MPC880VR133 - 133MHz PowerQUICC MPU 357-PBGA | NXP Semiconductors
Teilenummer: MPC880VR133 ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $32.75 | $327,50 |
| 100 | $27.2 | $2.720,00 |
| 500 | $22.8 | $11.400,00 |
| 1.000 | $19.45 | $19.450,00 |
MPC880VR133 Übersicht
What is a PowerQUICC microprocessor? PowerQUICC is NXP's product line of integrated communications processors built on Power Architecture technology. These devices sit in the taxonomy: PowerQUICC -> communications processor -> embedded microprocessor -> microcontroller/MCU -> semiconductor. PowerQUICC parts combine a high-performance CPU core with peripheral and communications subsystems, replacing what would otherwise require multiple discrete ICs in networking equipment.
Key features include 133 MHz core clock with 176 MIPS performance, a 32-bit Power Architecture (formerly PowerPC) core, integrated dual UART, dual SCC, dual SMC, SPI, I2C, parallel port (PCMCIA) interface, and a 10/100 Mbit Ethernet MAC. The device also integrates a memory controller supporting DRAM, SRAM, EPROM, and Flash, plus DMA channels and a programmable interrupt controller. The 357-PBGA package provides high pin density required for the wide system and peripheral bus.
The MPC880VR133 architecture isolates communications and peripheral handling from the main CPU via the CPM (Communications Processor Module), enabling efficient handling of multiple serial protocols without burdening the core. The MMU-based core supports full operating systems such as VxWorks, Linux, and Nucleus, making it suitable for networked embedded designs.
Typical applications include industrial networking routers and bridges, telecom edge equipment, set-top box controllers, ISDN terminal adapters, serial-to-Ethernet protocol converters, and embedded control boards requiring multiple serial channels. The integrated CPM is particularly valuable where multiple WAN/LAN protocols must run concurrently.
When designing with this part, ensure the 357-PBGA land pattern is matched by the PCB footprint, provide adequate decoupling near the supply pins, and respect the 0 to 95 C operating temperature window. The part is in End-of-Life status per NXP's product page, so designers should evaluate newer PowerQUICC or QorIQ successors for new designs.
This page synthesizes NXP datasheet specifications, distributor pricing, drop-in same-package alternatives, and practical design notes not found in any single manufacturer document.
Drop-in-Alternativen für MPC880VR133 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MPC880VR133 (gleiche Bauform und Footprint) – abweichend in Core Architecture, Package, RoHS Status, Operating Temperature, Manufacturer.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MPC885CVR133
✅ Drop-In✓ Auf Lager
$37.95 / Stück
Datenblatt ansehen →MPC880CVR133
✅ Drop-In✓ Auf Lager
$32.1 / Stück
Datenblatt ansehen →MPC885ZP133
✅ Drop-In✓ Auf Lager
$16.25 / Stück
Datenblatt ansehen →MPC880ZP133
✅ Drop-In✓ Auf Lager
$26.1 / Stück
Datenblatt ansehen →MPC880VR133 Grenzwerte & elektrische Eigenschaften
| Core Architecture | Power Architecture (PowerPC) 32-bit |
| Family | MPC8xx / PowerQUICC |
| Core Count | 1 |
| Maximum Core Frequency | 133 MHz |
| Performance | 176 MIPS |
| Betriebstemperatur | 0 C to +95 C |
| Gehäuse | 357-PBGA (25 x 25 mm) |
| Montageart | Surface Mount |
| Communications Processor Module (CPM) | Integrated |
| Memory Management Unit (MMU) | Yes |
| Ethernet MAC | 10/100 Mbit integrated |
| Serial Communication Controllers (SCC) | 2 |
| Serial Management Controllers (SMC) | 2 |
| PCMCIA / Parallel Port | Yes |
| I2C / SPI | Yes (integrated) |
MPC880VR133 357-pbga (25 x 25 mm) Pinbelegungsleitfaden
Pinbelegung für MPC880VR133 (357-pbga (25 x 25 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MPC880VR133.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MPC880VR133 ist geeignet für 6 Anwendungs: Industrial Networking Routers and Bridges, Telecom Edge Equipment and Terminal Adapters, Set-Top Box and Media Gateway Controllers, Serial-to-Ethernet Protocol Converters, Embedded Control Boards with Multiple Serial Channels, Legacy Networked Embedded Systems Maintenance.
Industrial Networking Routers and Bridges
The MPC880VR133's 133 MHz Power Architecture core and integrated CPM make it a strong fit for industrial routers and bridges. The CPM offloads WAN protocol processing from the CPU, freeing the 32-bit core to handle routing tables, encryption, and management tasks. The integrated 10/100 Ethernet MAC connects directly to an external PHY over MII, while dual SCC and SMC ports provide WAN serial connectivity. Engineers typically pair the device with external SDRAM and Flash, using the integrated memory controller to reduce BOM count. Compared with newer QorIQ parts, the MPC880VR133 suits legacy protocol stacks where stable firmware is more important than raw throughput.
