MPC8272CZQTIEA557 - PowerQUICC II MPU 400MHz PBGA516 | NXP
Teilenummer: MPC8272CZQTIEA557 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $85 | $85,00 |
| 10 | $78.5 | $785,00 |
| 100 | $72 | $7.200,00 |
| 500 | $65.5 | $32.750,00 |
| 1.000 | $60 | $60.000,00 |
MPC8272CZQTIEA557 Übersicht
A microprocessor (MPU) is an integrated circuit that contains the central processing unit of a computer system on a single chip. In modern embedded hierarchies, an MPU is a superset of a microcontroller (MCU) — MPUs typically lack on-chip non-volatile program memory but offer higher clock frequencies, MMU/memory management, external bus interfaces, and richer peripheral integration. The MPC8272 sits at the MPU tier of the embedded taxonomy: PowerQUICC II -> PowerQUICC family -> communications processors -> MPUs -> microcontrollers and processors -> semiconductors.
Key differentiating features of the MPC8272 include its dual PowerQUICC communications engine, support for 10/100 Mbps Ethernet MACs, up to four serial communications controllers, and a 60x-compatible 32-bit external bus. The integrated system interface supports SDRAM, Flash, and ROM peripherals directly. The internal core voltage is 1.5 V with 3.3 V I/O, and the device is fabricated on a 0.13 µm HiP7 process.
Architecturally, the MPC8272C family pairs a high-performance e500 or G2_LE PowerPC core with the CPM (Communications Processor Module), offloading DMA, HDLC/UART/SCC, and ATM/POS-PHY processing from the core. This split-architecture model allows the device to sustain high-throughput networking traffic while keeping MIPS available for the host operating system, which typically runs an embedded RTOS or a custom control loop.
Typical applications include wired routers and switches, DSLAM line cards, industrial control and automation gateways, telecom base-station controllers, and defense/aerospace embedded computing modules that require deterministic communications alongside a 32-bit general-purpose control plane.
When designing with the MPC8272, observe thermal and power guidelines: junction-to-ambient resistance is package-dependent and the part is rated for industrial and extended temperature grades. Use proper BGA PCB layout with via-in-pad or dogbone fan-out, matched-impedance traces for the external memory bus, and adequate decoupling.
This page synthesizes authorized distributor stock indicators, drop-in and pin-compatible alternatives, and design notes compiled from public datasheet excerpts and the cross-reference web results — content not present on the manufacturer datasheet alone.
Drop-in-Alternativen für MPC8272CZQTIEA557 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MPC8272CZQTIEA557 (gleiche Bauform und Footprint) – abweichend in Core Architecture, Mounting Type, Package.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MPC8272CVRPIEA
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MPC8272CZQTIEA
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MPC8280CZQTIEA
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MPC8270CZQTIEA
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MPC8271CZQTIEA
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$44.1 / Stück
Datenblatt ansehen →MPC8272CZQTIEA557 Grenzwerte & elektrische Eigenschaften
| Processor Family | PowerQUICC II (MPC82xx) |
| Processor Type | MPC82xx 32-bit Power Architecture |
| Core Architecture | PowerPC G2_LE (Power Architecture, 32-bit) |
| Core Clock Speed | 400 MHz |
| Core Voltage | 1.5 V |
| I/O Voltage | 3.3 V |
| USB Interface | USB 2.0 (1 port) |
| Ethernet | 10/100 Mbps MAC (Fast Ethernet) |
| Serial Communications | FCC, MCC, SCC, SMC serial controllers (per CPM) |
| External Bus | 60x-compatible 32-bit bus, SDRAM/Flash/ROM interface |
| L1 Cache | 16 KB instruction / 16 KB data (per family spec) |
| Gehäuse | 516-BBGA (PBGA516) |
| Montageart | Surface Mount (BGA) |
| Process Technology | 0.13 µm HiP7 |
| Lead Status | Contains Lead (non-lead-free) |
| RoHS-Status | RoHS status per manufacturer — see compliance_info |
| Betriebstemperatur | Industrial / Extended (grade-specific) |
MPC8272CZQTIEA557 516-bbga (pbga516) Pinbelegungsleitfaden
Pinbelegung für MPC8272CZQTIEA557 (516-bbga (pbga516)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MPC8272CZQTIEA557.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MPC8272CZQTIEA557 ist geeignet für 6 Anwendungs: Wired Router and Switch Control Plane, DSLAM Line Card Controller, Industrial Control and Automation Gateway, Telecom Base Station Controller, Defense and Aerospace Embedded Computing, Embedded Network Appliance Platform.
Wired Router and Switch Control Plane
The MPC8272CZQTIEA557's PowerPC G2_LE core at 400 MHz plus the on-chip Communications Processor Module (CPM) make it ideal for routing and switching control-plane tasks. The CPM offloads HDLC, ATM, and Ethernet MAC processing, freeing the core to run a routing stack. Compared with discrete CPU + Ethernet MAC designs, the integrated solution reduces board area, BOM cost, and design risk. Engineers typically pair the MPC8272 with external SDRAM and a PHY transceiver; the device supports 10/100 Mbps MACs natively.
Empfohlen
DSLAM Line Card Controller
DSLAM line cards need deterministic multi-channel serial handling for ATM and HDLC traffic alongside a host control plane. The MPC8272CZQTIEA557's CPM provides multiple FCCs and SCCs that segment ATM cells and forward them to the switching fabric, while the 400 MHz core runs the management interface. Designers gain a proven, field-deployed platform with mature Linux and VxWorks BSPs. The 3.3 V I/O compatibility lets the MPC8272 sit directly on standard telecom backplanes without level shifters.
