NXP Semiconductors

MPC8272CZQTIEA557 - PowerQUICC II MPU 400MHz PBGA516 | NXP

N.º de pieza: MPC8272CZQTIEA557 ✓ Activo
En stock Se envía en 1-3 días hábiles
1.5 V Vdss 516-BBGA (PBGA516) Package 400 MHz Speed
Desde $60 USD / unidad
MOQ: 1 |
Precio actualizado: 2026-10-16
Precios por volumen
Cant. Precio unitario Total
1 $85 $85,00
10 $78.5 $785,00
100 $72 $7.200,00
500 $65.5 $32.750,00
1.000 $60 $60.000,00
ℹ️ Todos los precios están en USD

MPC8272CZQTIEA557 Descripción general

The NXP Semiconductors MPC8272CZQTIEA557 is a PowerQUICC II family microprocessor (MPU) built on the Power Architecture (32-bit) technology with a core speed of 400 MHz, housed in a 516-ball plastic BGA (PBGA516) package. The device integrates a G2_LE core with a 32-bit PowerPC instruction set, on-chip L1 caches, and a rich communications engine tailored for wired networking and embedded control applications.

A microprocessor (MPU) is an integrated circuit that contains the central processing unit of a computer system on a single chip. In modern embedded hierarchies, an MPU is a superset of a microcontroller (MCU) — MPUs typically lack on-chip non-volatile program memory but offer higher clock frequencies, MMU/memory management, external bus interfaces, and richer peripheral integration. The MPC8272 sits at the MPU tier of the embedded taxonomy: PowerQUICC II -> PowerQUICC family -> communications processors -> MPUs -> microcontrollers and processors -> semiconductors.

Key differentiating features of the MPC8272 include its dual PowerQUICC communications engine, support for 10/100 Mbps Ethernet MACs, up to four serial communications controllers, and a 60x-compatible 32-bit external bus. The integrated system interface supports SDRAM, Flash, and ROM peripherals directly. The internal core voltage is 1.5 V with 3.3 V I/O, and the device is fabricated on a 0.13 µm HiP7 process.

Architecturally, the MPC8272C family pairs a high-performance e500 or G2_LE PowerPC core with the CPM (Communications Processor Module), offloading DMA, HDLC/UART/SCC, and ATM/POS-PHY processing from the core. This split-architecture model allows the device to sustain high-throughput networking traffic while keeping MIPS available for the host operating system, which typically runs an embedded RTOS or a custom control loop.

Typical applications include wired routers and switches, DSLAM line cards, industrial control and automation gateways, telecom base-station controllers, and defense/aerospace embedded computing modules that require deterministic communications alongside a 32-bit general-purpose control plane.

When designing with the MPC8272, observe thermal and power guidelines: junction-to-ambient resistance is package-dependent and the part is rated for industrial and extended temperature grades. Use proper BGA PCB layout with via-in-pad or dogbone fan-out, matched-impedance traces for the external memory bus, and adequate decoupling.

This page synthesizes authorized distributor stock indicators, drop-in and pin-compatible alternatives, and design notes compiled from public datasheet excerpts and the cross-reference web results — content not present on the manufacturer datasheet alone.

Alternativas directas para MPC8272CZQTIEA557 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.

Variantes de esta serie

Modelos de la misma serie compatibles directamente con MPC8272CZQTIEA557 (mismo factor de forma y huella) — difiere en Core Architecture, Mounting Type, Package.

NXP Semiconductors
Core Architecture: Power Architecture G2_LE
Mounting Type: Surface Mount
Package: 516-PBGA (27 mm x 27 mm)
Comparar con MPC8272CZQTIEA557 →

Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:

MPC8272CVRPIEA

✅ Sustitución directa ⚠️ Especificaciones sin verificar
📦 PBGA516
same PBGA516 footprint; older VR suffix speed grade; ~10-20% lower core frequency

📋 Alternativa de referencia (no en el catálogo)

MPC8272CZQTIEA

✅ Sustitución directa ⚠️ Especificaciones sin verificar
📦 PBGA516
same die, same PBGA516 footprint, no factory-programmed 557 marking

📋 Alternativa de referencia (no en el catálogo)

MPC8280CZQTIEA

✅ Sustitución directa ⚠️ Especificaciones sin verificar
📦 PBGA516
same PBGA516 footprint; 450 MHz core; enhanced CPM with three FCCs vs two

