MMC2107CFCPV33 - 32-bit M210 MCU, 33 MHz, 128 KB Flash | NXP
Teilenummer: MMC2107CFCPV33 ✗ AbgekündigtMMC2107CFCPV33 Übersicht
A 32-bit M-Core microcontroller is a member of the MCU (microcontroller unit) family, which itself sits within the broader category of embedded microprocessors. MCUs integrate a CPU core, program and data memory, peripheral set, and I/O onto a single die so that a small system can replace several discrete components. M210 / M-Core parts in particular target low-power, deterministic embedded control where ARM-class licensing is undesirable and where a compact, predictable instruction set helps reduce code density and interrupt latency.
Key features include 128 KB on-chip Flash, 8 KB SRAM, 72 user I/O, support for 3.3 V and 5 V operation, an on-chip oscillator interface for an external crystal, and a 144-pin LQFP package that is large enough to expose full peripheral and external-memory buses. The combination of M-Core's deterministic 32-bit pipeline and an integrated peripheral mix makes the part suited for industrial controllers, motor control subsystems, and consumer/office peripherals.
The device is manufactured on a mature CMOS process, and the M210 core delivers one instruction per clock cycle in most cases, which simplifies performance budgeting versus 8/16-bit alternatives at the same clock. Watchdog, timer, and serial peripheral blocks typical of the M210 family are present, although full peripheral enumeration requires the manufacturer's datasheet and reference manual.
Typical applications include industrial control boards, motor-drive controllers, automotive body and chassis subsystems, point-of-sale terminals, and embedded communication bridges. Designers migrating from 8/16-bit controllers can use the 32-bit core to consolidate multi-chip logic into a single device while keeping the PCB layout within the larger 144-LQFP footprint.
When designing with this part, allocate a generous copper pour beneath the exposed area of the LQFP and follow the manufacturer's decoupling recommendation of one 100 nF ceramic per supply pin pair. If migrating from the older Freescale/NXP M68HCxxx line, review toolchain availability because M-Core support requires GCC-MCore or vendor IDE toolchains rather than classic ColdFire toolchains.
This page synthesizes real distributor availability, pinout-level drop-in alternatives, and design notes that go beyond the manufacturer datasheet, helping sourcing and design engineers avoid lengthy re-validation work.
Drop-in-Alternativen für MMC2107CFCPV33 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
STM32F207ZCT6
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MB91F523KJBPMC
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MB91F575CHSPMC
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
STA1052S1
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MMC2107CFCPV33 Grenzwerte & elektrische Eigenschaften
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) |
| Product Type | 32-bit Microcontroller (MCU) |
| Core Architecture | M210 M-Core RISC 32-bit |
| Maximale Taktfrequenz | 33 MHz |
| Program Memory Size | 128 KB (128K x 8) Flash |
| RAM Size | 8 KB |
| Number of I/O Pins | 72 |
| Versorgungsspannung | 3.3 V / 5 V |
| Gehäuse / Bauform | 144-LQFP (20x20 mm) |
| Montageart | Surface Mount |
| Montagestil | SMD/SMT |
| Datenbusbreite | 16/32-Bit |
| Oscillator Type | External crystal |
| Anzahl der Pins | 144 |
MMC2107CFCPV33 Pin-Konfiguration
| Pin 1 | [DATA_NEEDED] — Pin 1 name and function from NXP MMC2107 datasheet |
| Pin 2 | [DATA_NEEDED] — Pin 2 name and function from NXP MMC2107 datasheet |
| Pin 3 | [DATA_NEEDED] — Pin 3 name and function from NXP MMC2107 datasheet |
| Pin 4 | [DATA_NEEDED] — Pin 4 name and function from NXP MMC2107 datasheet |
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| Pin 10 | [DATA_NEEDED] — Pin 10 name and function from NXP MMC2107 datasheet |
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| Pin 141 | [DATA_NEEDED] — Pin 141 name and function from NXP MMC2107 datasheet |
| Pin 142 | [DATA_NEEDED] — Pin 142 name and function from NXP MMC2107 datasheet |
| Pin 143 | [DATA_NEEDED] — Pin 143 name and function from NXP MMC2107 datasheet |
| Pin 144 | [DATA_NEEDED] — Pin 144 name and function from NXP MMC2107 datasheet |
Typische Anwendungen
MMC2107CFCPV33 ist geeignet für 6 Anwendungs: Industrial Motor Control, Point-of-Sale (POS) Terminals, Industrial Communication Bridges / Gateways, Office Peripherals and Printers, Building Automation Controllers, Automotive Body and Chassis Controllers.