Empfohlen
Telecom Edge Equipment and Terminal Adapters
For telecom edge equipment such as ISDN terminal adapters, xDSL bridges, and small PBX controllers, the MPC880VR133 supplies the integration density of a single-chip communications processor. The PowerQUICC architecture handles TDM, HDLC, and PPP protocols in firmware on the CPM, while the core runs signaling stacks. At 176 MIPS, the device can service multiple simultaneous voice channels in legacy designs. The 357-PBGA 25 x 25 mm package keeps board area compact, and the 0 to 95 C operating range covers indoor telecom enclosures. Designers should note the part is End of Life, so production planning should include a transition path to the MPC8306 family for new deployments.
Empfohlen
Set-Top Box and Media Gateway Controllers
Set-top box and residential gateway designs from the early-to-mid 2000s used the MPC880VR133 as the main controller, leveraging its Ethernet MAC for LAN connectivity, SCC/SMC ports for tuner interfaces, and PCMCIA support for conditional-access modules. The 133 MHz PowerPC core runs embedded Linux or a vendor RTOS for media streaming, while the CPM handles IR control, I2C peripherals, and serial smart-card interfaces. Although superseded by ARM-based SoCs in modern gateways, the MPC880VR133 remains supported in installed fleets. For greenfield designs, NXP recommends Layerscape LS1012A as a far more power-efficient successor.
Empfohlen
Serial-to-Ethernet Protocol Converters
The MPC880VR133 is well suited to industrial serial-to-Ethernet converters that aggregate RS-232, RS-485, or Modbus links onto an Ethernet backbone. The CPM's dual SCC and SMC channels handle up to four serial streams concurrently, while the integrated 10/100 MAC provides the network side. At 176 MIPS the core can run Modbus TCP, DNP3, or proprietary protocols alongside the network stack. Engineers typically implement the firmware on VxWorks or embedded Linux with the NXP CPM driver. The MMU enables full OS support, simplifying memory protection in safety-relevant converter applications such as substation automation.
Empfohlen
Embedded Control Boards with Multiple Serial Channels
Industrial single-board computers built on the MPC880VR133 use its integrated peripheral set to drive multiple serial interfaces without external UART chips. Two SCC channels, two SMC channels, an SPI controller, and an I2C bus together provide six or more serial endpoints, while the 32-bit Power Architecture core runs control logic. The memory controller interfaces directly to SDRAM, and the parallel port supports PCMCIA cards for removable storage. The 0 to 95 C commercial operating range suits most indoor and enclosed outdoor enclosures. For new boards, designers should evaluate whether the modern MPC8306 family offers comparable integration at lower power.
Empfohlen
Legacy Networked Embedded Systems Maintenance
Beyond greenfield designs, the MPC880VR133's primary use in 2026 is maintaining long-lifecycle networked embedded systems deployed in the late 1990s and 2000s. Industrial, medical, and aerospace customers continue to source this part to keep fielded equipment operational until end of service life. NXP's Discontinuance notice identifies successors, but for installed bases with certified firmware, drop-in same-package alternatives like the MPC885CVR133 or MPC880ZP133 allow field replacement without re-certification. Engineers should stock traceable factory-fresh components and verify date codes for mission-critical maintenance programs.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MPC880VR133 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MPC885CVR133 | MPC880CVR133 | MPC885ZP133 |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 357-PBGA (25x25) | 357-PBGA (25x25) | 357-PBGA (25x25) | 357-PBGA (25x25) |
| Core Frequency | 133 MHz | 133 MHz | 133 MHz | 133 MHz |
| Performance | 176 MIPS | 176 MIPS | 176 MIPS | 176 MIPS |
| Core Architecture | Power Architecture 32-bit | Power Architecture 32-bit | Power Architecture 32-bit | Power Architecture 32-bit |
| Ethernet MAC | 10/100 integrated | 10/100 integrated | 10/100 integrated | 10/100 integrated |
| Additional Peripherals | Baseline CPM set | Adds USB, extra timers, extended CPM | Industrial temperature variant | Superset peripheral set |
| Operating Temperature | 0 C to +95 C | 0 C to +95 C | -40 C to +95 C (typical industrial grade) | 0 C to +95 C |
Wichtigste Unterscheidungsmerkmale
- Same-package superset upgrade (vs. MPC885CVR133)
- Industrial temperature variant (vs. MPC880CVR133)
- Drop-in Z-package option (vs. MPC880ZP133)
Designhinweise
The MPC880VR133 is specified for 0 C to +95 C operation. While the 357-PBGA package exposes a thermal pad, designers should still provide adequate copper area on inner layers for heat spreading. At 133 MHz with full CPM activity, junction temperature can approach limits in sealed enclosures; adding thermal vias under the BGA is recommended for production boards.
Place decoupling capacitors as close as possible to each BGA supply pin pair, using 0.1 uF ceramics plus bulk 10 uF or larger tantalum/polymer caps near the package perimeter. Match trace lengths between the SDRAM clock, address, and data buses to the guidelines in the MPC885 hardware specification. Keep PHY MII traces under 100 mm with impedance-controlled routing for signal integrity.
Since the MPC880VR133 is End of Life, do not assume long-term availability. Plan a migration path to MPC8306 or QorIQ successors and verify date codes on every shipment. Use only authorized distributors or franchised excess stockists to avoid counterfeit risk. Always cross-check the lot code against NXP's traceability records when sourcing from independent brokers.
Compliance-Informationen
Part is End of Life per NXP. Compliance data not extracted from provided web snippets - see NXP product page for definitive RoHS/REACH statements.
