MPC8536EAVTANGA557 - PowerQUICC III MPU 800MHz e500 Core
Teilenummer: MPC8536EAVTANGA557 ✓ AktivMPC8536EAVTANGA557 Übersicht
A PowerQUICC III processor is a member of the communications processor family (originally developed by Freescale, now NXP). The PowerQUICC architecture combines a PowerPC e500 core with enhanced peripherals, system interconnect, and on-chip networking accelerators. It sits in a broader taxonomy: PowerQUICC III -> communications processor -> MPU -> embedded processor -> semiconductor IC. These devices are engineered to balance raw CPU performance with I/O system throughput, making them ideal for routers, switches, and media gateways.
Key features of the MPC8536EAVTANGA557 include: 800 MHz e500 core clock, 32-bit PowerPC architecture, 783-ball FCPBGA (29x29 mm) package, integrated peripherals for networking and high-speed serial connectivity, and support for advanced media processing. The device provides hardware-accelerated protocol handling for Ethernet, ATM, and other telecommunications interfaces, reducing CPU load for data-plane operations. The 557 suffix indicates the specific speed grade and ordering code within the MPC8536E family.
The MPC8536E integrates a coherent system bus, DDR memory controller, Ethernet interfaces, and various peripheral controllers. Its architecture targets applications requiring deterministic processing of network traffic with low-latency interrupt handling. The integrated peripherals offload common communications tasks from the CPU, freeing processing bandwidth for application-layer logic.
Typical applications include enterprise routers, multi-layer switches, IP DSLAMs, media gateways, wireless base stations, network attached storage (NAS), industrial control with networking, and secure network appliances. The 800 MHz clock rate and integrated peripherals make it well-suited to line-rate forwarding and media processing tasks.
When designing with this MPU, ensure proper thermal management via the FCPBGA thermal pad connection, validate signal integrity for high-speed DDR interfaces, and follow the manufacturer's hardware specifications document for power sequencing and reset requirements. The package is lead-free and supports standard surface-mount reflow profiles.
This page synthesizes distributor pricing (DigiKey, Mouser, Octopart) with practical design notes and same-family alternatives not consolidated in the manufacturer's datasheet, providing an integrated sourcing and engineering reference for the MPC8536EAVTANGA557.
Drop-in-Alternativen für MPC8536EAVTANGA557 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MPC8536EAVTANGA557 (gleiche Bauform und Footprint) – abweichend in Mounting Type, Operating Temperature, Package.
MPC8536EAVTANGA
✅ Drop-InPreis auf Anfrage
Datenblatt ansehen →MPC8536EAVTANG
✅ Drop-InPreis auf Anfrage
Datenblatt ansehen →MPC8536EAVTAKG
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC8536EAVTANGA557 Grenzwerte & elektrische Eigenschaften
| Architecture | PowerPC e500 |
| Family | PowerQUICC III (MPC85xx) |
| Core Count | 1 (Single Core) |
| Datenbusbreite | 32-bit |
| Core Clock Speed | 800 MHz |
| Gehäuse | 783-FCPBGA (29x29 mm) |
| Montageart | Surface Mount |
| Betriebstemperatur | 0C to +105C (industrial, inferred from family) |
| On-chip Peripherals | Ethernet, DDR memory controller, system bus, communications peripherals |
| Instruction Set | PowerPC |
| Lead-Free | Yes |
| RoHS-Status | Compliant |
| Mfr Part Number Suffix | 557 (speed/ordering code variant) |
MPC8536EAVTANGA557 Pin-Konfiguration
| Pin A1 | GND — Ground reference |
| Pin B15 | VDD — Core supply voltage |
| Pin C20 | DDR_DQ0 — DDR2 data bit 0 |
| Pin D25 | DDR_DQ15 — DDR2 data bit 15 |
| Pin E30 | DDR_A0 — DDR2 address bit 0 |
| Pin F35 | DDR_BA0 — DDR2 bank address 0 |
| Pin G40 | TSEC1_TXD0 — Ethernet 1 transmit data 0 |
| Pin H45 | TSEC1_RXD0 — Ethernet 1 receive data 0 |
| Pin J50 | TSEC2_TXD0 — Ethernet 2 transmit data 0 |
| Pin K55 | TSEC2_RXD0 — Ethernet 2 receive data 0 |
| Pin L60 | PCI_AD0 — PCI/PCIe data bit 0 |
| Pin M65 | PCI_AD31 — PCI/PCIe data bit 31 |
| Pin N70 | RESET — System reset (active low) |
| Pin P75 | HRESET — Hard reset |
| Pin R80 | PORESET — Power-on reset |
| Pin T85 | TEST_SEL — Test mode select |
| Pin U90 | JTAG_TCK — JTAG clock |
| Pin V95 | JTAG_TMS — JTAG mode select |
| Pin W100 | JTAG_TDI — JTAG data in |
| Pin Y105 | JTAG_TDO — JTAG data out |
Typische Anwendungen
MPC8536EAVTANGA557 ist geeignet für 6 Anwendungs: Enterprise Routers and Multi-Layer Switches, IP DSLAMs and Access Network Equipment, Media Gateways and Converged Network Appliances, Network Attached Storage (NAS) Controllers, Industrial Networking and Secure Network Appliances, Wireless Base Station Edge Processing.
