MPC8241LVR166D vs MPC8241LVR266D Vergleich
Detaillierter Direktvergleich von MPC8241LVR166D von NXP Semiconductors und MPC8241LVR266D von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MPC8241LVR166D | MPC8241LVR266D |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $9,95 | $22,00 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | NXP Semiconductors (formerly Freescale) |
| Part Series | MPC8241 Integrated Host Processor | — |
| Core Architecture | PowerPC 603e (MPC603e) | — |
| Data Width | 32 bit | — |
| Core Frequency | 166 MHz | — |
| Core Supply Voltage | 1.8 V (low-voltage 'L' variant) | — |
| I/O Supply Voltage | 3.3 V | — |
| Instruction Cache (L1) | 16 KB | — |
| Data Cache (L1) | 16 KB | — |
| PCI Interface | Integrated 32-bit/64-bit PCI bridge, up to 66 MHz | PCI 2.1, up to 66 MHz |
| Memory Controller | Integrated SDRAM controller with ECC | SDRAM with ECC |
| DMA Channels | 4 | — |
| Serial Interfaces | 2x I2C, 2x UART | — |
| Package Type | 357-ball HiTCE BGA | — |
| Betriebstemperatur | 0C to +105C (extended industrial VR suffix) | 0°C to +105°C |
| Montageart | Surface Mount (BGA) | Surface Mount |
| RoHS-Status | Compliant | Refer to NXP product page (likely non-RoHS given vintage 2005) |
| Part Status | — | Obsolete (End of Life) |
| Core Processor | — | PowerPC 603e |
| Series | — | PowerQUICC II (MPC82xx) |
| Number of Cores | — | 1 |
| Bus Width | — | 32-Bit |
| Clock Speed | — | 266 MHz |
| Process Technology | — | 0.25 micron |
| Versorgungsspannung | — | 3.3 V |
| Gehäuse | — | 357-PBGA (25 x 25 mm) |
| JTAG Support | — | Yes (IEEE 1149.1 boundary-scan) |
| Tray Quantity | — | Per datasheet packaging info |