MPC8536BVTAKGA557 - PowerPC e500 MPU 600MHz 783-FCPBGA | NXP
Teilenummer: MPC8536BVTAKGA557 ✓ AktivMPC8536BVTAKGA557 Übersicht
What is a PowerPC e500 microprocessor? The e500 is a superscalar embedded processor core derived from the Power Architecture, optimized for low-power, high-throughput communications and networking workloads. Within the broader taxonomy, the e500 sits inside the PowerPC microprocessor family, which itself belongs to the MPU (microprocessor unit) tier of integrated circuits and ultimately to the broader class of embedded processors. The MPC85xx series integrates the e500 core alongside system logic, allowing single-chip designs for routers, switches, and industrial control equipment.
Key features include the e500 core with dual-issue out-of-order execution, integrated security acceleration for IPsec, SSL/TLS, and SRTP workloads, four Gigabit Ethernet controllers with SGMII support, three PCI Express Gen 1.1 controllers, two Serial RapidIO endpoints, and a 64-bit DDR2/DDR3 memory controller with ECC. The device supports hardware virtualization through the embedded hypervisor features of the e500 core.
The MPC8536BVTAKGA557 architecture pairs the e500 pipeline with a coherent system bus, on-chip SRAM, and a DMA engine that offloads data movement from the core. This combination delivers deterministic throughput for packet processing tasks while leaving CPU cycles available for control-plane software. The 783-FCPBGA package exposes the full SerDes and memory interface, requiring a multi-layer PCB with impedance-controlled routing.
Typical applications include enterprise routers, wired and wireless access points, industrial gateways, networked printers, multi-function peripherals, and LTE small-cell base stations. The integrated security engine makes it suitable for VPN concentrators and IPsec-aware networking equipment. In storage systems, the combination of RapidIO and PCI Express enables high-throughput controller designs.
When designing with this part, ensure the PCB provides matched-length routing for DDR2/DDR3, controlled-impedance SerDes lanes, and adequate decoupling across the 783-ball grid. The thermal envelope requires attention because the 29x29 mm BGA concentrates heat; airflow or a heatsink is recommended for industrial temperature operation.
This page synthesizes distributor pricing, drop-in same-package variants, and practical design notes that go beyond the manufacturer datasheet, helping engineers select between operating-speed grades and qualify the part for embedded networking designs.
Drop-in-Alternativen für MPC8536BVTAKGA557 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MPC8536BVTAKGA557 (gleiche Bauform und Footprint) – abweichend in Ethernet, Memory Controller, Operating Temperature, Core Architecture, PCI Express.
Für dieses Produkt sind keine Drop-in-Alternativen verfügbar.
Alternativen anfordernMPC8536BVTAKGA557 Grenzwerte & elektrische Eigenschaften
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Series | MPC85xx |
| Core Architecture | PowerPC e500 |
| Number of Cores | 1 |
| Datenbusbreite | 32-bit |
| Core Frequency | 600 MHz |
| Gehäuse | 783-FCPBGA (29x29 mm) |
| Montageart | Surface Mount |
| Betriebstemperatur | -40C to +105C (industrial, per 'A' suffix) |
| Memory Controller | DDR2/DDR3 with ECC (64-bit) |
| Ethernet | 4 x 10/100/1000 Mbps (SGMII) |
| PCI Express | 3 x PCIe Gen 1.1 controllers |
| Serial RapidIO | 2 x Serial RapidIO endpoints |
| Security Engine | Integrated (IPsec, SSL/TLS, SRTP) |
| RoHS-Status | Compliant |
MPC8536BVTAKGA557 783-fcpbga (29x29 mm) Pinbelegungsleitfaden
Pinbelegung für MPC8536BVTAKGA557 (783-fcpbga (29x29 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MPC8536BVTAKGA557.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MPC8536BVTAKGA557 ist geeignet für 6 Anwendungs: Enterprise Router and Switch Control Plane, LTE Small-Cell Base Station, Industrial Networked Gateway, Networked Multi-Function Printer Controller, Wireless LAN Access Point Controller, VPN Concentrator and IPsec Appliance.
Enterprise Router and Switch Control Plane
The MPC8536BVTAKGA557 fits enterprise router control-plane designs because its 600 MHz e500 core and integrated security engine handle IPsec and SSL/TLS acceleration at line rate. The four Gigabit Ethernet MACs with SGMII connect directly to PHY or switch fabric transceivers, eliminating external MAC chips. Placing the part between the line-card PHY and the management CPU reduces bill-of-materials cost and PCB area. Unlike software-only crypto on a generic SoC, the integrated security engine sustains multiple VPN tunnels at wire speed.
Empfohlen
LTE Small-Cell Base Station
In LTE small-cell base stations, the MPC8536BVTAKGA557 provides a deterministic packet processing engine with dual Serial RapidIO endpoints for baseband SoC interconnect. The 64-bit DDR2/DDR3 controller with ECC supports the buffer memory required for HARQ and MAC scheduling. The e500 hardware virtualization features allow secure partitioning between real-time baseband tasks and the management stack. Unlike a general-purpose x86 CPU, the e500 determinism and SerDes integration cut latency for time-critical radio protocols.