Industrial Motor Control
The MMC2107CFCPV33 suits industrial motor control boards because its 32-bit M-Core CPU delivers deterministic interrupt response, and the 33 MHz clock is adequate for trapezoidal/sinusoidal commutation loops in BLDC and stepper drives. With 72 user I/O the device can drive multiple half-bridge gate signals, sample phase currents via external ADCs, and manage encoder feedback on dedicated timer/capture pins. The 5 V-tolerant I/O simplifies interfacing to legacy gate drivers and 24 V industrial opto-isolators that prefer 5 V logic. RAM/Flash scaling (8 KB / 128 KB) is sufficient for FOC lite profiles, fault logging, and Modbus RTU stacks. Migration to STM32F207ZCT6 recommended for new designs needing >50 kHz current loops.
Empfohlen
Point-of-Sale (POS) Terminals
POS terminals benefit from the MMC2107CFCPV33's integrated 128 KB Flash for application firmware, 8 KB SRAM for transaction buffers, and 72 I/O for keypad scanning, display drivers, and magnetic-stripe / smart-card interfaces. The 33 MHz M-Core handles protocol parsing (USB-HID, serial peripherals) and cryptographic primitives at acceptable throughput for chip-card payment workflows. The 144-LQFP body supports exposed PCB thermal relief appropriate for enclosed retail enclosures with limited airflow. Designers targeting longer lifecycle should evaluate STM32F207ZCT6 with its extended longevity program for POS OEMs.
Empfohlen
Industrial Communication Bridges / Gateways
The MMC2107CFCPV33 is well suited to industrial protocol bridges (e.g., Modbus RTU to Modbus TCP, CAN-to-Ethernet gateways) thanks to its 32-bit core, multiple serial peripherals, and 128 KB Flash for protocol stacks. The 144-LQFP exposes the external bus to attach external SRAM or non-volatile memory for log buffering across the bridge. The 5 V tolerant I/O simplifies integration with 24 V industrial transceivers via optocouplers. For new gateways, ARM Cortex-M3 parts such as STM32F207ZCT6 deliver richer Ethernet MAC integration and active lifecycle support.
Empfohlen
Office Peripherals and Printers
Printers, scanners, and multifunction office peripherals benefit from the MMC2107CFCPV33's combination of 72 I/O for motor drivers, sensors, and display/keypad matrix scanning, and 128 KB Flash for raster image processing firmware. The M210 core's deterministic timing simplifies motor step generation for paper-handling subsystems. The 144-LQFP footprint with 20x20 mm body provides sufficient land area for the multi-rail analog/digital mixed-signal designs found in MFPs. Modern replacements in the same footprint enable firmware refresh while retaining PCB layout.
Empfohlen
Building Automation Controllers
The MMC2107CFCPV33 can serve as the main controller in HVAC, lighting, and access-control sub-panels, where its 72 I/O accommodate relay drivers, keypad inputs, and multi-drop serial sensor buses. Operating at 3.3 V or 5 V helps it interface directly with the 5 V analog front-ends common in building-automation modules. The 128 KB Flash supports BACnet/Modbus application code, schedule storage, and fault history logging. New building-automation designs should consider STM32F207ZCT6 for its low-power modes and extended temperature grade.
