MPC8241TVR200D - PowerQUICC II 200MHz Host Processor | NXP
Teilenummer: MPC8241TVR200D ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $32.5 | $32,50 |
| 10 | $28.75 | $287,50 |
| 100 | $24.9 | $2.490,00 |
| 500 | $21.5 | $10.750,00 |
| 1.000 | $18.25 | $18.250,00 |
MPC8241TVR200D Übersicht
An integrated host processor is a system-on-chip (SoC) variant that combines a microprocessor core with chipset-style peripherals (memory controller, I/O bridges) typically implemented as separate devices on industrial motherboards. The MPC82xx PowerQUICC II line sits between a bare MPU and a full SoC; it provides deterministic embedded performance with embedded DRAM support and a dedicated PCI interface for connecting standard PCI peripherals. This category hierarchy (MPU -> integrated host processor -> embedded SoC -> semiconductor) matters for engineers designing cost- and space-constrained embedded systems where a full SoC is overkill but a bare MPU plus discrete peripherals wastes board area.
Key features include a 200 MHz PowerPC 603e core (0.25 micron process), 1.8 V core voltage with 3.3 V I/O, integrated PCI bridge (32-bit/33 MHz), SDRAM/EDO ROM/Flash memory controller, and a peripheral logic block supporting two UARTs, I2C, and an interrupt controller. The integrated host processor reduces system chip count, board area, and power consumption while maintaining a familiar PowerPC programming model. The -40C to +105C industrial operating range supports harsh-environment deployments such as industrial control, network routers, and storage controllers.
Typical applications include embedded routers and switches, industrial automation controllers, single-board computers, printer imaging controllers, and storage area network (SAN) adapters. The PCI bridge enables connection to standard PCI peripherals while the integrated memory controller removes the need for an external northbridge. Compared to the earlier MPC860 PowerQUICC I family, the MPC8241 trades telecom-specific peripherals for a higher-performance CPU core and standard PCI connectivity.
When designing with the MPC8241, pay attention to decoupling capacitor placement around the BGA power balls and ensure the thermal pad design dissipates the typical 1.5-2.0 W core power under sustained load. The 25x25 mm BGA requires a 4-layer or 6-layer PCB with controlled-impedance routing for the DDR/SDRAM interface.
This page synthesizes distributor pricing, drop-in same-family alternatives, and design considerations not collocated on the manufacturer datasheet, enabling faster procurement and design-in decisions.
Drop-in-Alternativen für MPC8241TVR200D – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MPC8241TVR200D (gleiche Bauform und Footprint) – abweichend in Integrated PCI Bridge, Mounting Type, Operating Temperature, Package / Case.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MPC8241LVR200D
✅ Drop-In✓ Auf Lager
$36.78 / Stück
Datenblatt ansehen →MPC8241TZQ200D
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC8241TVR200D Grenzwerte & elektrische Eigenschaften
| Core Architecture | PowerPC 603e |
| Series | MPC82xx PowerQUICC II |
| Datenbusbreite | 32-bit |
| Core Speed | 200 MHz |
| Process Technology | 0.25 micron CMOS |
| Core Voltage | 1.8 V |
| I/O Voltage | 3.3 V |
| Number of Cores | 1 |
| Gehäuse / Bauform | 357-PBGA (25 x 25 mm) |
| Montageart | Surface Mount (BGA) |
| Betriebstemperatur | -40C to +105C |
| Integrated Peripheral | PCI bridge (32-bit/33 MHz), memory controller, UART, I2C |
| Memory Support | SDRAM, EDO DRAM, ROM, Flash |
| Packaging | Tray |
| RoHS-Status | RoHS compliant |
| Lead-Free Status | Lead Free |
MPC8241TVR200D 357-pbga (25 x 25 mm) Pinbelegungsleitfaden
Pinbelegung für MPC8241TVR200D (357-pbga (25 x 25 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MPC8241TVR200D.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MPC8241TVR200D ist geeignet für 6 Anwendungs: Embedded Router / Switch, Industrial Automation Controller, Single-Board Computer (SBC), Printer Imaging Controller, Storage Area Network (SAN) Adapter, Legacy Network Infrastructure.
Embedded Router / Switch
The MPC8241TVR200D's integrated PowerPC 603e core at 200 MHz, combined with the on-chip PCI bridge and memory controller, makes it well-suited for embedded router and switch applications. The PCI bridge enables direct connection to PCI-based network interface cards and switch fabrics, while the integrated memory controller eliminates an external northbridge, reducing board area and BOM. The 32-bit data path handles line-rate packet processing for Fast Ethernet and basic Gigabit uplinks, and the -40C to +105C industrial temperature range supports deployment in uncontrolled-environment telecom closets. Compared to a discrete MPU plus chipset design, the MPC8241 reduces power consumption by integrating five functions into one device.
Empfohlen
Industrial Automation Controller
For industrial automation controllers, the MPC8241TVR200D delivers the deterministic PowerPC architecture with on-board PCI expansion for I/O modules. The integrated UARTs and I2C interface connect to sensors, motor drives, and HMI panels without requiring an external Super I/O chip. Industrial -40C to +105C operation ensures reliable deployment on factory floors. The 357-PBGA package supports surface-mount assembly on standard 4-layer PCBs, and the 0.25 micron CMOS process keeps typical power dissipation around 1.5-2.0 W, simplifying thermal management in sealed enclosures.
