MPC8536BVTAKGA - PowerQUICC III SoC, 600MHz e500, 783-FCPBGA | NXP
Teilenummer: MPC8536BVTAKGA ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $185 | $185,00 |
| 10 | $168.5 | $1.685,00 |
| 100 | $152 | $15.200,00 |
| 500 | $138.75 | $69.375,00 |
| 1.000 | $125 | $125.000,00 |
MPC8536BVTAKGA Übersicht
A PowerQUICC III SoC is a Power Architecture-based system-on-chip originally designed by Freescale (acquired by NXP) for IP network, storage, and industrial gateway applications. It sits in the broader hierarchy: communications processor -> application processor -> microprocessor -> integrated circuit. By integrating high-speed serial interfaces and a memory controller on-die, PowerQUICC III parts eliminate the need for external bridges and reduce BOM cost in routers, switches, and edge appliances.
Key features of the MPC8536BVTAKGA include a 600 MHz e500 core, integrated DDR2/DDR3 SDRAM controller with ECC, four Gigabit Ethernet ports, dual PCI/PCIe interfaces, SATA host support, USB 2.0, SD/MMC host controller, security acceleration, and an operating temperature range of 0 to 105 degrees C. The non-E variant omits the integrated security engine. The device is targeted at extended-temperature industrial and networking environments where reliability and long-life-cycle silicon are required.
Architecturally, the MPC8536B uses a hierarchical bus structure with a 256-bit internal core complex bus and multiple I/O controllers arbitrated through a high-speed crossbar. The e500 core includes a double-precision FPU, MMU, and 32 KB instruction/data L1 caches. A hardware coherency module keeps external masters and the core coherent in shared-memory designs.
Typical applications include industrial routers and switches, network attached storage, factory automation gateways, multi-protocol industrial Ethernet nodes, and embedded control systems that require deterministic networking with deterministic boot behavior. The wide operating temperature range and long-life-cycle silicon make it well suited for industrial control cabinets.
When designing with this part, ensure the PCB has a minimum 6-layer stack-up to route the DDR3 controller cleanly, place the 0.1 microfarent decoupling capacitors adjacent to every power ball pair, and use length-matched routing on the SATA and PCIe differential pairs. A full BSDL and U-Boot port is recommended for production deployment.
Drop-in-Alternativen für MPC8536BVTAKGA – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MPC8536BVTAKGA (gleiche Bauform und Footprint) – abweichend in Core Architecture, Memory Controller, Operating Temperature, Ethernet, Series.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MPC8536AVTAKGA
✅ Drop-In✓ Auf Lager
$64.8 / Stück
Datenblatt ansehen →MPC8536BVTATHA
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC8536BVTAQGA
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC8536BVTAULA
✅ Drop-In✓ Auf Lager
$148.75 / Stück
Datenblatt ansehen →MPC8536BVJAKGA
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC8536BVTAKGA Grenzwerte & elektrische Eigenschaften
| Processor Type | MPC85xx PowerQUICC III 32-Bit |
| Core Architecture | PowerPC e500 |
| Number of Cores | 1 |
| Maximum CPU Frequency | 600 MHz |
| Operating Voltage | 1 V core |
| Betriebstemperatur | 0 C to +105 C |
| Gehäuse | 783-FCPBGA (29x29 mm) |
| Montageart | Surface Mount |
| Memory Controller | DDR2/DDR3 with ECC |
| Ethernet | 10/100/1000 Mbps (multiple ports) |
| PCI/PCIe | PCI and PCI Express interfaces |
| SATA | SATA host support |
| USB | USB 2.0 |
| Storage | SDHC / MMC |
| Security Engine | Not included (non-E variant) |
| MSL-Level | 3 (per JEDEC J-STD-020) |
MPC8536BVTAKGA 783-fcpbga (29x29 mm) Pinbelegungsleitfaden
Pinbelegung für MPC8536BVTAKGA (783-fcpbga (29x29 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MPC8536BVTAKGA.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MPC8536BVTAKGA ist geeignet für 6 Anwendungs: Industrial Routers and Switches, Network Attached Storage (NAS) Controllers, Factory Automation Gateways, Multi-Protocol Industrial Ethernet Nodes, Embedded Control Systems with Boot Determinism, VoIP and Unified Communications Appliances.
Industrial Routers and Switches
The MPC8536BVTAKGA's integrated multi-port Gigabit Ethernet MACs and PCI/PCIe interfaces make it well suited for industrial router and managed-switch designs. With a 600 MHz e500 core, the device can run a full routing stack plus QoS, VLAN, and ACL processing without external coprocessors. Its 0 C to +105 C operating range supports deployment in factory cabinets and outdoor enclosures without active cooling. Compared to a discrete FPGA + CPU solution, the integrated controller reduces BOM count and PCB area.
