MPC8313VRAGDC - PowerQUICC II Pro MPU 400MHz | NXP
Teilenummer: MPC8313VRAGDC ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $48.11 | $48,11 |
| 10 | $44.5 | $445,00 |
| 100 | $39.2 | $3.920,00 |
| 500 | $35.85 | $17.925,00 |
| 1.000 | $32.4 | $32.400,00 |
MPC8313VRAGDC Übersicht
A PowerQUICC II Pro SoC belongs to the broader family of communications processors that combine a general-purpose CPU with integrated peripherals for networking and storage. Within the taxonomy, the device sits at the intersection of microprocessor, system-on-chip (SoC), and communications processor - bridging MPU and ASIC-style integration. It was specifically designed to address demand for higher CPU performance, faster I/O, and lower system cost than earlier PowerQUICC generations, while remaining software-compatible with the e300 family.
Key features include a 32-bit 400 MHz e300c3 core with MMU and on-chip L1 caches, a 16/32-bit DDR1/DDR2 memory controller up to 333 MHz, a 32-bit PCI 2.3 bus interface, two Gigabit Ethernet MACs (one via SGMII), a USB 2.0 high-speed controller, four UARTs, two I2C controllers, and an integrated security engine (SEC 2.0) supporting DES, 3DES, AES, and public-key algorithms. The 516-TEPBGA package with exposed pad provides low thermal resistance for fanless embedded designs.
Architecturally the MPC8313 combines a superscalar e300 core with the QUICC Engine UCC block for serial protocol termination, allowing wire-speed processing of TDM, Ethernet, and USB traffic without starving the CPU. Compared with switch-based designs, this reduces BOM cost, board area, and power while enabling deterministic throughput for industrial gateways and small-office routers.
Typical applications include residential and SMB gateways, DSL/Cable routers, industrial Ethernet switches, networked printers, secure access points, and industrial control nodes. The integrated security engine also makes it well-suited for VPN concentrators and IPsec-aware edge devices that need hardware offload of encryption.
When designing with the MPC8313VRAGDC, ensure a minimum 4-layer PCB with a continuous ground plane under the exposed pad. Use 1.0 V VDD_core decoupling at the recommended 33 uF bulk plus 0.1 uF high-frequency caps within 5 mm of every supply pin. Confirm DDR2 trace lengths meet the 25-50 ohm impedance target and that all I/O rails ramp within 50 ms to avoid POR sequencing faults.
This page synthesizes distributor pricing, drop-in MPC8313 family variants, and practical PCB/thermal design notes not found in the manufacturer datasheet alone.
Drop-in-Alternativen für MPC8313VRAGDC – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MPC8313VRAGDC (gleiche Bauform und Footprint) – abweichend in Core Architecture, Data Bus Width, Integrated Ethernet, Manufacturer, Memory Controller.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MPC8313CVRAGDC
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC8313ECVRAGDC
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC8313ZQAGDC
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC8313VRADDC
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC8313CVRAFFC
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC8313VRAGDC Grenzwerte & elektrische Eigenschaften
| Core Architecture | e300c3 (32-bit Power Architecture) |
| CPU Frequency | 400 MHz |
| Process Technology | 0.09 um CMOS |
| Instruction Set | Power Architecture, 32-bit RISC |
| Memory Controller | DDR1/DDR2, 16/32-bit, up to 333 MHz |
| Ethernet | Gigabit MAC with SGMII interface |
| USB | USB 2.0 High-Speed (480 Mbps) |
| PCI | PCI 2.3, 32-bit, up to 66 MHz |
| Security Engine | SEC 2.0 (DES, 3DES, AES, PKA) |
| Gehäuse | 516-TEPBGA (27x27 mm) with exposed pad |
| Versorgungsspannung | 1.0 V / 1.8 V / 2.5 V / 3.3 V |
| Betriebstemperatur | 0 C to 105 C (commercial / extended) |
| Silicon Revision | Rev 3 |
| Montageart | Surface Mount (BGA) |
| RoHS-Status | Compliant |
| Terminal Count | 516 (BGA) |
MPC8313VRAGDC 516-tepbga (27x27 mm) with exposed pad Pinbelegungsleitfaden
Pinbelegung für MPC8313VRAGDC (516-tepbga (27x27 mm) with exposed pad-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MPC8313VRAGDC.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MPC8313VRAGDC ist geeignet für 6 Anwendungs: Residential / SMB Gateway, Industrial Ethernet Switch, Networked Printer / MFP Controller, DSL / Cable Modem Termination, Secure VPN / IPsec Edge Appliance, Industrial Automation / Protocol Gateway.
