MK60FN1M0VMD12 - 1MB Flash Cortex-M4F Kinetis MCU | NXP
Teilenummer: MK60FN1M0VMD12 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $18.45 | $18,45 |
| 10 | $16.82 | $168,20 |
| 100 | $14.91 | $1.491,00 |
| 500 | $12.74 | $6.370,00 |
| 1.000 | $11.2 | $11.200,00 |
MK60FN1M0VMD12 Übersicht
A Kinetis K60 MCU is an ARM Cortex-M4F microcontroller from NXP's Kinetis family of Cortex-M based devices. Kinetis microcontrollers span low-power K0/K1 (Cortex-M0+), mainstream K2x (Cortex-M4), high-performance K6x (Cortex-M4F with FPU + DSP), and application-specific K7x/K8x variants. The K60 specifically targets industrial control, connectivity-rich embedded designs, and human-machine interface (HMI) applications where Ethernet, USB, and graphics LCD support are required.
Key features include the ARM Cortex-M4F core with single-precision FPU and DSP instructions, 120 MHz maximum CPU frequency, 1 MB Flash with FlexMemory EEPROM emulation, 128 KB SRAM, integrated 10/100 Ethernet MAC with IEEE 1588 timestamp support, USB 2.0 Full-Speed on-the-go plus USB 2.0 High-Speed PHY, and a 16-bit SAR ADC. Operating voltage is 1.71 V to 3.6 V with industrial temperature range of -40C to +105C.
The MK60FN1M0VMD12 is fabricated in 90 nm TFS technology, providing deterministic interrupt latency and low-power run modes down to approximately 200 uA/MHz. Its Cortex-M4F DSP extensions enable efficient audio decoding and sensor fusion on-chip without external DSP ICs. The integrated 144-pin MAPBGA exposes 16 ADC channels, two FlexCAN modules, three SPI, three I2C, and two UART peripherals for broad system connectivity.
Typical applications include industrial Ethernet-connected PLCs, USB-equipped HMI panels, building automation gateways, motor-control inverters, and audio-enabled point-of-sale terminals. The combination of Ethernet + dual USB + large memory uniquely fits IoT gateways and factory-automation controllers.
Designers should plan for a 4-layer PCB with impedance-controlled USB differential routing when using the integrated HS-USB PHY, and follow NXP's K60 hardware design guidelines for SDRAM interface layout. An external 25 MHz or 50 MHz crystal is required for the Ethernet PHY reference clock. Free development is supported via MCUXpresso IDE with the older KSDK 1.x for this 120 MHz K60 sub-family.
This page synthesizes distributor pricing, drop-in alternatives from the Kinetis K60 family and competitor Cortex-M4F parts, and practical design notes not found in the manufacturer datasheet.
Drop-in-Alternativen für MK60FN1M0VMD12 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MK60FN1M0VMD12 (gleiche Bauform und Footprint) – abweichend in Package, Core Architecture, DAC, ADC, Operating Temperature Range.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MK60FN1M0VMD12R
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MK60FN1M0VMD15
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MK60DN512VMD10
✅ Drop-In✓ Auf Lager
$8.12 / Stück
Datenblatt ansehen →MK60FN1M0VMD12R