Empfohlen
Industrial Networked Gateway
The MPC8536BVTAKGA557's industrial -40C to +105C temperature range and integrated Ethernet make it ideal for industrial gateways bridging Profinet, EtherNet/IP, and Modbus TCP networks. The three PCI Express Gen 1.1 controllers allow direct attach of Wi-Fi or 5G modem cards. Hardware-accelerated IPsec protects site-to-site VPN tunnels for SCADA traffic. Compared to a soft-CPU plus FPGA design, the integrated platform simplifies certification under IEC 61131 and reduces total system power.
Empfohlen
Networked Multi-Function Printer Controller
Multi-function printers need a high-throughput network interface plus USB and image-processing headroom; the MPC8536BVTAKGA557's Gigabit Ethernet, PCI Express, and integrated DMA engine fit this profile. The e500 core runs the printer's embedded OS, while the DMA engine offloads scan-to-email and print-data ingest tasks. The on-chip security engine protects admin access via SSL/TLS. The 783-FCPBGA exposes the full I/O set without external bridge chips, reducing PCB complexity for compact printer mainboards.
Empfohlen
Wireless LAN Access Point Controller
Enterprise wireless access points use the MPC8536BVTAKGA557 as the main controller, with the e500 core running the WLAN controller stack and the integrated Ethernet handling uplink. The PCI Express ports attach to the 802.11ac/ax radio card, while the Serial RapidIO endpoints provide backhaul to a central wireless controller. Hardware crypto offloads 802.11i WPA2/WPA3-Enterprise authentication, freeing the CPU for management tasks. The integrated platform eliminates separate switch and crypto ASICs.
Empfohlen
VPN Concentrator and IPsec Appliance
The MPC8536BVTAKGA557's integrated security engine delivers multi-gigabit IPsec throughput, making it well-suited as a VPN concentrator in branch-office appliances. The four Ethernet MACs provide WAN, LAN, DMZ, and HA interfaces without external switches. The DDR3 memory controller supports large Security Association databases. Compared to a discrete crypto accelerator card, the integrated engine reduces BOM cost and power consumption while simplifying the appliance chassis design for small-business deployments.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MPC8536BVTAKGA557 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MPC8536BVTAKGA | MPC8536AVTAKGA | MPC8536ECVTAGGA | MPC8536BVJAQGA | MPC8544EVTAQGA |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 783-FCPBGA (29x29) | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same |
| Core Architecture | PowerPC e500 | PowerPC e500 | PowerPC e500 | PowerPC e500 | PowerPC e500 | PowerPC e500 |
| Core Frequency | 600 MHz | 600 MHz | 600 MHz | 600 MHz | 600 MHz | 800 MHz+ (higher) |
| Number of Cores | 1 | 1 | 1 | 1 | 1 | 1 |
| Security Engine | Integrated IPsec/SSL/TLS/SRTP | Integrated | Integrated | Integrated | Integrated | Integrated (enhanced) |
| Memory Controller | DDR2/DDR3 with ECC (64-bit) | DDR2/DDR3 with ECC (64-bit) | DDR2/DDR3 with ECC (64-bit) | DDR2/DDR3 with ECC (64-bit) | DDR2/DDR3 with ECC (64-bit) | DDR2/DDR3 with ECC (64-bit) |
Wichtigste Unterscheidungsmerkmale
- Integrated security engine for line-rate IPsec/SSL/TLS (vs. MPC8533)
- Triple PCI Express Gen 1.1 controllers vs single on smaller MPC85xx siblings (vs. MPC8533)
- Industrial temperature grade variant available in same FCPBGA footprint (vs. MPC8536AVTAKGA)
Designhinweise
The 783-FCPBGA at 29x29 mm concentrates the die heat into a small footprint; under full load with all SerDes lanes and security engine active, the junction can exceed 100C in still air. Design for at least 1 m/s airflow across the BGA or attach a low-profile heatsink via the thermal pad exposed on the package top. Validate using the theta_JA from the NXP MPC8536 datasheet thermal section, not the JEDEC-only number.
DDR2/DDR3 routing requires strict length matching on the 64-bit data bus and matched address/command traces; follow the NXP design checklist for byte-lane routing and use the published IBIS model for SI simulation. Place at least eight 100nF decoupling capacitors directly under the BGA footprint (one per quadrant plus critical pin groups) to suppress transient current peaks during core state changes.
The SerDes lanes (PCIe, SGMII, Serial RapidIO) require 100-ohm differential routing with reference planes intact and length matching within the budget listed in the reference manual. Use AC-coupling capacitors as specified by NXP; do not bypass them. Crosstalk between adjacent SerDes lanes degrades eye margin, so keep high-speed lanes separated by at least 3x the trace-to-trace spacing.
Do not assume the '557' suffix is a separate die - it is NXP's product option code (factory option / customer marking) on the same MPC8536BVTAKGA silicon. Boot configuration via Reset Configuration Word must be set before RESET deassertion; otherwise the part may hang in a low-power state. Validate JTAG access during prototype bring-up before locking the board layout.
Compliance-Informationen
Per NXP product page listings on DigiKey, the MPC8536BVTAKGA557 is RoHS compliant and lead-free. AEC-Q100 is not applicable since this is an industrial MPU, not an automotive grade part.