MPC562CZP40 - 32-bit PowerPC MCU 40MHz ROMless 388-PBGA | NXP
Teilenummer: MPC562CZP40 ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $40.07 | $40,07 |
| 10 | $36.5 | $365,00 |
| 100 | $32.95 | $3.295,00 |
| 500 | $28.4 | $14.200,00 |
| 1.000 | $25.1 | $25.100,00 |
MPC562CZP40 Übersicht
A microcontroller (MCU) is an integrated circuit that combines a CPU core, program and data memory, on-chip peripherals, and I/O into a single silicon die. The PowerPC MPC5xx family descended from Motorola's RISC automotive microcontrollers, with the CPU core sitting above general-purpose microcontrollers and below high-end application processors in the embedded taxonomy: MCU -> 32-bit MCU -> RISC MCU -> PowerPC MCU -> automotive-grade MCU. The MPC562 implements a Harvard-style memory architecture with two Configurable Module Flash (CMF) regions and a Dual Port TPU RAM, supporting code compression (CODECMP) for on-chip flash variants.
Key features include a 32-bit PowerPC integer core, 32-bit address space, a dedicated peripheral pin multiplexing unit, a Time Processing Unit (TPU) for complex timing, a Queued Serial Module (QSM), a Configurable Communication Interface (CCI), and an enhanced USIU (System Integration Unit). The device integrates 8 KB of unified SRAM with the TPU and additional module memory areas. Operating temperature spans -40 C to +125 C for industrial and automotive environments.
Typical applications include automotive body and chassis controllers, industrial automation PLCs, CAN/LIN networked embedded nodes, and motor control systems. The TPU and USIU peripherals are tuned for real-time deterministic workloads and on-chip pulse-width modulation, often used in electronic power steering and transmission ECUs.
Designers should evaluate PCB layout for the 388-ball PBGA carefully, ensuring 4-layer or better stack-up with microvia fan-outs to maintain signal integrity on the high-speed external memory bus. Software development uses the PowerPC EABI toolchain (GCC + binutils) and either a Metrowerks CodeWarrior or Green Hills MULTI IDE; programmers typically attach via NXP's parallel BDM or a JTAG-style Nexus debug port.
This page synthesizes distributor pricing from DigiKey, Mouser and Heisener, identifies drop-in alternatives sharing the 388-PBGA footprint, and provides design notes not consolidated in the original Motorola datasheet.
Drop-in-Alternativen für MPC562CZP40 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MPC562CZP40 (gleiche Bauform und Footprint) – abweichend in Core Architecture, Mounting Type, Automotive Grade, Operating Temperature, Package.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MPC566CZP40
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC563CZP40
✅ Drop-In✓ Auf Lager
$58.5 / Stück
Datenblatt ansehen →MPC562CVR40
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC561CZP40
✅ Drop-In✓ Auf Lager
$51.75 / Stück
Datenblatt ansehen →MPC564MZP40
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC562CZP40 Grenzwerte & elektrische Eigenschaften
| Core Architecture | PowerPC MPC5xx RISC |
| Core Width | 32-bit |
| Maximale Taktfrequenz | 40 MHz |
| Program Memory Type | ROMless |
| Gehäuse | 388-PBGA (27x27 mm) |
| Betriebstemperatur | -40 C to +125 C |
| Communication Interfaces | QSM (SPI/SCI), CAN (TouCAN), USIU |
| Timers | Time Processing Unit (TPU) |
| Montageart | Surface Mount (BGA) |
| Lead-Free / RoHS | Yes (per DigiKey listing) |
| Series | MPC500 automotive / industrial MCU family |
| Code Compression (CODECMP) | Yes (per datasheet title) |
MPC562CZP40 388-pbga (27x27 mm) Pinbelegungsleitfaden
Pinbelegung für MPC562CZP40 (388-pbga (27x27 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MPC562CZP40.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MPC562CZP40 ist geeignet für 8 Anwendungs: Automotive Body Control Module (BCM), Electronic Power Steering (EPS) ECU, Industrial PLC and Automation Controller, Motor Control and Variable Frequency Drive, Engine Management / Transmission ECU, CAN-Connected Sensor Hub, Medical Instrumentation Controller, Aerospace Auxiliary Controller.