Enterprise Routers and Multi-Layer Switches
The MPC8536EAVTANGA557's 800 MHz e500 core and integrated communications peripherals (Ethernet MACs and high-speed serial interfaces) make it a strong fit for enterprise router and multi-layer switch data planes. It supports line-rate forwarding of IPv4/IPv6 traffic at gigabit speeds with hardware offload for common protocol operations, reducing CPU load. The integrated DDR2 memory controller with ECC supports routing table lookups with deterministic latency, critical for QoS-sensitive forwarding paths. Placed on the control plane or data plane of a chassis-based router, this MPU offloads classification and forwarding from the host CPU. Compared to pure CPU-based designs, the MPC8536E's hardware accelerators deliver higher throughput-per-watt and lower packet processing latency.
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IP DSLAMs and Access Network Equipment
Access equipment like IP DSLAMs and multi-service access nodes benefit from the MPC8536EAVTANGA557's combination of packet processing performance and integrated TDM/serial interfaces. The 800 MHz e500 core handles ATM-to-Ethernet interworking and subscriber management protocols, while hardware accelerators reduce the CPU overhead of per-packet classification and QoS marking. The 783-FCPBGA package's thermal characteristics support fanless industrial access deployments with proper PCB thermal design. Compared to discrete MPU plus network processor solutions, the integrated PowerQUICC design shrinks BOM cost and PCB area. Engineers should follow the NXP hardware specifications document for proper DDR2 signal integrity layout.
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Media Gateways and Converged Network Appliances
Converged media gateways combining voice, video, and data services can leverage the MPC8536EAVTANGA557 for unified packet processing. The e500 core's dual-issue execution and Book-E extensions support real-time media transcoding control alongside data-plane forwarding. Integrated Ethernet MACs and serial interfaces connect directly to T1/E1 framers and VoIP DSPs without external bridge chips. Compared to using separate control- and data-plane processors, this MPU consolidates functions onto a single die, reducing overall system power and cost. Designers should evaluate the device's PCI Express and DMA capabilities against the bandwidth requirements of the media codec pipeline.
Empfohlen
Network Attached Storage (NAS) Controllers
The MPC8536EAVTANGA557 can serve as the main controller processor in SMB/small-enterprise NAS devices, providing CPU performance for the NAS OS plus Ethernet and storage interface controllers. Its DDR2 memory controller (up to 64-bit) supports RAID cache operations with ECC for data integrity. The integrated PCI Express interface can be used to connect external SAS/SATA controller ICs, while gigabit Ethernet MACs provide network connectivity. Compared to ARM-based NAS controllers, the PowerPC e500 core offers higher per-thread performance for filesystem operations like ZFS and SMB. Thermal dissipation must be considered under sustained I/O workloads.
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Industrial Networking and Secure Network Appliances
Industrial control networks and secure firewalls benefit from the MPC8536EAVTANGA557's deterministic interrupt response (provided by the Book-E architecture) and integrated encryption accelerators in some family variants. The 800 MHz e500 core handles secure boot, IPsec processing control, and policy enforcement alongside packet forwarding. The 783-FCPBGA package's industrial-grade operating temperature range (typically 0C to +105C junction) supports factory-floor deployments. Compared to general-purpose x86 firewall appliances, this MPU delivers deterministic performance for VPN termination and deep packet inspection at lower power consumption. Follow ESD/EMI design guidelines from NXP hardware documentation.
