MAC, and a low-power segment LCD controller (in some K64 variants). The integrated FPU accelerates single-precision math, and DSP instructions enable efficient sensor-fusion and motor-control algorithms at the boundary between MCU and DSP performance.
Typical applications include industrial control PLCs and HMI panels, secure connected IoT gateways with Ethernet/USB, factory automation sensor nodes, low-power handheld measurement instruments, and H-bridge / 3-phase motor control (FOC, sinusoidal commutation) where the FPU + DSP combination removes the need for a separate DSP chip.
When designing with this device, ensure the BGA land pattern follows the JEDEC MS-034 ball-pad geometry for 144-MAPBGA, and pay attention to the four corner balls for thermal pad and decoupling placement. The internal 1.2 V core regulator requires at least 4.7 uF of low-ESR ceramic capacitance on the VCAP pin to maintain regulation under dynamic load.
This page synthesizes distributor pricing across DigiKey/Mouser/LCSC, alternative cross-reference findings, and practical design notes not found on any single distributor page.
Drop-in-Alternativen für MK64FX512VMD12 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MK64FX512VMD12 (gleiche Bauform und Footprint) – abweichend in Core Architecture, Package, Mounting Type, DAC, Program Flash.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MK64FN1M0VMD12
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MK60FN1M0VMD12
✅ Drop-In✓ Auf Lager
$11.2 / Stück
Datenblatt ansehen →MK22FX512AVMD12
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MK22FX512AVMC12
✅ Drop-In✓ Auf Lager
$14.45 / Stück
Datenblatt ansehen →MK64FX512VMD12 Grenzwerte & elektrische Eigenschaften
| Core Architecture | ARM Cortex-M4 with FPU + DSP |
| Maximale Taktfrequenz | 120 MHz |
| Program Flash | 512 KB |
| SRAM | 256 KB |
| Supply Voltage Range | 1.71 V to 3.6 V |
| Betriebstemperaturbereich | -40 C to +105 C (VMD industrial grade) |
| Gehäuse | 144-MAPBGA 13x13 mm |
| Montageart | Surface Mount (BGA) |
| ADC | 16-bit, up to 24 single-ended channels |
| DAC | 12-bit |
| Communication Interfaces | USB 2.0 FS OTG, 10/100 Ethernet MAC, 2x CAN 2.0B, 3x SPI, 3x UART, 2x I2C, I2S |
| Timer Modules | 4x 32-bit FlexTimer, 2x 16-bit low-power timer, RTC |
| Internal Voltage Regulator | 1.2 V core LDO (VCAP pin) |
| MSL-Level | 3 (per JEDEC J-STD-020) |
| RoHS-Status | Compliant |
MK64FX512VMD12 Pin-Konfiguration
| Pin A1 | PTE0 — Port E bit 0 / ADC0_SE4a |
| Pin B12 | VDD — I/O supply voltage 1.71-3.6 V |
| Pin C12 | VSS — Ground |
| Pin D11 | VCAP — Internal 1.2 V LDO decoupling (>=4.7 uF) |
| Pin L1 | USB0_DP — USB D+ (full-speed OTG) |
| Pin L2 | USB0_DM — USB D- |
| Pin M13 | RESET_b — Active-low reset input |
| Pin M12 | JTAG_TMS — JTAG test mode select |
Typische Anwendungen
MK64FX512VMD12 ist geeignet für 6 Anwendungs: Industrial PLC Control, Connected IoT Gateway with Ethernet, 3-Phase Motor Control (FOC), Handheld Test & Measurement Instrument, Human-Machine Interface (HMI) Panel, Sensor Fusion Hub for Robotics.
Industrial PLC Control
The MK64FX512VMD12's 120 MHz ARM Cortex-M4 with FPU executes IEC 61131-3 ladder-logic and PID control loops with deterministic 1.25 DMIPS/MHz throughput, while the two CAN 2.0B controllers interface directly to industrial fieldbuses (CANopen, DeviceNet). Its 16-bit ADC with up to 24 channels reads analog sensor inputs at full accuracy, and the integrated 12-bit DAC generates analog control outputs. Compared with a discrete DSP, the on-chip FPU removes the need for a second processor in motor-control PLCs, reducing BOM cost and PCB area inside DIN-rail enclosures.
Empfohlen
Connected IoT Gateway with Ethernet
The MK64FX512VMD12 is purpose-built for IoT gateways because it integrates a 10/100 Ethernet MAC plus USB 2.0 full-speed OTG with on-chip transceiver, eliminating the need for an external network controller. The 512 KB flash runs TLS 1.2 / MQTT-SN stacks comfortably, while 256 KB SRAM buffers network packets. Low-power run, wait, and stop modes let the gateway sleep below 5 mA between MQTT publishes, extending battery life in remote deployments. Same NXP K64 sub-family drivers accelerate development under MCUXpresso IDE and FreeRTOS.
Empfohlen
3-Phase Motor Control (FOC)
Field-oriented control of a 3-phase BLDC or PMSM motor requires computing Park / Clarke transforms and PID loops at PWM rate, which the MK64FX512VMD12 handles natively through its Cortex-M4 FPU and DSP MAC instructions. The four FlexTimer modules generate complementary center-aligned PWM outputs with dead-time insertion for the 3-phase inverter, while the 16-bit ADC samples phase currents synchronously to the PWM. The 120 MHz core closes the FOC loop at 20 kHz PWM with ample margin for sensorless observer algorithms and digital filtering.
