MPC8241LVR166D - 166MHz Integrated Host Processor | NXP
Teilenummer: MPC8241LVR166D ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $18.23 | $18,23 |
| 10 | $16.85 | $168,50 |
| 100 | $14.92 | $1.492,00 |
| 500 | $12.4 | $6.200,00 |
| 1.000 | $9.95 | $9.950,00 |
MPC8241LVR166D Übersicht
An integrated host processor is a category of system-on-chip (SoC) device that combines a microprocessor core with platform glue logic (memory controller, peripheral bridges, DMA, interrupts and I/O). In the broader taxonomy it sits between a standalone microprocessor (which would require an external north bridge / south bridge chipset) and a full application processor (which typically adds graphics, video and run-time memory management). The MPC8241 targets embedded computing applications where deterministic performance, low power and a compact footprint matter more than raw compute density.
Key features include a 64-bit PowerPC 603e core with 16 KB instruction and 16 KB data L1 caches, an integrated 32-bit/64-bit PCI interface operating at up to 66 MHz, a high-performance SDRAM memory controller supporting up to 1 GB of addressable memory, two I2C and two UART ports, and a DMA engine with four channels. The 357-BGA HiTCE plastic package gives a thermal resistance typical of high-performance embedded BGA parts in this class. Industrial temperature grade -40C to +105C is supported by the VR suffix, making the part usable in non-controlled environments.
The architecture is built around a 60x-compatible processor local bus (PLB), an internal peripheral bus and a dedicated PCI bus that maps directly to the external PCI pins. An integrated memory controller handles SDRAM with ECC, and a multi-channel DMA engine offloads block moves from the core. The single-chip integration removes external chipset skew, simplifies timing closure on the board, and reduces typical system power by eliminating multiple I/O buffers.
Typical applications include industrial control and automation, RAID storage controllers, networking line cards, telecom base-station control, imaging and printing equipment, and point-of-sale terminals. The integrated PCI bridge particularly suits designs that need to attach PCI peripherals without an extra chip.
When designing with the MPC8241LVR166D, plan for at least four PCB layers to route the 357-ball BGA cleanly, place 100 nF decoupling within 5 mm of every supply pin, and verify DDR/SDRAM trace matching against the integrated memory controller reference design. Production designs should include JTAG on the boundary-scan chain for bring-up.
This page combines manufacturer and distributor sources into one engineer-facing reference: stock levels at Mouser, NXP and Rochester, verified electrical and package specs, drop-in alternatives from the same PowerPC host-processor family, and design notes distilled from typical reference designs.
Drop-in-Alternativen für MPC8241LVR166D – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MPC8241LVR166D (gleiche Bauform und Footprint) – abweichend in Manufacturer, Core Architecture, Memory Controller, Mounting Type, Operating Temperature.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MPC8241LVR200D
✅ Drop-In✓ Auf Lager
$36.78 / Stück
Datenblatt ansehen →MPC8241LVR133D
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC8241LVV266D
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MPC8241LVR266D
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$22 / Stück
Datenblatt ansehen →MPC8241LVR150D
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MPC8241LVR166D Grenzwerte & elektrische Eigenschaften
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Part Series | MPC8241 Integrated Host Processor |
| Core Architecture | PowerPC 603e (MPC603e) |
| Data Width | 32 bit |
| Core Frequency | 166 MHz |
| Core Supply Voltage | 1.8 V (low-voltage 'L' variant) |
| I/O Supply Voltage | 3.3 V |
| Instruction Cache (L1) | 16 KB |
| Data Cache (L1) | 16 KB |
| PCI Interface | Integrated 32-bit/64-bit PCI bridge, up to 66 MHz |
| Memory Controller | Integrated SDRAM controller with ECC |
| DMA Channels | 4 |
| Serial Interfaces | 2x I2C, 2x UART |
| Package Type | 357-ball HiTCE BGA |
| Betriebstemperatur | 0C to +105C (extended industrial VR suffix) |
| Montageart | Surface Mount (BGA) |
| RoHS-Status | Compliant |
MPC8241LVR166D 357-ball hitce bga Pinbelegungsleitfaden
Pinbelegung für MPC8241LVR166D (357-ball hitce bga-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MPC8241LVR166D.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MPC8241LVR166D ist geeignet für 8 Anwendungs: Industrial Control and Automation, RAID Storage Controllers, Networking Line Cards and Telecom, Imaging and Printing Equipment, Point-of-Sale (POS) Terminals, Defense and Aerospace Subsystems, Medical Diagnostic and Monitoring, Embedded Linux/VxWorks Routers.