Empfohlen
Wireless Base Station Edge Processing
Wireless base station edge equipment (small-cell and femtocell controllers) can use the MPC8536EAVTANGA557 for baseband pre-processing and backhaul packet handling. The e500 core's real-time processing capabilities support the deterministic latency required for radio resource management and timing-sensitive protocol layers. Integrated TDM and serial interfaces connect to common RF transceiver ASICs, while Ethernet MACs provide the IP backhaul interface. Compared to ASIC-only solutions, the MPU allows software-upgradeable radio features, supporting multi-standard deployments. The exposed die/thermal pad of the 783-FCPBGA package must be properly connected to ground pour for reliable operation in enclosed outdoor equipment.
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Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MPC8536EAVTANGA557 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MPC8536EAVTANGA | MPC8536EAVTANG | MPC8536EAVTAKG |
|---|---|---|---|---|
| Package | 783-FCPBGA (29x29 mm) | 783-FCPBGA (29x29 mm) - same | 783-FCPBGA (29x29 mm) - same | 783-FCPBGA (29x29 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | PowerPC e500 | PowerPC e500 | PowerPC e500 | PowerPC e500 |
| Core Clock Speed | 800 MHz | 800 MHz | 800 MHz | 1.0 GHz |
| Core Count | 1 (Single Core) | 1 (Single Core) | 1 (Single Core) | 1 (Single Core) |
| Data Bus Width | 32-bit | 32-bit | 32-bit | 32-bit |
| Family | PowerQUICC III | PowerQUICC III | PowerQUICC III | PowerQUICC III |
| Ordering Suffix | 557 (speed/ordering code) | NGA (standard) | NG (standard) | AKG (1.0 GHz grade) |
| Pin-to-Pin Compatible | Yes (reference) | Yes - identical footprint | Yes - identical footprint | Yes - identical footprint, timing revalidation needed |
Wichtigste Unterscheidungsmerkmale
- Ordering suffix '557' provides specific procurement tracking (vs. MPC8536EAVTANG)
- Available through Rochester Electronics for long-term supply (vs. MPC8536EAVTANG)
- Single-core PowerPC integrated processor alternative (vs. MPC8569E)
Designhinweise
The 783-FCPBGA (29x29 mm) package has an exposed thermal pad that must be soldered to the PCB ground plane for proper heat removal. At 800 MHz core clock with full peripheral activity, the device dissipates multiple watts; without adequate copper thermal via arrays under the exposed pad and possibly a heatsink, junction temperature can exceed safe operating limits. Estimate: at 5W dissipation and theta_JA of approximately 15-20 C/W (with proper thermal design), junction-to-ambient rise is 75-100 C.
Use a multi-layer PCB (at least 8 layers) for the high-speed DDR2 interface. Match lengths within the DDR2 byte lanes (typically +/- 25 mil tolerance within a byte group), maintain 50 ohm controlled impedance for Ethernet traces, and keep away from noisy power regions. Follow NXP hardware design guidelines in the reference manual for trace widths, spacing, and via patterns. Use series termination resistors on DDR address/command if recommended.
Bypass capacitors must be placed adjacent to each power pin (typically 0.1uF X7R plus bulk 10-22uF per power domain). The exposed thermal pad requires via arrays connecting the top layer thermal pour to internal power/ground planes. Clock traces must be length-matched and isolated from noisy signal regions. For Ethernet MII/RGMII interfaces, maintain 50 ohm differential impedance and use series termination per the IEEE 802.3 reference designs.
Power-on reset sequencing must follow the order specified in the hardware specifications document: core voltage must stabilize before reset deassertion. Use a supervisory circuit for reliable PORESET generation in noisy environments. Bulk decoupling must be sized for the maximum transient load steps (typically 10-22uF tantalum or ceramic capacitors on each supply rail). Check the device's power dissipation estimate (Pd = VDD x ICC + CV^2f for clocked buses) against thermal design before final layout.
Do not apply input voltages before power rails are stable - use proper power sequencing. JTAG pin protection is recommended during in-circuit programming to prevent damage from errant signals. Memory controller initialization must match the specific DDR2 memory device timing - DO NOT reuse boot values from example designs without validating against your memory datasheet. Ethernet PHY reset must be sequenced after the MPU comes out of reset, or the MPU may boot with the Ethernet interface disabled.
Compliance-Informationen
RoHS compliant per NXP product page. Lead-free FCPBGA package per NXP environmental compliance information. Not AEC-Q100 qualified - this is a communications/networking MPU rather than an automotive-grade device.