Automotive Body Control Module (BCM)
The MPC562CZP40's 32-bit PowerPC core at 40 MHz, integrated TouCAN controller, and QSM (SPI/SCI) peripherals make it a strong fit for body control modules managing lighting, door locks, wipers, and comfort systems. Its -40 C to +125 C operating range covers under-hood and cabin environments. Placed as the central ECU with CAN bus trunk off-chip and discrete power drivers, the MCU orchestrates multiple LIN sub-nets while the TPU generates precise timing for PWM-controlled loads.
Empfohlen
Electronic Power Steering (EPS) ECU
The Time Processing Unit (TPU) and USIU-driven deterministic interrupts in the MPC562CZP40 support the real-time torque-loop calculations required by electric power steering ECUs. At 40 MHz, the 32-bit core comfortably executes torque-vector algorithms at 1 ms loop rates. Designers pair the MCU with external 12 V gate drivers and resolver-to-digital converters; the 388-PBGA's exposed die enables direct thermal attachment to a chassis heatsink for high-vibration underhood operation.
Empfohlen
Industrial PLC and Automation Controller
The MPC562CZP40's PowerPC integer core executes deterministic ladder-logic and motion-control firmware at 40 MHz, suitable for mid-range industrial PLCs and machine controllers. Its QSM peripheral drives SPI-bus I/O expanders, while the CCI provides industrial fieldbus connectivity. When deployed on a 4-layer PCB with proper BGA fan-out, the MCU reliably operates in factory-floor environments across the full -40 C to +125 C range.
Empfohlen
Motor Control and Variable Frequency Drive
The MPC562CZP40's TPU can generate the complementary PWM outputs and dead-time insertion required by 3-phase variable frequency drives (VFDs). With 32-bit integer throughput and 40 MHz clock, field-oriented control (FOC) algorithms for permanent-magnet motors run within sub-millisecond loop intervals. External 3-phase IGBT/MOSFET gate drivers handle the high-current power stage while the MCU performs AD sampling, PI loops, and SVPWM modulation.
Empfohlen
Engine Management / Transmission ECU
The MPC562CZP40 was originally designed for engine management and transmission control, where its 32-bit PowerPC core, TPU, and CODECMP compression module deliver deterministic real-time performance. The integrated TouCAN controller connects to vehicle OBD-II and CAN bus networks at 500 kbit/s. External boot ROM holds program memory since this ROMless variant requires off-chip storage. -40 C to +125 C operation supports underhood mounting.
CAN-Connected Sensor Hub
The MPC562CZP40 acts as a CAN-connected sensor hub aggregating data from multiple SPI or analog sensors across an industrial or vehicle network. Its QSM peripheral exposes SPI for sensor interfacing while TouCAN bridges to the vehicle or factory CAN bus. The 40 MHz 32-bit core performs local sensor fusion, threshold checking, and digital filtering before forwarding condensed data upstream, reducing network bandwidth.
Empfohlen
Medical Instrumentation Controller
The MPC562CZP40's deterministic interrupt response and 32-bit data paths support mid-tier medical instrumentation such as infusion pumps, patient monitors, and benchtop analyzers. Its TPU generates precise PWM for motor-controlled syringe drives, and the 40 MHz clock handles real-time ECG/pressure waveform sampling and threshold detection. Long-term availability (NRND status) requires careful BOM lifecycle management for FDA-cleared designs.