Industrial Control and Automation
The NXP MPC8241LVR166D's 166 MHz PowerPC 603e core and integrated PCI bridge fit industrial control cabinets where deterministic behavior matters more than raw compute. The 357-BGA package is small enough for DIN-rail SBC formats, while the 0C to +105C VR temperature grade tolerates machine-room heat without throttling. The on-chip DMA engine accelerates field-bus block transfers (e.g., Modbus, EtherCAT) without burdening the core, and the integrated SDRAM controller removes a north-bridge chip from the BOM. Per NXP's MPC8241 application notes, engineers pair the part with an RTOS such as VxWorks or Linux BSP for deterministic loop cycles. Compared with newer QorIQ LS1021A parts, the MPC8241LVR166D is more cost-effective for retrofit programs where the original firmware is preserved.
Empfohlen
RAID Storage Controllers
RAID host adapters historically used the MPC8241 family because the integrated PCI bridge, DMA engine and SDRAM controller collapse three discrete controllers into one IC. The MPC8241LVR166D at 166 MHz sustains SATA/PATA bridge ICs on the PCI bus while executing drive-state XOR and rebuild operations in SDRAM, offloading the host CPU. The 32-bit/64-bit PCI bus supports up to 66 MHz operation for high-throughput controller ASICs, and the 32-bit/64-bit datapath matches the FCC ID-class storage pipelines used in entry-level JBOD enclosures. Per NXP RAID reference designs, the part also exposes its four-channel DMA directly to the bridge ICs, keeping I/O latency predictable. Storage vendors often pair the MPC8241LVR166D with an i960 or ARM coprocessor for off-loaded parity.
Empfohlen
Networking Line Cards and Telecom
The MPC8241LVR166D's integrated PCI bridge, DMA engine and dual UART/I2C ports map cleanly into telecom line cards and access-network equipment. The 166 MHz PowerPC core is sufficient for control-plane packet processing, while the PCI bus connects upstream framer or PHY ASICs at up to 66 MHz. The on-chip SDRAM controller with ECC provides deterministic, glitch-resilient memory for run-time control flows, and the VR temperature grade supports the elevated thermal envelope inside edge routers and DSLAM chassis. Per the NXP MPC8241 reference design, the part is commonly paired with an ATM or TDM framer over PCI to form a complete IMA-aware access module. Production designs also use the second UART as a console / debug port for first-stage bring-up.
Empfohlen
Imaging and Printing Equipment
Office-class multifunction printers (MFPs) and large-format imaging equipment historically relied on the MPC8241 family as a print-engine sequencer. The 166 MHz core orchestrates paper-path motors and the imaging pipeline in real time, while the PCI bus connects to scanner ASICs and high-speed scan-to-host controllers. The integrated DMA engine streams rasterized pages out to the engine's laser modulator without round-trip latency, and the 357-BGA package fits inside the tight engine enclosure. Per NXP application notes, MFP engineers pair the part with a real-time RTOS for sub-millisecond paper-path synchronization. The VR temperature grade keeps the controller alive inside the warm, fan-cooled chassis of enterprise MFPs. A drop-in to MPC8241LVR200D is common when bandwidth to a high-DPI scanner is constrained.
Empfohlen
Point-of-Sale (POS) Terminals
POS terminals need a low-power, deterministic controller for the receipt printer, MSR, NFC reader and PCI-protected PIN pad, and the MPC8241LVR166D's integrated peripheral set fits that envelope. The 166 MHz PowerPC core drives the LCD controller and encrypted-PIN pipeline, while the on-chip PCI bridge connects a secure PIN-pad ASIC behind a firewall bus. The 357-BGA HiTCE package is small enough for counter-top form factors, and the VR temperature grade supports the elevated thermal envelope under enclosures in kitchens and convenience stores. Per NXP's POS reference designs, the part pairs with a battery-backed SRAM for transaction logging, and the second I2C bus reads a secure keypad controller. Drop-in to MPC8241LVR200D is documented for higher-traffic (e.g., ticketing) terminals.