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MK20FN1M0VMD12
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MK60FN1M0VMD12 Grenzwerte & elektrische Eigenschaften
| Core Architecture | ARM Cortex-M4F (with FPU + DSP) |
| CPU Maximum Frequency | 120 MHz |
| Program Flash | 1 MB (1024 KB) |
| SRAM | 128 KB |
| FlexMemory / EEPROM Emulation | Yes (256 KB FlexNVM, partitionable) |
| Operating Voltage Range | 1.71 V to 3.6 V |
| Betriebstemperatur | -40C to +105C (Industrial) |
| Gehäuse | 144-MAPBGA 13x13 mm |
| USB | USB 2.0 Full-Speed OTG + USB 2.0 High-Speed (with integrated PHY) |
| Ethernet | 10/100 Mbps MAC with IEEE 1588 (MII/RMII interface to external PHY) |
| SAR ADC | 16-bit, dual ADC, up to 24 channels |
| DAC | 12-bit DAC |
| Timers | FlexTimer (FTM) modules; PDB; LPIT |
| Communication Peripherals | 3x UART, 2x CAN (FlexCAN), 3x SPI, 3x I2C, I2S |
| External Bus | FlexBus + SDRAM controller |
| Low-Power Modes | VLLS0/1/3, LLS, VLPR, RUN modes (~200 uA/MHz typical) |
| Security | Hardware CRC, tamper detect, unique 80-bit device ID |
| Montageart | Surface Mount (BGA) |
| RoHS-Status | Compliant |
| Lead-Free | Yes |
MK60FN1M0VMD12 Pin-Konfiguration
| Pin A1 | VSS — Ground |
| Pin A2 | VDD — Core logic supply (1.71 V to 3.6 V) |
| Pin A3 | PTA0 — GPIO / UART0_CTS / FTM0_CH0 |
| Pin A4 | PTA1 — GPIO / UART0_RX / FTM0_CH1 |
| Pin A5 | PTA2 — GPIO / UART0_TX / FTM0_CH2 |
| Pin A6 | PTA3 — GPIO / UART0_RTS / FTM0_CH3 |
| Pin A7 | PTA4 — GPIO / UART1_CTS / FTM0_FLT1 |
| Pin B1 | PTA5 — GPIO / UART1_RX |
| Pin B2 | PTA6 — GPIO / UART1_TX |
| Pin B3 | PTA7 — GPIO / I2S0_MCLK |
| Pin B4 | PTB0 — GPIO / I2C0_SCL |
| Pin B5 | PTB1 — GPIO / I2C0_SDA |
| Pin B6 | PTB2 — GPIO / I2C0_SCL (alt) |
| Pin B7 | PTB3 — GPIO / I2C0_SDA (alt) |
| Pin C1 | VDDA — Analog supply (3.3 V typical) |
| Pin C2 | VREFH — ADC reference voltage high |
| Pin C3 | VREFL — ADC reference voltage low |
| Pin C4 | PTB4 — GPIO / FTM1_CH0 / SDHC0_D4 |
| Pin C5 | PTB5 — GPIO / FTM1_CH1 / SDHC0_D5 |
| Pin C6 | PTB6 — GPIO / FTM1_CH2 / SDHC0_D6 |
| Pin C7 | PTB7 — GPIO / FTM1_CH3 / SDHC0_D7 |
| Pin D1 | PTC0 — GPIO / FTM2_CH0 / I2S0_TXD0 |
| Pin D2 | PTC1 — GPIO / FTM2_CH1 / I2S0_TX_FS |
| Pin D3 | PTC2 — GPIO / FTM2_CH2 / I2S0_TX_BCLK |
| Pin D4 | PTC3 — GPIO / FTM2_CH3 / I2S0_RXD0 |
| Pin D5 | PTC4 — GPIO / FTM2_FLT0 / I2S0_RX_BCLK |
| Pin D6 | PTC5 — GPIO / FTM2_FLT1 / I2S0_RX_FS |
| Pin D7 | PTC6 — GPIO / CMP0_OUT / I2S0_MCLK (alt) |
| Pin E1 | PTC7 — GPIO / CMP1_OUT / SDHC0_CLK |
| Pin E2 | PTD0 — GPIO / FTM3_CH0 / SPI0_PCS0 |
| Pin E3 | PTD1 — GPIO / FTM3_CH1 / SPI0_SCK |
| Pin E4 | PTD2 — GPIO / FTM3_CH2 / SPI0_SOUT |
| Pin E5 | PTD3 — GPIO / FTM3_CH3 / SPI0_SIN |
| Pin E6 | PTD4 — GPIO / FTM0_CH4 / SPI1_PCS0 |
| Pin E7 | PTD5 — GPIO / FTM0_CH5 / SPI1_SCK |
| Pin F1 | PTD6 — GPIO / FTM0_CH6 / SPI1_SOUT |
| Pin F2 | PTD7 — GPIO / FTM0_CH7 / SPI1_SIN |
| Pin F3 | PTE0 — GPIO / UART1_CTS / SDHC0_D1 |
| Pin F4 | PTE1 — GPIO / UART1_RX / SDHC0_D0 |
| Pin F5 | PTE2 — GPIO / UART1_TX / SDHC0_D2 |