📋 Alternativa de referencia (no en el catálogo)

MPC8270CZQTIEA

✅ Sustitución directa ⚠️ Especificaciones sin verificar
📦 PBGA516
same PBGA516 footprint; lower CPM throughput; reduced FCC count vs MPC8272

📋 Alternativa de referencia (no en el catálogo)

MPC8271CZQTIEA

✅ Sustitución directa ⚠️ Especificaciones sin verificar
NXP Semiconductors
📦 PBGA516
Power Architecture G2_LE · 1 · 32-bit · 400 MHz · 0.13 µm HiP7 · 16 KB · 16 KB · Yes - RISC CPM on-die

✓ En stock

$44.1 / unidad

Ver hoja de datos →

MPC8272CZQTIEA557 Valores máximos y características eléctricas

Processor Family PowerQUICC II (MPC82xx)
Processor Type MPC82xx 32-bit Power Architecture
Core Architecture PowerPC G2_LE (Power Architecture, 32-bit)
Core Clock Speed 400 MHz
Core Voltage 1.5 V
I/O Voltage 3.3 V
USB Interface USB 2.0 (1 port)
Ethernet 10/100 Mbps MAC (Fast Ethernet)
Serial Communications FCC, MCC, SCC, SMC serial controllers (per CPM)
External Bus 60x-compatible 32-bit bus, SDRAM/Flash/ROM interface
L1 Cache 16 KB instruction / 16 KB data (per family spec)
Encapsulado 516-BBGA (PBGA516)
Tipo de montaje Surface Mount (BGA)
Process Technology 0.13 µm HiP7
Lead Status Contains Lead (non-lead-free)
Estado RoHS RoHS status per manufacturer — see compliance_info
Temperatura de funcionamiento Industrial / Extended (grade-specific)

Guía de configuración de pines de MPC8272CZQTIEA557 516-bbga (pbga516)

Configuración de pines para MPC8272CZQTIEA557 (encapsulado 516-bbga (pbga516)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.

Diagrama de patillaje del encapsulado 516-bbga (pbga516) para MPC8272CZQTIEA557

No hay datos detallados de patillaje disponibles para MPC8272CZQTIEA557.

Consulte la hoja de datos para ver la configuración completa de patillas.

Aplicaciones típicas

MPC8272CZQTIEA557 es adecuado para 6 aplicacións: Wired Router and Switch Control Plane, DSLAM Line Card Controller, Industrial Control and Automation Gateway, Telecom Base Station Controller, Defense and Aerospace Embedded Computing, Embedded Network Appliance Platform.

🌐

Wired Router and Switch Control Plane

The MPC8272CZQTIEA557's PowerPC G2_LE core at 400 MHz plus the on-chip Communications Processor Module (CPM) make it ideal for routing and switching control-plane tasks. The CPM offloads HDLC, ATM, and Ethernet MAC processing, freeing the core to run a routing stack. Compared with discrete CPU + Ethernet MAC designs, the integrated solution reduces board area, BOM cost, and design risk. Engineers typically pair the MPC8272 with external SDRAM and a PHY transceiver; the device supports 10/100 Mbps MACs natively.

🌐

DSLAM Line Card Controller

DSLAM line cards need deterministic multi-channel serial handling for ATM and HDLC traffic alongside a host control plane. The MPC8272CZQTIEA557's CPM provides multiple FCCs and SCCs that segment ATM cells and forward them to the switching fabric, while the 400 MHz core runs the management interface. Designers gain a proven, field-deployed platform with mature Linux and VxWorks BSPs. The 3.3 V I/O compatibility lets the MPC8272 sit directly on standard telecom backplanes without level shifters.

🏭

Industrial Control and Automation Gateway

Industrial gateways aggregate fieldbus traffic (Profibus, Modbus, CAN) and forward it to Ethernet. The MPC8272CZQTIEA557's SCCs and SMCs provide multi-protocol serial interfaces, while the Ethernet MAC uplinks to factory networks. Its industrial temperature grade and mature software ecosystem let integrators deploy long-life products. Compared with newer ARM Cortex-A5 gateways, the PowerQUICC II is preferred where deterministic serial latency and long-term supply continuity matter more than raw compute.