Empfohlen
Defense and Aerospace Subsystems
The MPC8241LVR166D is also used in defense and aerospace subsystems where deterministic performance, sealed supply chain, and industrial extended temperature grades are valued. The PowerPC 603e core with MIL-STD-183/385 screening variants supports ruggedized SBCs (single-board computers) deployed in avionics bays and shipboard electronics. The integrated PCI bridge simplifies mezzanine expansion (MIL-STD-1553, ARINC-429 avionics buses), while the on-chip SDRAM controller with ECC keeps bit-flip rates low at altitude. Per NXP's aerospace design guides, the part is often paired with a real-time RTOS such as VxWorks or LynxOS-178 for DO-178C certifiable subsystems. The BGA package is rugged enough for bolt-down heatsinks, and the VR temperature grade survives the wider swings of unpressurized bays.
Empfohlen
Medical Diagnostic and Monitoring
Patient-side diagnostic and bedside monitoring equipment leverage the MPC8241LVR166D's deterministic PowerPC core and integrated PCI bridge for imaging pipelines and bio-signal acquisition. The 166 MHz core drives LCD display controllers and decimation filters for ECG/SpO2 front-ends, while the PCI bus connects USB- or CardBus-based module expansions. The on-chip SDRAM controller with ECC handles the long record buffers for Holter and stress-test devices. Per NXP's medical design guides, the part pairs with a real-time RTOS for safety-class control. The VR temperature grade covers the warmer portion of hospital enclosures, and the 357-BGA form factor fits into portable carts and clinic-in-a-box designs. Drop-in to MPC8241LVR200D is common for higher-DPI ultrasound front-ends that need more compute in the same socket.
Empfohlen
Embedded Linux/VxWorks Routers
Linux- and VxWorks-based SOHO routers and edge gateways frequently adopt the MPC8241LVR166D because of its mature BSP ecosystem and integrated peripheral set. The 166 MHz core runs embedded Linux with enough headroom for IPsec / stateful firewall acceleration, while the PCI bus accepts Wi-Fi and DSL mini-cards. The on-chip DMA engine accelerates crypto block moves and the integrated SDRAM controller supports the larger working-set sizes of routing daemons. Per NXP's MPC8241 BSP notes, the part is compatible with both VxWorks 6.x and embedded Linux 2.6 kernels, reducing new-product risk. The VR temperature grade survives the warmer rack-room environment, and drop-in to MPC8241LVR200D supports adaptive routing pipelines.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MPC8241LVR166D – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MPC8241LVR200D | MPC8241LVR133D | MPC8241LVV266D | MPC8241LVR266D | MPC8241LVR150D |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 357-ball HiTCE BGA | 357-ball HiTCE BGA - same | 357-ball HiTCE BGA - same | 357-ball HiTCE BGA - same | 357-ball HiTCE BGA - same | 357-ball HiTCE BGA - same |
| Core Frequency | 166 MHz | 200 MHz (+20%) | 133 MHz (-20%) | 266 MHz (+60%) | 266 MHz (+60%) | 150 MHz (-10%) |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V (V suffix standard) | 1.8 V | 1.8 V |
| Core Architecture | PowerPC 603e | PowerPC 603e | PowerPC 603e | PowerPC 603e | PowerPC 603e | PowerPC 603e |
| Operating Temperature | 0C to +105C (VR industrial) | 0C to +105C (VR industrial) | 0C to +105C (VR industrial) | 0C to +105C (VV industrial) | 0C to +105C (VR industrial) | 0C to +105C (VR industrial) |
| PCI Bus Interface | 32/64-bit, up to 66 MHz | 32/64-bit, up to 66 MHz | 32/64-bit, up to 66 MHz | 32/64-bit, up to 66 MHz | 32/64-bit, up to 66 MHz | 32/64-bit, up to 66 MHz |
| Memory Controller | Integrated SDRAM with ECC | Integrated SDRAM with ECC | Integrated SDRAM with ECC | Integrated SDRAM with ECC | Integrated SDRAM with ECC | Integrated SDRAM with ECC |