Empfohlen
Industrial Control and Automation Gateway
Industrial gateways aggregate fieldbus traffic (Profibus, Modbus, CAN) and forward it to Ethernet. The MPC8272CZQTIEA557's SCCs and SMCs provide multi-protocol serial interfaces, while the Ethernet MAC uplinks to factory networks. Its industrial temperature grade and mature software ecosystem let integrators deploy long-life products. Compared with newer ARM Cortex-A5 gateways, the PowerQUICC II is preferred where deterministic serial latency and long-term supply continuity matter more than raw compute.
Empfohlen
Telecom Base Station Controller
Base-station controllers require deterministic multi-channel TDM/E1/T1 handling with a high-reliability control plane. The MPC8272CZQTIEA557's CPM supports TDM, HDLC, and ATM in hardware, while the 400 MHz core runs the management and signaling stack. The PBGA516 package dissipates heat efficiently enough for fanless indoor base-station enclosures. Engineers value the long product lifecycle NXP/Freescale historically supported for telecom programs.
Empfohlen
Defense and Aerospace Embedded Computing
Defense programs value the PowerQUICC II family for its deterministic behavior, mature BSP ecosystem, and the ability to operate reliably in extended-grade temperature ranges. The MPC8272CZQTIEA557 integrates Ethernet, multi-channel serial, and a 32-bit host processor on a single BGA, reducing SWaP-C on ruggedized boards. Defense integrators can run VxWorks, INTEGRITY, or LynxOS-178 and reuse IP across programs because the architecture has been stable for decades.
Empfohlen
Embedded Network Appliance Platform
Small-to-medium embedded network appliances (firewalls, VPN concentrators, edge routers) benefit from the MPC8272CZQTIEA557's integrated Ethernet MAC and serial controllers. The 400 MHz core is sufficient for stateful firewall tables up to several hundred thousand sessions, while the CPM handles WAN-side encapsulation. The part runs Linux with mainline kernel support, allowing OEMs to deploy rapidly without proprietary toolchains. PBGA516 supports miniaturized fanless designs.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MPC8272CZQTIEA557 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MPC8272CVRPIEA | MPC8272CZQTIEA | MPC8280CZQTIEA | MPC8270CZQTIEA | MPC8271CZQTIEA |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | PBGA516 (516-BBGA) | PBGA516 - same | PBGA516 - same | PBGA516 - same | PBGA516 - same | PBGA516 - same |
| Core Speed | 400 MHz | 300-350 MHz (VR grade) | 400 MHz | 450 MHz | 266-300 MHz | 266-300 MHz |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| I/O Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Ethernet MACs | 10/100 Mbps (two FE MACs) | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps (three FCCs) | 10/100 Mbps (single) | 10/100 Mbps (single) |
| CPM / FCC Count | 2x FCC + multiple SCC/SMC | 2x FCC | 2x FCC | 3x FCC | 1x FCC | 1x FCC |
| USB | USB 2.0 (1 port) | USB 2.0 | USB 2.0 | USB 2.0 | USB 2.0 | USB 2.0 |
| Process Technology | 0.13 µm HiP7 | 0.13 µm HiP7 | 0.13 µm HiP7 | 0.13 µm HiP7 | 0.13 µm HiP7 | 0.13 µm HiP7 |
Wichtigste Unterscheidungsmerkmale
- Integrated Communications Processor Module (CPM) (vs. MPC8271CZQTIEA (single FCC))
- Higher core frequency vs older VR speed grade (vs. MPC8272CVRPIEA)
- Mature Linux and VxWorks BSP ecosystem (vs. MPC8280CZQTIEA (newer but higher cost))
- Pin-to-pin scalable with MPC8280 family (vs. MPC8280CZQTIEA)
Designhinweise
The MPC8272CZQTIEA557 in PBGA516 has a junction-to-ambient thermal resistance in the 15-25 C/W range with proper PCB layout. For reliable industrial operation, provide at least four thermal vias under the die flag and connect to internal copper planes. In fanless telecom enclosures, derate output clock frequencies or add a heatsink if junction-to-ambient exceeds 70 °C in worst-case ambient.
Use microvia or via-in-pad technology for the PBGA516 to escape traces reliably. Match impedance (50 Ω single-ended, 100 Ω differential) on the 60x external bus and Ethernet signals. Place SDRAM as close as possible to the data bus pins to minimize stub length and meet the published AC timings. Bulk-decouple every supply pin with 0.1 µF X7R plus a 10 µF tantalum.
Do not assume pin compatibility between the PowerQUICC II (MPC8272) and the PowerPC 750FX (e.g. 25PPC750FX-FB25F3T) — the latter is a different pinout and lacks the CPM. Also remember the standard MPC8272CZQTIEA557 is NOT lead-free per the datasheet; select the appropriate Pb-free ordering code if RoHS compliance is required for the end product.
The 60x external memory bus runs at 66-100 MHz on the MPC8272. Use IBIS-AMI simulation to validate SI on SDRAM traces. Series-stamp 33 Ω resistors near the driver help dampen reflections. Clocks must be routed on inner layers with continuous reference planes; avoid crossing plane splits.
Compliance-Informationen
Datasheet explicitly indicates non-lead-free for the standard MPC8272CZQTIEA557 ordering code. RoHS compliance requires the dedicated Pb-free ordering variant. REACH and conflict-mineral status per NXP product stewardship disclosures.