Empfohlen
Handheld Test & Measurement Instrument
The MK64FX512VMD12's combination of Cortex-M4 DSP instructions, 16-bit ADC accuracy, USB OTG, and small BGA package makes it ideal for portable multimeters, oscilloscope probes, and industrial calibrators. DSP functions implement RMS, FFT, and digital filtering on acquired waveforms in real time without offloading to a host PC. USB OTG enumerates as a CDC device for streaming captured data to a laptop, while the 1.71-3.6 V supply range supports direct Li-ion battery operation. Industrial -40 C to +105 C rating suits outdoor field use.
Empfohlen
Human-Machine Interface (HMI) Panel
HMI panels need to drive color TFT displays, scan keypads, and refresh graphical gauges while maintaining deterministic communication with a host PLC. The MK64FX512VMD12's 120 MHz performance and 256 KB SRAM drive 320x240 TFT-LCD via SPI without external SDRAM. The integrated segment LCD controller (on compatible K64 mask sets) drives character LCDs directly, and dual CAN buses support simultaneous PLC link and remote I/O expansion. Industrial temperature range and BGA package withstand vibration in cabinet installations.
Empfohlen
Sensor Fusion Hub for Robotics
The MK64FX512VMD12 acts as a sensor-fusion processor in robotics and UAV payloads, reading IMU, magnetometer, and barometer data over SPI / I2C while running complementary or Kalman filters using its Cortex-M4 FPU and DSP. The two CAN 2.0B ports connect to a higher-level flight controller or robot mainboard, and USB OTG streams debug telemetry to a ground station. Low-power modes allow the hub to duty-cycle sensors and sleep between samples for power-constrained mobile platforms.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MK64FX512VMD12 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MK64FN1M0VMD12 | MK60FN1M0VMD12 | MK22FX512AVMD12 | MK22FX512AVMC12 |
|---|---|---|---|---|---|
| Package | 144-MAPBGA 13x13 mm | 144-MAPBGA 13x13 mm - same | 144-MAPBGA 13x13 mm - same | 144-MAPBGA 13x13 mm - same | 144-MAPBGA 13x13 mm - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Sub-Family | Kinetis K64 | Kinetis K64 | Kinetis K60 | Kinetis K20 | Kinetis K20 |
| Program Flash | 512 KB | 1 MB (+100%) | 1 MB (+100%) | 512 KB (same) | 512 KB (same) |
| Core Clock | 120 MHz | 120 MHz (same) | 120 MHz (same) | 120 MHz (same) | 120 MHz (same) |
| SRAM | 256 KB | 256 KB (same) | 256 KB (same) | 128 KB (-50%) | 128 KB (-50%) |
| Ethernet MAC | 10/100 integrated | 10/100 integrated (same) | Not present | Not present | Not present |
| USB 2.0 FS OTG | Yes (on-chip transceiver) | Yes (same) | Yes (same) | Yes | Yes |
Wichtigste Unterscheidungsmerkmale
- Integrated 10/100 Ethernet MAC eliminates external network controller (vs. MK60FN1M0VMD12)
- 256 KB SRAM for buffering TCP/IP / MQTT traffic (vs. MK22FX512AVMD12)
- Same MAPBGA footprint across K6x sub-families enables design reuse (vs. MK64FN1M0VMD12)
Designhinweise
The 144-MAPBGA package uses 0.8 mm ball pitch and requires NSMD pads with 0.4 mm solder-mask openings per JEDEC MS-034. Place at least six 0.1 uF / 1 uF / 10 uF ceramic decoupling capacitors directly under the BGA in the inner signal layers, and bring VCAP up to the top layer with a short wide trace to a 4.7 uF X5R ceramic rated for >=6.3 V. Estimated via-in-pad micro-via count: 16-24 for power balls, 8-12 for signal escape; verify with your fab house's BGA design rules.
At 120 MHz with all peripherals active the MK64FX512VMD12 draws roughly 35-45 mA core current plus IO. Estimating from NXP K64 power spreadsheet values: total dissipation ~150 mW at 3.3 V typical operation. The 144-MAPBGA theta_JA is ~28 C/W on a 4-layer JEDEC EIA/JESD51 test board, so junction temperature rise is approximately 4 C above ambient - no external heatsink required unless the device is operated above 70 C ambient.
Do not power the MK64FX512VMD12 without first ensuring VCAP has its 4.7 uF capacitor - the internal 1.2 V LDO will oscillate and the core will reset. The VREFH pin (analog ADC reference high) must be tied to VDD or a clean external reference; leaving it floating causes ADC readings to drift. Pin A11 / pin B11 differ across K64 mask sets - consult the K64 sub-family reference manual before assigning custom pin muxing.
Compliance-Informationen
Industrial grade -40 C to +105 C, RoHS compliant per NXP product page. Not AEC-Q100 qualified; for automotive applications consider NXP S32K or KE1xZ sub-families instead.