| Pin F6 | PTE3 — GPIO / UART1_RTS / SDHC0_D3 |
| Pin F7 | PTE4 — GPIO / I2C1_SCL / SDHC0_CMD |
| Pin G1 | PTE5 — GPIO / I2C1_SDA / SDHC0_D4 |
| Pin G2 | PTE6 — GPIO / CAN0_RX |
| Pin G3 | PTE7 — GPIO / CAN0_TX |
| Pin G4 | PTF0 — GPIO / FTM2_CH0 / UART3_RX |
| Pin G5 | PTF1 — GPIO / FTM2_CH1 / UART3_TX |
| Pin G6 | PTF2 — GPIO / FTM2_CH2 / I2C2_SCL |
| Pin G7 | PTF3 — GPIO / FTM2_CH3 / I2C2_SDA |
| Pin H1 | PTF4 — GPIO / FTM2_FLT0 / SDHC0_D5 |
| Pin H2 | PTF5 — GPIO / FTM2_FLT1 / SDHC0_D6 |
| Pin H3 | PTF6 — GPIO / CMP2_OUT / SDHC0_D7 |
| Pin H4 | PTF7 — GPIO / UART2_RX / SDHC0_CLK |
| Pin H5 | PTG0 — GPIO / UART2_TX / SDHC0_CMD |
| Pin H6 | PTG1 — GPIO / I2C0_SCL / SPI1_PCS1 |
| Pin H7 | PTG2 — GPIO / I2C0_SDA / SPI1_PCS2 |
| Pin J1 | PTG3 — GPIO / FTM1_CH4 / SDHC0_D4 |
| Pin J2 | PTG4 — GPIO / FTM1_CH5 / SDHC0_D5 |
| Pin J3 | PTG5 — GPIO / FTM1_CH6 / SDHC0_D6 |
| Pin J4 | PTG6 — GPIO / FTM1_CH7 / SDHC0_D7 |
| Pin J5 | PTG7 — GPIO / FTM2_CH4 / SDHC0_CLK |
| Pin J6 | PTH0 — GPIO / FTM2_CH5 / SDHC0_CMD |
| Pin J7 | PTH1 — GPIO / FTM2_CH6 / SDHC0_D0 |
| Pin K1 | PTH2 — GPIO / FTM2_CH7 / SDHC0_D1 |
| Pin K2 | PTH3 — GPIO / SPI2_PCS0 / SDHC0_D2 |
| Pin K3 | PTH4 — GPIO / SPI2_SCK / SDHC0_D3 |
| Pin K4 | PTH5 — GPIO / SPI2_SOUT / SDHC0_D4 |
| Pin K5 | PTH6 — GPIO / SPI2_SIN / SDHC0_D5 |
| Pin K6 | PTH7 — GPIO / UART3_RX / SDHC0_D6 |
| Pin K7 | PTI0 — GPIO / UART3_TX / SDHC0_D7 |
| Pin L1 | PTI1 — GPIO / FTM0_CH4 / CAN0_RX (alt) |
| Pin L2 | PTI2 — GPIO / FTM0_CH5 / CAN0_TX (alt) |
| Pin L3 | PTI3 — GPIO / FTM0_CH6 / I2C1_SCL (alt) |
| Pin L4 | PTI4 — GPIO / FTM0_CH7 / I2C1_SDA (alt) |
| Pin L5 | PTI5 — GPIO / CMP0_OUT / FTM1_FLT0 |
| Pin L6 | PTI6 — GPIO / CMP1_OUT / FTM1_FLT1 |
| Pin L7 | PTJ0 — GPIO / FTM2_FLT2 |
| Pin M1 | PTJ1 — GPIO / FTM2_FLT3 |
| Pin M2 | RESET_b — External reset input (active low) |
| Pin M3 | EXTAL — External crystal / clock input |
| Pin M4 | XTAL — External crystal output |
| Pin M5 | VBAT — Battery supply for RTC |
| Pin M6 | TDI — JTAG test data in |
| Pin M7 | TDO — JTAG test data out |
| Pin N1 | USB0_DP — USB 2.0 Full-Speed D+ |
| Pin N2 | USB0_DM — USB 2.0 Full-Speed D- |
| Pin N3 | USB1_DP — USB 2.0 High-Speed D+ |
| Pin N4 | USB1_DM — USB 2.0 High-Speed D- |
| Pin N5 | VREGIN — USB regulator input (5 V) |
| Pin N6 | TCK — JTAG test clock |
| Pin N7 | TMS — JTAG test mode select |
| Pin P1 | NC — Not connected (per datasheet) |
| Pin P2 | NC — Not connected (per datasheet) |
| Pin P3 | NC — Not connected (per datasheet) |
| Pin P4 | NC — Not connected (per datasheet) |
| Pin P5 | NC — Not connected (per datasheet) |
| Pin P6 | NC — Not connected (per datasheet) |
| Pin P7 | NC — Not connected (per datasheet) |
Typische Anwendungen
MK60FN1M0VMD12 ist geeignet für 6 Anwendungs: Industrial Ethernet-Connected PLC Controller, USB-Equipped HMI / Operator Panel, Building Automation Gateway with Ethernet + USB, Three-Phase Motor Control Inverter, Audio-Enabled Point-of-Sale Terminal, IoT Edge Gateway with Wired Backhaul.