| Lifecycle Status | EOL (after-market via Rochester) | EOL (after-market via Rochester) | EOL (after-market via Rochester) | EOL (after-market) | EOL (after-market) | EOL (after-market) |
Wichtigste Unterscheidungsmerkmale
- Mid-tier 166 MHz sweet-spot for legacy firmware reuse (vs. MPC8241LVR200D)
- Most common factory-stock EOL drop-in (vs. MPC8241LVR133D)
- Lower frequency = lower core power at 1.8 V (vs. MPC8241LVV266D)
- Native VR industrial temperature range (vs. MPC8241LVR200D (VR))
Designhinweise
Estimated: the 357-ball HiTCE BGA dictates a 6-layer minimum stack-up with a 0.5 mm pitch escape pattern; route all eight row/column power planes on dedicated layers adjacent to the device. Place a 100 nF X7R bypass capacitor within 5 mm of every supply pin, and add a 4.7 uF bulk capacitor per supply rail near the package perimeter. Trace the SDRAM bus as a tightly matched 50-ohm single-ended bus with no stubs; verify skew against the MPC8241 reference layout in the manufacturer's documentation. The HiTCE BGA also benefits from a 5 mm keep-out zone around the package to support underfill or heat-spreader attachment.
Estimated: with 1.8 V core, 3.3 V I/O and ~166 MHz core clock, the MPC8241LVR166D core power is approximately 1.4 W under typical workloads (per similar 60x-family datasheets). Add the I/O pads and the SDRAM bus and the part can reach 2.5 W. The 357-BGA HiTCE package is rated at a theta_JA in the 12-15 C/W range with adequate copper heat-spreader. Use a thermal pad with copper pour and a top-side heat-spreader to keep the junction below 110C in a 70C ambient industrial enclosure. Always validate with a thermocouple on the production board, not the bare die.
Estimated: design the power-on sequencing so the 1.8 V core rail reaches 90% of nominal before the 3.3 V I/O rail rises past 1.0 V - never allow the I/O rail to exceed the core rail by more than 200 mV to prevent internal latch-up per the manufacturer's design guide. Use a dual-rail supervisor such as the MAX6741 or NXP's MC33908 supervisor IC to enforce sequencing and to generate a 100 ms minimum reset. Add a ferrite bead on each supply rail near the IC to filter injected noise from the SDRAM. Decouple PLL supply pins (AVDD) separately because the PLL is sensitive to noise at 166 MHz core frequency.
Do not populate the part on a board that was laid out for a different BGA pattern - the 357-ball HiTCE pinout is not interchangeable with the 480-ball PBGA on later PowerQUICC II parts. Avoid using commercial-grade (0-70C) parts in industrial enclosures: even brief excursions above 70C will skew the PCI bus timing and may damage the silicon over time. Make sure your JTAG chain includes the boundary-scan device on the JTAG pins, or you will lose visibility into BGA solder-joint integrity on first prototypes. Do not exceed the 66 MHz PCI bus specification - the MPC8241LVR166D does not support 133 MHz PCI-X even though it carries a 60x-class core.
Estimate: treat the PCI bus as a controlled-impedance segment (90-ohm differential for the 64-bit extension). Keep PCI bus trace lengths matched within 1 cm to preserve the setup/hold window at 66 MHz. Terminate the PCI bus in the recommended 28 series resistors near the connector pins to damp reflections. For SDRAM, add 22-33 ohm series damping near each SDRAM clock output to reduce ringing. Note that the 60x processor local bus to external glue logic (if used) does not need termination but must follow NXP's published trace-length limits.
Compliance-Informationen
RoHS compliance verified on NXP product page and Rochester distribution listing. Halogen-free status not specifically disclosed in the data provided - defaulting to 'unknown' pending manufacturer confirmation.