Empfohlen
Network Attached Storage (NAS) Controllers
The integrated SATA host, Gigabit Ethernet, and DDR2/DDR3 controller with ECC allow the MPC8536BVTAKGA to function as the main SoC in small-form-factor NAS appliances. ECC memory support is critical for protecting user data from soft errors in always-on storage applications. The 600 MHz e500 core offers sufficient processing headroom for RAID management, file-system services (SMB/NFS), and HTTP UI on a single chip, eliminating the need for a separate storage controller.
Empfohlen
Factory Automation Gateways
Industrial EtherNet/IP, PROFINET, and Modbus TCP gateways require deterministic networking with multi-protocol bridging capability. The MPC8536BVTAKGA's combination of Gigabit Ethernet MACs, PCI/PCIe for protocol expansion cards, and a real-time capable e500 core handles these workloads. The extended 105 C junction temperature range enables cabinet-level deployment without additional cooling, and the long-life-cycle silicon reduces qualification re-work for industrial customers.
Empfohlen
Multi-Protocol Industrial Ethernet Nodes
The MPC8536BVTAKGA's flexible SerDes configuration allows designers to expose 1G/2.5G Ethernet ports plus dedicated EtherCAT or PROFINET IRT channels through PCI/PCIe expansion. The e500 core's deterministic interrupt latency and the integrated DMA engines handle real-time protocol processing with bounded jitter. Drop-in compatibility with the MPC8536AVTAKGA means production lines can seamlessly switch between silicon stepping stones as supply dictates.
Empfohlen
Embedded Control Systems with Boot Determinism
Designers building secure-control systems that require deterministic boot and integrity verification benefit from the MPC8536BVTAKGA's secure-boot ROM and hardware random number generator on E variants. The non-E variant (BVTAKGA) still provides a deterministic boot sequence with hardware-assisted secure-boot key storage. This enables regulatory-compliant firmware loading for medical, energy, and transportation sub-systems where predictable startup behavior is required.
Empfohlen
VoIP and Unified Communications Appliances
Small-to-medium VoIP gateway and unified-communications appliances can use the MPC8536BVTAKGA as the main controller, leveraging its multi-port Gigabit Ethernet for LAN/WAN separation, PCI for DSP daughter cards, and DDR2/DDR3 with ECC for reliable call-state memory. The 600 MHz e500 core handles SIP/RTP processing for tens of concurrent sessions without external media accelerators, and the integrated SATA enables local call-recording storage.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MPC8536BVTAKGA – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MPC8536AVTAKGA | MPC8536BVTATHA | MPC8536BVTAQGA | MPC8536BVTAULA | MPC8536BVJAKGA |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 783-FCPBGA (29x29) | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same |
| Core Architecture | PowerPC e500 | PowerPC e500 | PowerPC e500 | PowerPC e500 | PowerPC e500 | PowerPC e500 |
| DDR Memory Controller | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC |
| Gigabit Ethernet Ports | Multiple (multi-MAC) | Multiple (multi-MAC) | Multiple (multi-MAC) | Multiple (multi-MAC) | Multiple (multi-MAC) | Multiple (multi-MAC) |
Wichtigste Unterscheidungsmerkmale
- Fully integrated multi-protocol SoC at 600 MHz (vs. MPC8536AVTAKGA)
- Higher-speed variant available in same package (vs. MPC8536BVTATHA)
- Long-life-cycle silicon for industrial programs (vs. MPC8536BVJAKGA)
Designhinweise
The 783-ball FCPBGA at 29x29 mm requires a high-density PCB stack-up of six layers minimum, with micro-via or laser-drilled via fanout from the BGA ball array to inner routing channels. Per NXP design guidelines, route all DDR signals on inner stripline layers with reference planes on both sides, and length-match byte lanes within 25 mils. Use 0.1 microfarad decoupling capacitors adjacent to every power/ground ball pair to suppress core-rail transients during power-state changes.
Estimated: at maximum 600 MHz core frequency with all SerDes lanes active and dual GbE ports at full line rate, typical core power consumption is on the order of 4-6 W. The FCPBGA package requires a thermal management solution - either a heat-spreader lid with thermal interface material or a forced-air-cooled heatsink in industrial enclosures - to keep junction temperature below 105 C under worst-case ambient conditions.
Do not assume all MPC8536 variants share identical SerDes lane mappings; the SerDes multiplex between SATA, PCIe, and SGMII must be configured via hardware strapping resistors at reset. Incorrect configuration is the most common reason prototypes fail to enumerate PCIe endpoints or detect SATA drives. Reference the NXP hardware specification document and validate SerDes mapping against the Reference Manual before layout finalization.
Differential pairs for SATA, PCIe, and SGMII Ethernet must be length-matched within 5 mils intra-pair and 50 mils inter-pair, with 85 ohm differential impedance and an unbroken reference plane. Keep high-speed digital switching signals (DDR, local bus) physically separated from analog Ethernet magnetics by at least 50 mm to prevent radiated-coupling noise from corrupting PHY-side signals.
Compliance-Informationen
Compliance status not explicitly listed in verified web data; consult the NXP product declaration document or the manufacturer datasheet for authoritative statements.