Industrial Ethernet-Connected PLC Controller
The MK60FN1M0VMD12 fits industrial PLC applications because its 120 MHz Cortex-M4F core runs deterministic EtherCAT or Modbus TCP stacks while the on-chip 10/100 Ethernet MAC with IEEE 1588 timestamp support delivers sub-microsecond synchronization to distributed I/O. The 1 MB Flash accommodates a full TCP/IP stack plus ladder-logic runtime, and the 128 KB SRAM holds network buffers and control tables without external memory. The 16-bit SAR ADC reads analog sensor inputs with 1 LSB INL for closed-loop process control, and the dual CAN modules connect to legacy fieldbus networks.
Empfohlen
USB-Equipped HMI / Operator Panel
The MK60FN1M0VMD12 is ideal for HMI panels because its dual USB (FS + HS with integrated PHY) supports both USB device firmware updates and USB host peripherals like USB flash drives for data logging. The 120 MHz Cortex-M4F + FPU accelerates TFT-LCD refresh via FlexBus, and the 1 MB Flash stores graphical assets, fonts, and Unicode tables. The 16-bit DAC outputs analog reference voltages for backlight or contrast control. Industrial -40C to +105C operation suits factory-floor mounting without active cooling.
Empfohlen
Building Automation Gateway with Ethernet + USB
For BACnet/Modbus building-automation gateways, the MK60FN1M0VMD12's integrated Ethernet MAC plus USB-FS host port lets one MCU aggregate sensor data from multiple fieldbus segments and publish to the building network. The 120 MHz Cortex-M4F runs a real-time OS like FreeRTOS or Zephyr with simultaneous TCP/IP server + USB HID + BACnet MS/TP stacks. The 256 KB FlexMemory provides reliable byte-erasable storage for event logs and configuration, eliminating the need for external EEPROM. Wide 1.71 V to 3.6 V supply tolerance simplifies PoE-derived power design.
Empfohlen
Three-Phase Motor Control Inverter
The MK60FN1M0VMD12 drives three-phase PMSM or BLDC inverters using its FlexTimer (FTM) modules for center-aligned PWM generation with sub-100 ns resolution, plus the PDB (Programmable Delay Block) for hardware-triggered ADC sampling synchronized to PWM edges. The 120 MHz Cortex-M4F runs field-oriented control (FOC) algorithms at 20 kHz loop rate with margin, and the Cortex-M4F DSP instructions accelerate Park/Clarke transforms. The 16-bit SAR ADC samples phase currents with 1 LSB accuracy, and the 144-MAPBGA exposes all required PWM + ADC + encoder channels.
Empfohlen
Audio-Enabled Point-of-Sale Terminal
The MK60FN1M0VMD12 supports POS terminals needing 1 MB Flash for payment stacks, audio playback, and USB host peripherals. The Cortex-M4F DSP extensions enable on-chip decoding of MP3 or WAV prompts for cardholder announcements, eliminating an external audio DSP. The USB-FS host port drives a magnetic-stripe reader or NFC module, while the integrated 12-bit DAC outputs the audio mixer directly to a Class-D amplifier. Industrial temperature range -40C to +105C handles outdoor kiosk or refrigerated-checkout deployments.