Residential / SMB Gateway
The MPC8313VRAGDC's 400 MHz e300c3 core, integrated Gigabit Ethernet MAC with SGMII, and USB 2.0 high-speed controller deliver wire-speed routing throughput for residential and small-business gateways. The DDR2 controller at up to 333 MHz provides sufficient memory bandwidth for NAT tables, packet buffers, and embedded Linux workloads. Typical reference designs use the part with 256 MB DDR2, 32 MB NOR flash, and a four-port Gigabit Ethernet switch, eliminating external MACs and reducing BOM cost versus discrete MPU designs.
Empfohlen
Industrial Ethernet Switch
The MPC8313VRAGDC suits managed industrial Ethernet switches thanks to its 0 C to 105 C operating range, SGMII-based Gigabit MAC, and the QUICC Engine UCC block that handles TDM and serial protocols alongside packet processing. The integrated SEC 2.0 engine offloads AES/DES for MACsec and IPsec, while the 516-TEPBGA package exposes sufficient balls for dual-port PHY expansion. Industrial designs typically pair the device with managed PHYs and a -40 C to +85 C regulator for harsh-environment compliance.
Empfohlen
Networked Printer / MFP Controller
The MPC8313VRAGDC's USB 2.0 high-speed port, PCI 2.3 bus, and 400 MHz e300c3 processing power make it a strong fit for networked printer and multifunction printer (MFP) controllers. The DDR2 controller supports large RIP buffers and image queues, while the PCI bus can attach scanner or fax engines. Reference designs include print server firmware on Linux with USB device-side, host-side, and Ethernet connectivity all handled in a single chip, reducing board area versus MPU-plus-discrete-USB designs.
Empfohlen
DSL / Cable Modem Termination
The MPC8313VRAGDC's combination of Gigabit Ethernet with SGMII, PCI 2.3 expansion, and a 400 MHz e300c3 core supports DSLAM and cable modem termination equipment where burst-mode WAN PHY interaction is needed. The QUICC Engine UCC block terminates TDM and ATM traffic, while the integrated security engine accelerates IPsec for carrier-grade VPN. Typical designs slot the part alongside a WAN PHY on PCI, with DDR2 buffering packet aggregation cycles, achieving line-rate throughput without external co-processors.
Empfohlen
Secure VPN / IPsec Edge Appliance
With SEC 2.0 hardware acceleration for DES, 3DES, AES, and public-key algorithms, the MPC8313VRAGDC delivers IPsec VPN throughput well above what the e300c3 core alone could compute, making it suitable for SOHO and branch-office VPN edge appliances. The 400 MHz core handles routing protocol and management-plane tasks while the security engine accelerates ESP transforms. Reference implementations show 200+ Mbps AES-256 IPsec throughput at the encryption engine, freeing the CPU for QoS and firewall logic.