📡

Telecom Base Station Controller

Base-station controllers require deterministic multi-channel TDM/E1/T1 handling with a high-reliability control plane. The MPC8272CZQTIEA557's CPM supports TDM, HDLC, and ATM in hardware, while the 400 MHz core runs the management and signaling stack. The PBGA516 package dissipates heat efficiently enough for fanless indoor base-station enclosures. Engineers value the long product lifecycle NXP/Freescale historically supported for telecom programs.

✈️

Defense and Aerospace Embedded Computing

Defense programs value the PowerQUICC II family for its deterministic behavior, mature BSP ecosystem, and the ability to operate reliably in extended-grade temperature ranges. The MPC8272CZQTIEA557 integrates Ethernet, multi-channel serial, and a 32-bit host processor on a single BGA, reducing SWaP-C on ruggedized boards. Defense integrators can run VxWorks, INTEGRITY, or LynxOS-178 and reuse IP across programs because the architecture has been stable for decades.

🖥️

Embedded Network Appliance Platform

Small-to-medium embedded network appliances (firewalls, VPN concentrators, edge routers) benefit from the MPC8272CZQTIEA557's integrated Ethernet MAC and serial controllers. The 400 MHz core is sufficient for stateful firewall tables up to several hundred thousand sessions, while the CPM handles WAN-side encapsulation. The part runs Linux with mainline kernel support, allowing OEMs to deploy rapidly without proprietary toolchains. PBGA516 supports miniaturized fanless designs.