Empfohlen
Aerospace Auxiliary Controller
The MPC562CZP40's industrial operating range and PowerPC reliability make it usable in non-flight-critical aerospace subsystems such as cabin lighting, galley controllers, and seat actuation systems. The 388-PBGA's mechanical robustness withstands vibration, and the deterministic USIU interrupt handling supports redundant sensor sampling. Designers must perform DO-254 compliance verification for any flight-critical role.
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MPC562CZP40 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MPC566CZP40 | MPC563CZP40 | MPC562CVR40 | MPC561CZP40 | MPC564MZP40 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors (originally Motorola/Freescale) | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 388-PBGA (27x27 mm) | 388-PBGA (27x27 mm) - same | 388-PBGA (27x27 mm) - same | 388-PBGA (27x27 mm) - same | 388-PBGA (27x27 mm) - same | 388-PBGA (27x27 mm) - same |
| Core | PowerPC MPC5xx RISC, 32-bit | PowerPC MPC5xx RISC, 32-bit | PowerPC MPC5xx RISC, 32-bit | PowerPC MPC5xx RISC, 32-bit | PowerPC MPC5xx RISC, 32-bit | PowerPC MPC5xx RISC, 32-bit |
| Clock Speed | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz |
| Program Memory | ROMless (external boot ROM required) | On-chip flash | ROMless | ROMless | ROMless | On-chip flash |
| Operating Temperature | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
| Approx. Unit Price (qty 1) | $40.07 | $42.50 | $38.90 | $39.80 | $36.50 | $44.20 |
Wichtigste Unterscheidungsmerkmale
- PowerPC RISC architecture with integrated TPU for deterministic timing (vs. MPC561CZP40)
- CODECMP code compression support reduces external memory bandwidth (vs. MPC562CVR40)
- Wide distributor availability through authorized channels (vs. MPC564MZP40)
Designhinweise
The 388-ball PBGA at 27x27 mm requires a 4-layer or better PCB stack-up with 0.4-0.5 mm pitch BGA fan-out using microvias. Route the external address/data bus on inner layers with controlled impedance (typically 50 ohm single-ended) and keep trace lengths matched within +/- 100 mil to preserve bus timing margins at 40 MHz. Place 0.1 uF decoupling capacitors on every power pin within 100 mil, and add bulk 10 uF ceramics near the supply pins. A continuous ground pour under the BGA improves thermal dissipation and signal return paths.
Estimated: At 40 MHz core clock with 3.3 V I/O and 5 V analog supply, the MPC562CZP40 typically dissipates 0.5-1.0 W depending on peripheral activity. The 388-PBGA's exposed die enables direct thermal attachment; design a 25x25 mm copper land array on the top and second layer connected by thermal vias (0.3 mm pitch, 12 mil filled) to a bottom-side heatsink pad. For underhood automotive deployments with ambient >85 C, derate junction-to-ambient by at least 20% and ensure case temperature stays below 110 C.
Do not assume ROMless variants boot from internal memory - the MPC562CZP40 requires an external boot ROM or flash on the address/data bus. Verify pin multiplexing assignments for QSM, TouCAN, and TPU functions in your specific layout, since the same physical pins can serve multiple peripheral functions and incorrect assignment is a common firmware/hardware integration bug. Always sequence the power rails per the datasheet (typically 5 V analog before 3.3 V I/O before 1.5 V core) to avoid latch-up.
The external memory bus at 40 MHz generates significant simultaneous switching noise on the address and data lines. Use source-series termination (22-33 ohm) on the MCU-side outputs and place the external memory device within 50 mm of the BGA to minimize reflections. Keep the address and data buses on separate PCB layers with adjacent ground planes, and avoid routing high-current motor-drive traces under or near the BGA to prevent ground-bounce coupling into the USIU clock tree.
Compliance-Informationen
RoHS and lead-free confirmed by DigiKey listing. REACH, halogen-free and conflict-minerals status not explicitly published in available distributor data and should be requested from NXP for the specific date code. AEC-Q100 automotive qualification for this specific variant not stated in available distributor data.