Empfohlen
Single-Board Computer (SBC)
The MPC8241TVR200D's high level of integration - combining CPU, memory controller, PCI bridge, and basic peripherals on one die - enables compact single-board computers for embedded computing applications. System designers can build a full SBC around a single MPC8241 plus SDRAM, Flash, and a PCI Ethernet controller, achieving a small form factor suitable for medical carts, kiosks, and transportation signage. The 200 MHz core provides adequate throughput for Linux or VxWorks-based control software, while the PCI bridge allows add-in mezzanine cards for application-specific I/O.
Empfohlen
Printer Imaging Controller
In printer imaging controllers, the MPC8241TVR200D's PCI bridge enables high-bandwidth connection to image processing ASICs and scanner modules. The 32-bit PowerPC 603e core handles page-description language (PDL) rasterization at engine speeds, while the integrated memory controller provides direct SDRAM access for image buffers. The industrial temperature range suits printer engines that run hot. PowerQUICC II's mature firmware ecosystem (VxWorks, Linux, MontaVista) accelerates time-to-market for printer OEMs building on the MPC8241 reference platform.
Empfohlen
Storage Area Network (SAN) Adapter
The MPC8241TVR200D serves as the host processor for SAN adapters and RAID controllers, where its PCI bridge interfaces with Fibre Channel or SAS controller ASICs. The 200 MHz PowerPC 603e handles command queuing, caching algorithms, and SCSI/Fibre Channel protocol stacks, while the integrated memory controller buffers DMA transfers to system SDRAM. The reduced chip count (versus a discrete MPU plus northbridge design) lowers BOM cost for storage OEMs, and the industrial temperature rating supports deployment in enterprise server rooms.
Empfohlen
Legacy Network Infrastructure
For maintaining legacy network infrastructure such as older routers, base-station controllers, and access multiplexers, the MPC8241TVR200D provides long-term service continuity. The part's mature firmware ecosystem and stable PowerPC architecture ensure reliable operation in deployed equipment, and NXP's NRND status (with continued supply via Rochester Electronics) supports maintenance contracts. Engineers performing field repairs can order the MPC8241TVR200D as a direct replacement for failed units without redesigning the host board, preserving multi-million-dollar network investments.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MPC8241TVR200D – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MPC8241LVR200D | MPC8241TZQ200D |
|---|---|---|---|
| Package | 357-PBGA (25x25 mm) | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same |
| Brand | NXP Semiconductors (formerly Freescale) | NXP Semiconductors - same | NXP Semiconductors - same |
| Core Speed | 200 MHz | 200 MHz | 200 MHz |
| Core Voltage | 1.8 V | 1.5 V (lower voltage) | 1.8 V |
| Operating Temperature | -40C to +105C | -40C to +105C | -40C to +105C |
| Integrated PCI Bridge | Yes (32-bit / 33 MHz) | Yes (32-bit / 33 MHz) | Yes (32-bit / 33 MHz) |
| Memory Controller | SDRAM, EDO DRAM, ROM, Flash | SDRAM, EDO DRAM, ROM, Flash | SDRAM, EDO DRAM, ROM, Flash |
| Lifecycle Status | NRND (Not Recommended for New Designs) | NRND | NRND |
Wichtigste Unterscheidungsmerkmale
- Same-family drop-in with slightly lower core voltage (vs. MPC8241LVR200D)
- Alternative speed-grade suffix variant (vs. MPC8241TZQ200D)
- Single-chip integration vs discrete chipset (vs. Discrete MPU + northbridge design)
Designhinweise
The 357-PBGA package requires a 4-layer or 6-layer PCB with via-in-pad or dog-bone fanout for the BGA balls. Place decoupling capacitors (0.1 uF X7R minimum) within 2-3 mm of every power/ground ball pair. Use a continuous ground plane on layer 2 and a power plane on layer 3 for the 1.8 V core and 3.3 V I/O rails. Maintain 50 ohm controlled impedance for the SDRAM address/data bus and 90 ohm differential impedance for PCI bus signals.
Estimated: at 200 MHz core clock and 1.8 V core supply, the MPC8241TVR200D dissipates approximately 1.5-2.0 W under sustained CPU load (input values: Vcore=1.8V, Icore~1.0A, plus I/O activity). On the 25x25 mm PBGA, the theta_JA is approximately 15-20 C/W (with proper PCB thermal vias), resulting in a 30-40C junction temperature rise above ambient at room temperature. At the upper operating temperature limit (105C junction), derate CPU activity or add active cooling in sealed enclosures. Place thermal vias under the central BGA power balls to conduct heat to the internal ground plane.
Do not confuse the MPC8241 (PowerQUICC II, integrated host processor) with the earlier MPC860 (PowerQUICC I, communications processor) - they have different peripheral sets and PCI implementations. When migrating firmware between PowerQUICC generations, verify register definitions and endian configuration. The BGA has no leads for visual inspection; design for X-ray inspection or boundary-scan test access. Ensure JTAG TCK/TMS/TDO/TDI are accessible for in-system programming and debug.
Compliance-Informationen
RoHS compliant and lead-free per NXP product page and DigiKey listing. REACH compliance status not explicitly stated in verified data. Not AEC-Q100 qualified (industrial MPU, not automotive grade). Conflict minerals reporting status should be confirmed with NXP for latest declaration.