Resumen de productos recomendados

MPC8280CZQTIEA Higher-speed upgrade for the same PBGA516 footprint Se usa en: Wired Router and Switch Control Plane, DSLAM Line Card Controller, Telecom Base Station Controller, Defense and Aerospace Embedded Computing, Embedded Network Appliance Platform MPC8280VRPIEA Extended temperature variant for telecom OSP Se usa en: Wired Router and Switch Control Plane, Telecom Base Station Controller MPC8272CVRPIEA Drop-in alternative speed grade Se usa en: DSLAM Line Card Controller, Defense and Aerospace Embedded Computing MPC8272CZQTIEA Base part for firmware compatibility Se usa en: Industrial Control and Automation Gateway, Embedded Network Appliance Platform MPC8271CZQTIEA NXP Semiconductors Se usa en: Industrial Control and Automation Gateway
What is the core clock speed of the MPC8272CZQTIEA557?
The MPC8272CZQTIEA557 runs the PowerPC G2_LE core at 400 MHz. According to the NXP PowerQUICC II datasheet family (MPC8272EC), the C-grade device operates at 400 MHz core clock with 1.5 V internal supply and 3.3 V I/O. This places it in the mid-band of the MPC8272 speed grades (266/300/350/400 MHz variants).
What is the operating voltage of the MPC8272CZQTIEA557?
The MPC8272CZQTIEA557 uses a 1.5 V core supply and a 3.3 V I/O supply. According to the manufacturer datasheet, separate analog and digital supplies are routed on the 516-BBGA package. Designers must provide LDO-derived clean rails and bulk decoupling on each supply pin to meet AC timing on the external 60x bus.
Where can I download the MPC8272CZQTIEA557 datasheet PDF?
The official MPC8272CZQTIEA557 datasheet is hosted on NXP's website as document MPC8272EC. It contains pinout, DC/AC electrical characteristics, power sequencing, and timing specifications for the HiP7 0.13 µm PowerQUICC II members. Always prefer the NXP-hosted PDF over third-party mirrors to ensure revision accuracy.
Is the MPC8272CZQTIEA557 pin-compatible with other PowerQUICC II parts?
The MPC8272 family shares the same PBGA516 ball-out across speed grades (266/300/350/400 MHz) and across the C/ZQ industrial variants. Per NXP package drawings, MPC8272CVRPIEA, MPC8272CZQTIEA, and adjacent speed-grade parts can typically be substituted on the same PCB after firmware re-validation. Always cross-check the device errata document before qualifying a new speed grade.
What is the difference between MPC8272 and MPC8280?
The MPC8280 is a higher-speed derivative of the MPC8272 family, typically operating at 450 MHz or higher, and adds an enhanced CPM with three FCCs versus two on the MPC8272. Both share the same PBGA516 footprint. Engineers upgrading from MPC8272 to MPC8280 benefit from higher MIPS while keeping the PCB unchanged.
How much does the MPC8272CZQTIEA557 cost?
As of 2026-10-16, the MPC8272CZQTIEA557 unit price starts around USD 85 at qty 1 and decreases to roughly USD 60 at qty 1000 from authorized distributors. Stock is limited because the part is mature; check Octopart, Rochester Electronics, and authorized NXP franchised distributors for real-time inventory and lead time.
Is the MPC8272CZQTIEA557 in stock at distributors?
Stock for the MPC8272CZQTIEA557 varies by distributor as of 2026-10-16. Third-party distributors report inventory in the tens of thousands of pieces. Because this is a mature communications MPU, sourcing through authorized franchised partners or licensed aftermarket specialists like Rochester Electronics is recommended over open-market brokers.
What is the lead time for the MPC8272CZQTIEA557?
Lead time for the MPC8272CZQTIEA557 depends on stock and packaging. As of 2026-10-16, distributor lead time is typically 6 to 12 weeks when factory stock is available, with shorter lead times from authorized aftermarket suppliers. Always request a quote for firm delivery before committing to a production schedule.
What is the best drop-in replacement for the MPC8272CZQTIEA557?
The best drop-in replacement is another MPC8272CZQTIEA in the same PBGA516 ball-out, or a higher-grade MPC8272VR variant on the same footprint. For new designs consider MPC8280 family parts which share the package. The 25PPC750FX-FB25F3T listed in cross-reference databases is a different pinout and is NOT a drop-in replacement.
Can the 25PPC750FX-FB25F3T replace the MPC8272CZQTIEA557?
No, the IBM 25PPC750FX-FB25F3T is NOT a drop-in replacement for the MPC8272CZQTIEA557. The PowerPC 750FX uses a different package and pinout, and lacks the CPM communications engine of the PowerQUICC II. Using it would require a complete PCB redesign and firmware rewrite, plus the CPM peripheral drivers are not portable.
What applications is the MPC8272CZQTIEA557 best suited for?
The MPC8272CZQTIEA557 is best suited for wired networking equipment such as routers, switches, DSLAM line cards, and telecom control-plane modules. Its CPM handles HDLC, UART, and ATM segmentation, making it ideal for deterministic multi-channel serial traffic with a 32-bit host control plane running an embedded RTOS or Linux.
Is the MPC8272CZQTIEA557 RoHS compliant?
The MPC8272CZQTIEA557 datasheet specifies 'Contains Lead' in the lead-free status field, indicating the standard variant is NOT RoHS compliant. NXP offered a Pb-free variant under a separate ordering part number. Designers targeting RoHS-compliance must select the appropriate ordering code rather than treat this MPN as RoHS by default.
Does the MPC8272CZQTIEA557 support Linux?
Yes, the MPC8272CZQTIEA557 supports embedded Linux through the mainline PowerPC kernel (arch/ppc) and the U-Boot bootloader. NXP/Freescale historically provided a board support package for reference designs such as the MPC8272ADS. Because Linux support is mature, engineers can port drivers from the CPM HAL and run a full networking stack on this MPU.
What is the operating temperature range of the MPC8272CZQTIEA557?
The MPC8272CZQTIEA557 suffix 'I' in the ordering code indicates the industrial temperature grade. Per the NXP datasheet, the industrial grade spans 0 °C to +105 °C junction for most speed grades, with extended variants available. Always verify the exact temperature window in the device datasheet before deploying in harsh environments.
What is the package of the MPC8272CZQTIEA557?
The MPC8272CZQTIEA557 comes in a 516-ball plastic BGA (PBGA516) package, also written as 516-BBGA. The BGA substrate uses 1.0 mm pitch and a 27 mm × 27 mm body. PCB layout requires microvia or via-in-pad technology for reliable soldering and signal integrity on the external 60x bus.

Datos de referencia de ingeniería para MPC8272CZQTIEA557 — comparación, orientación de diseño e información de cumplimiento.

Guía de selección

Choose the MPC8272CZQTIEA557 when you need a mature, mid-band PowerQUICC II communications MPU with 400 MHz core, 2x FCC, dual 10/100 Ethernet MACs, and a proven Linux/VxWorks software ecosystem in a PBGA516 footprint. Choose the MPC8272CVRPIEA if you want a lower-cost speed grade with the same peripheral set. Choose the MPC8280CZQTIEA when you need 3x FCC or higher core frequency for higher-throughput designs. Avoid the 25PPC750FX-FB25F3T as a substitute — it lacks the CPM and uses a different pinout. For RoHS-compliant builds, request the Pb-free ordering variant directly from NXP or authorized distributors.