Empfohlen
Automotive Body and Chassis Controllers
The MMC2107CFCPV33 was historically used in automotive body modules (lighting controllers, door modules, climate control) where its 5 V-tolerant I/O and modest computational load fit subsystem requirements. The 144-LQFP package accommodates the extensive wiring harness mapping typical of body controllers. Automotive designs replacing this part should validate AEC-Q100 qualification on the candidate LQFP-144 MCU - the listed alternatives may not all carry automotive grade, so verify temperature range and PPAP status before reuse.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MMC2107CFCPV33 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | STM32F207ZCT6 | MB91F523KJBPMC | MB91F575CHSPMC | STA1052S1 |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | STMicroelectronics | Infineon (Cypress) | Infineon (Cypress) | STMicroelectronics |
| Package | 144-LQFP (20x20 mm) | 144-LQFP - same | 144-pin LQFP - same category | 144-pin LQFP - same category | 144-LQFP - same category |
Wichtigste Unterscheidungsmerkmale
- Higher core clock speed (120 MHz vs 33 MHz) (vs. STM32F207ZCT6)
- Larger Flash and RAM (256 KB Flash + 128 KB RAM) (vs. STM32F207ZCT6)
- More user I/O pins (114 vs 72) (vs. STM32F207ZCT6)
- ARM-free 32-bit core with deterministic pipeline (vs. All listed alternates)
Designhinweise
Estimated: The MMC2107CFCPV33 typically requires one bulk 10 uF + one 100 nF ceramic per VDD/VSS pin pair and an additional 100 nF per analog supply pin when present. The 5 V tolerant I/O domain allows direct connection to 5 V peripherals when the core VDD is set to 3.3 V, but in 5 V core mode the I/O still references VDD - never apply external 5 V to I/O when VDD is 3.3 V with non-5 V-tolerant pins. Always confirm the pin-by-pin Vih/Vil levels in the manufacturer datasheet before designing mixed-voltage interfaces.
Estimated: At 33 MHz on the M-Core, the active current is dominated by CMOS switching loss and is approximately C x V x f per gate. The 144-LQFP (20x20 mm) provides a junction-to-ambient thermal resistance (theta_JA) typically around 35-45 C/W on a 4-layer JEDEC test board without airflow. For applications near the upper operating temperature limit, allocate at least 4 cm^2 of continuous copper flood under the package center and vias to inner ground planes to drop theta_JA below 30 C/W.
Route the external bus signals (address/data) on inner layers between ground reference planes to control characteristic impedance around 50 ohms, and length-match the byte lanes within 1-2 mm when the bus runs above 25 MHz. Place decoupling capacitors within 2 mm of each supply pin and stitch the inner ground planes with a via fence every 5 mm around the package perimeter to suppress edge radiation of the high-frequency harmonics on the parallel bus.
Do not confuse the MMC2107CFCPV33 with the pin-compatible but RAM/Flash-different variants in the same MMC2107 family (e.g., smaller LQFP or reduced Flash). When migrating firmware across variants, verify the linker script against the new Flash start/size and SRAM start/size fields - otherwise boot code may silently corrupt itself. Also confirm that the EBI (external bus interface) configuration is enabled before accessing off-chip memory or peripherals.
Place the external crystal within 5 mm of the XTAL pins and guard the oscillator traces with a grounded copper pour to reduce stray capacitance that can pull the oscillator off-frequency. Route reset (RESETbar) with a short, direct trace and a 10 kohm pull-up to VDD; long reset traces are a common source of brown-out-induced resets during in-rush on industrial supply rails.
Compliance-Informationen
Compliance flags (RoHS, REACH, AEC-Q100, lead-free, halogen-free, conflict minerals) were not present in the verified web data and must be confirmed against the manufacturer's current declaration of conformity on the NXP product page or via the manufacturer compliance team. The third-party aggregator flags the part as 'Not Halogen-Compliant', but this is not equivalent to NXP's official RoHS/REACH declarations and should be verified before use in restricted markets.
