MPC8313VRAGDC vs MPC8313ZQADDC Vergleich
Detaillierter Direktvergleich von MPC8313VRAGDC von NXP Semiconductors und MPC8313ZQADDC von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MPC8313ZQADDC - PowerQUICC II Pro 266MHz MPU 516-TEPBGA | NXP
MPC8313ZQADDC ✓ AktivSpezifikationsvergleich
| Parameter | MPC8313VRAGDC | MPC8313ZQADDC |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $32,40 | $21,40 |
| Core Architecture | e300c3 (32-bit Power Architecture) | PowerPC e300c3 |
| CPU Frequency | 400 MHz | — |
| Process Technology | 0.09 um CMOS | 0.09 µm CMOS |
| Instruction Set | Power Architecture, 32-bit RISC | — |
| L1 Cache | [DATA_NEEDED: cache size specifics] | — |
| Memory Controller | DDR1/DDR2, 16/32-bit, up to 333 MHz | — |
| Ethernet | Gigabit MAC with SGMII interface | — |
| USB | USB 2.0 High-Speed (480 Mbps) | — |
| PCI | PCI 2.3, 32-bit, up to 66 MHz | — |
| Security Engine | SEC 2.0 (DES, 3DES, AES, PKA) | AES / DES / 3DES |
| Gehäuse | 516-TEPBGA (27x27 mm) with exposed pad | — |
| Versorgungsspannung | 1.0 V / 1.8 V / 2.5 V / 3.3 V | — |
| Betriebstemperatur | 0 C to 105 C (commercial / extended) | 0 °C to +105 °C |
| Silicon Revision | Rev 3 | — |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| MSL-Level | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: MSL level] |
| RoHS-Status | Compliant | [DATA_NEEDED: RoHS status] |
| Terminal Count | 516 (BGA) | — |
| Manufacturer | — | NXP Semiconductors / Freescale |
| Series | — | MPC83xx PowerQUICC II Pro |
| Core Count | — | 1 |
| Datenbusbreite | — | 32-bit |
| Max Core Frequency | — | 267 MHz |
| Operating Voltage (Core) | — | 1.8 V |
| Operating Voltage (DDR I/O) | — | 2.5 V / 1.8 V |
| Operating Voltage (Standard I/O) | — | 3.3 V |
| Package Type | — | 516-TEPBGA (27x27 mm) |
| Ball Count | — | 516 |
| Integrated Memory Controller | — | DDR1/DDR2 up to 266 MHz |
| Integrated Ethernet | — | 10/100/1000 Mbps (3x eTSEC) |
| USB Interface | — | USB 2.0 High-Speed (Host/Device) |
| PCI Interface | — | PCI 32-bit/66 MHz + mini-PCI |