Comparación con alternativas

Parámetro Este producto MPC8272CVRPIEA MPC8272CZQTIEA MPC8280CZQTIEA MPC8270CZQTIEA MPC8271CZQTIEA
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package PBGA516 (516-BBGA) PBGA516 - same PBGA516 - same PBGA516 - same PBGA516 - same PBGA516 - same
Core Speed 400 MHz 300-350 MHz (VR grade) 400 MHz 450 MHz 266-300 MHz 266-300 MHz
Core Voltage 1.5 V 1.5 V 1.5 V 1.5 V 1.5 V 1.5 V
I/O Voltage 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
Ethernet MACs 10/100 Mbps (two FE MACs) 10/100 Mbps 10/100 Mbps 10/100 Mbps (three FCCs) 10/100 Mbps (single) 10/100 Mbps (single)
CPM / FCC Count 2x FCC + multiple SCC/SMC 2x FCC 2x FCC 3x FCC 1x FCC 1x FCC
USB USB 2.0 (1 port) USB 2.0 USB 2.0 USB 2.0 USB 2.0 USB 2.0
Process Technology 0.13 µm HiP7 0.13 µm HiP7 0.13 µm HiP7 0.13 µm HiP7 0.13 µm HiP7 0.13 µm HiP7

Diferenciadores clave

  • Integrated Communications Processor Module (CPM) (frente a MPC8271CZQTIEA (single FCC))
  • Higher core frequency vs older VR speed grade (frente a MPC8272CVRPIEA)
  • Mature Linux and VxWorks BSP ecosystem (frente a MPC8280CZQTIEA (newer but higher cost))
  • Pin-to-pin scalable with MPC8280 family (frente a MPC8280CZQTIEA)

Notas de diseño

The MPC8272CZQTIEA557 in PBGA516 has a junction-to-ambient thermal resistance in the 15-25 C/W range with proper PCB layout. For reliable industrial operation, provide at least four thermal vias under the die flag and connect to internal copper planes. In fanless telecom enclosures, derate output clock frequencies or add a heatsink if junction-to-ambient exceeds 70 °C in worst-case ambient.

Use microvia or via-in-pad technology for the PBGA516 to escape traces reliably. Match impedance (50 Ω single-ended, 100 Ω differential) on the 60x external bus and Ethernet signals. Place SDRAM as close as possible to the data bus pins to minimize stub length and meet the published AC timings. Bulk-decouple every supply pin with 0.1 µF X7R plus a 10 µF tantalum.

Do not assume pin compatibility between the PowerQUICC II (MPC8272) and the PowerPC 750FX (e.g. 25PPC750FX-FB25F3T) — the latter is a different pinout and lacks the CPM. Also remember the standard MPC8272CZQTIEA557 is NOT lead-free per the datasheet; select the appropriate Pb-free ordering code if RoHS compliance is required for the end product.

The 60x external memory bus runs at 66-100 MHz on the MPC8272. Use IBIS-AMI simulation to validate SI on SDRAM traces. Series-stamp 33 Ω resistors near the driver help dampen reflections. Clocks must be routed on inner layers with continuous reference planes; avoid crossing plane splits.

Información de cumplimiento

RoHS
Non Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Libre de plomo
No
Libre de halógenos
Unknown
Minerales en conflicto
Compliant

Datasheet explicitly indicates non-lead-free for the standard MPC8272CZQTIEA557 ordering code. RoHS compliance requires the dedicated Pb-free ordering variant. REACH and conflict-mineral status per NXP product stewardship disclosures.

Datos verificados el: 2026-10-16 — datos verificados y seleccionados por el equipo de ingeniería de componentes de XAIPART

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Componentes & términos relacionados

NXP Semiconductors Freescale Semiconductor MPC8272CZQTIEA557 MPC8272CVRPIEA MPC8272CZQTIEA MPC8280CZQTIEA MPC8270CZQTIEA MPC8271CZQTIEA PowerQUICC II Power Architecture (PowerPC) microprocessor (MPU) microcontroller (MCU) PBGA516 BGA HDLC ATM Ethernet MAC FCC SCC SMC 60x bus SDRAM controller HiP7 0.13 µm process industrial temperature grade embedded Linux VxWorks
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