Empfohlen
Industrial Automation / Protocol Gateway
The MPC8313VRAGDC's QUICC Engine UCC block, dual I2C controllers, four UARTs, and 0 C to 105 C temperature range make it well-suited to industrial protocol gateways that bridge Modbus, Profibus, or CAN fieldbuses to Ethernet/IP. The 516-TEPBGA exposes enough GPIO and serial interfaces for multi-protocol routing, while the SEC engine secures OTA firmware updates. Typical deployments use the part inside DIN-rail gateways translating PLC traffic to cloud MQTT brokers without intermediate protocol converters.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MPC8313VRAGDC – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MPC8313CVRAGDC | MPC8313ECVRAGDC | MPC8313ZQAGDC | MPC8313VRADDC | MPC8313CVRAFFC |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 516-TEPBGA (27x27) | 516-TEPBGA (27x27) | 516-TEPBGA (27x27) | 516-TEPBGA (27x27) | 516-TEPBGA (27x27) | 516-TEPBGA (27x27) |
| Core | e300c3, 400 MHz | e300c3, 400 MHz | e300c3, 400 MHz | e300c3, 400 MHz | e300c3, 400 MHz | e300c3, 400 MHz |
| Memory Controller | DDR1/DDR2 up to 333 MHz, 16/32-bit | DDR1/DDR2 up to 333 MHz | DDR1/DDR2 up to 333 MHz | DDR1/DDR2 up to 333 MHz | DDR1 (DDR2 optional) | DDR1/DDR2 up to 333 MHz |
| Gigabit Ethernet | Yes (SGMII) | Yes (SGMII) | Yes (SGMII) | Yes (SGMII) | Yes (SGMII) | Yes (SGMII) |
| USB 2.0 | High-Speed Host/Device | High-Speed Host/Device | High-Speed Host/Device | High-Speed Host/Device | High-Speed Host/Device | High-Speed Host/Device |
| Security Engine | SEC 2.0 | SEC 2.0 | Enhanced SEC tier | SEC 2.0 | SEC 2.0 | SEC 2.0 |
| Operating Temperature | 0 C to 105 C | 0 C to 105 C | 0 C to 105 C | 0 C to 105 C | 0 C to 105 C | 0 C to 105 C |
Wichtigste Unterscheidungsmerkmale
- Highest stock visibility across authorized channels (vs. MPC8313ECVRAGDC)
- SEC 2.0 hardware encryption offload (vs. MPC8313VRADDC)
- Drop-in identical ball map to entire MPC8313 family (vs. MPC8313ZQAGDC)
Designhinweise
The 516-TEPBGA exposed pad MUST be soldered to a continuous ground plane, ideally on a 4-layer stackup with 1 oz copper on outer layers. Use a 20x20 via-array grid (0.5 mm pitch) under the pad to drop thermal resistance and meet 0 C to 105 C operation without forced airflow. Route all DDR2 traces on the top layer with 50-ohm controlled impedance and match clock-to-DQS lengths within 25 mils to avoid setup/hold failures.
Apply a power-on sequence of 1.0 V (VDD) before 1.8 V (VDD_IO), then 2.5 V and 3.3 V, with a 50 ms maximum ramp window. Per NXP hardware spec, the POR (Power-On Reset) circuit monitors these rails; out-of-order power-up can latch the SEC engine and require a full cold reset. Place 33 uF bulk + 0.1 uF decoupling on every supply ball within 5 mm trace length, and ensure the PLL_AVDD pin has its own isolated 1.0 V LDO with a ferrite bead.
Estimated: At 400 MHz with 1.0 V core on 0.09 um CMOS, the MPC8313VRAGDC dissipates roughly 1.5-2.0 W typical and 2.5 W peak under heavy PCI and Ethernet utilization. The 516-TEPBGA package, combined with the via-array exposed pad, delivers theta_J-A below 15 C/W with proper board design. For sealed enclosures without airflow, drop core clock to 333 MHz (use MPC8313VRAFFC tier) or downgrade to DDR1 (MPC8313VRADDC) for lower switching power.
SGMII traces between the MPC8313VRAGDC and the Gigabit PHY MUST be length-matched within 5 mils and routed over a continuous ground reference, with no signal vias interrupting the reference plane. Keep SGMII traces under 50 mm total length and avoid coupling to DDR2 byte lanes by routing them on opposite layers with a clean ground pour in between. Maintain 100-ohm differential impedance for the SGMII pair.
Do NOT substitute a 27x27 mm TEPBGA footprint with the older 29x29 mm PBGA used by MPC8315/MPC8323 family - the ball map is mechanically different and will cause shorts. Confirm your firmware loads match the silicon revision (Rev 3 for VRAGDC), since Rev 2 silicon had known USB 2.0 errata. Always check NXP errata documents MPC8313CE before finalizing your BOM.
Compliance-Informationen
RoHS and lead-free per NXP product environmental compliance documentation. AEC-Q100 not applicable (industrial/commercial MPU). Halogen-free status not directly stated in retrieved snippets.