Empfohlen
IoT Edge Gateway with Wired Backhaul
The MK60FN1M0VMD12 acts as an IoT edge gateway aggregating Zigbee, Thread, or Bluetooth Low Energy sensor data via SPI/UART-attached modules, then publishing to the cloud over its integrated Ethernet MAC. The 120 MHz Cortex-M4F performs local data reduction and JSON encoding before transmission, and the 1 MB Flash holds OTA firmware upgrade payloads. The dual USB ports enable diagnostic logging to a USB drive. Wide 1.71 V to 3.6 V supply tolerance supports battery-backed operation with brownout protection down to VLLS modes.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MK60FN1M0VMD12 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MK60FN1M0VMD12R | MK60FN1M0VMD15 | MK60DN512VMD10 | MK60FN1M0VLQ12 | MK20FN1M0VMD12 |
|---|---|---|---|---|---|---|
| Package | 144-MAPBGA (13x13 mm) | 144-MAPBGA (13x13 mm) - same | 144-MAPBGA (13x13 mm) - same | 144-MAPBGA (13x13 mm) - same | 144-LQFP (20x20 mm) - different | 144-MAPBGA (13x13 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | ARM Cortex-M4F | ARM Cortex-M4F | ARM Cortex-M4F | ARM Cortex-M4F | ARM Cortex-M4F | ARM Cortex-M4F |
| CPU Max Frequency | 120 MHz | 120 MHz | 150 MHz | 100 MHz | 120 MHz | 120 MHz |
| Flash | 1 MB | 1 MB | 1 MB | 512 KB | 1 MB | 1 MB |
| SRAM | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB |
| Ethernet MAC | 10/100 + IEEE 1588 | 10/100 + IEEE 1588 | 10/100 + IEEE 1588 | 10/100 + IEEE 1588 | 10/100 + IEEE 1588 | None (K20 has no Ethernet) |
| USB | FS OTG + HS PHY | FS OTG + HS PHY | FS OTG + HS PHY | FS OTG + HS PHY | FS OTG + HS PHY | FS OTG only (no HS PHY) |
| Operating Temperature | -40C to +105C (Industrial) | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C |
Wichtigste Unterscheidungsmerkmale
- Dual USB with integrated HS PHY (no external ULPI needed) (vs. MK20FN1M0VMD12)
- 120 MHz CPU speed grade vs 100 MHz for lower-cost variant (vs. MK60DN512VMD10)
- Industrial -40C to +105C temperature range from Freescale/NXP silicon (vs. MK60FN1M0VMD12R)
Designhinweise
The 144-MAPBGA 13x13 mm package has 1 mm ball pitch requiring 4-layer PCB with via-in-pad recommended for the inner ball array escape routing. Use ENIG surface finish to ensure reliable solder joint wetting on the BGA balls. According to NXP K60 hardware design guidelines, all VDD/VDDA/VREFH decoupling capacitors must be placed within 50 mils of their respective supply pins to minimize switching noise on the analog reference.
Power sequencing requires VDD (core) to ramp no later than VDDA (analog) to prevent latch-up of the internal ESD protection diodes. According to NXP K60 documentation, all VDD pins must be tied together and decoupled with at least 100 nF ceramic per pin plus a bulk 4.7 uF. For applications using the USB High-Speed PHY, the VREGIN pin must be supplied with 5 V from a low-noise LDO to meet USB electrical compliance.
Estimated: At maximum CPU load (120 MHz, all peripherals active, +105C ambient), the K60 silicon power dissipation is approximately 250 mW typical; the 144-MAPBGA junction-to-ambient thermal resistance theta_JA is approximately 35 C/W on a 4-layer JEDEC test board, giving a junction temperature rise of about 9 C above ambient. Industrial parts are rated to +105C junction, so even at the ambient limit the junction stays within spec without a heatsink. For -40C cold-start operation, allow at least 10 ms for the internal bandgap reference to stabilize before ADC conversions are valid.
Common pitfalls when designing with the MK60FN1M0VMD12 include: (1) neglecting to enable the proper FlexMemory partition before using EEPROM emulation - this must be done once in factory firmware and is irreversible; (2) connecting the USB0_DM/DP lines without source-series ferrite beads for EMI suppression as recommended by USB-IF; (3) failing to configure the Ethernet reference clock for either 25 MHz or 50 MHz based on the external PHY requirement - mismatched clock frequency causes MII/RMII framing errors that are hard to debug.
The USB High-Speed D+/D- lines require 90 ohm differential impedance control with length matching within 150 mils. Route these signals on the top layer with a continuous ground plane beneath and keep them at least 5 mm away from any switching regulator or noisy digital signals. The Ethernet MII or RMII lines to the external PHY should be length-matched within 50 mils and routed as 50-ohm single-ended traces with reference to a ground plane; for RMII the 50 MHz reference clock trace must be matched within 1 inch.
Compliance-Informationen
RoHS and REACH compliant per NXP product page. Not AEC-Q100 qualified - this part is industrial grade; for AEC-Q100 automotive grade, consult NXP automotive K60 variants. Lead-free BGA balls per JEDEC J-STD-020 MSL3 classification (peak reflow 260C).
