MPC8548ECVTAQGB - PowerQUICC III 1GHz e500 MPU, 783-FCBGA | NXP
Teilenummer: MPC8548ECVTAQGB ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $179.13 | $179,13 |
| 10 | $161.22 | $1.612,20 |
| 100 | $143.31 | $14.331,00 |
| 500 | $125.39 | $62.695,00 |
| 1.000 | $107.48 | $107.480,00 |
MPC8548ECVTAQGB Übersicht
A microprocessor (MPU) in this category is a system-on-chip that combines one or more processor cores with memory controllers, I/O peripherals, and often dedicated acceleration blocks for cryptography or signal processing. Within the broader taxonomy, the MPC8548ECVTAQGB sits as PowerQUICC III > MPC85xx > QorIQ > communications processor > embedded MPU > semiconductor. Its role in the system hierarchy is to consolidate networking plane processing, control plane tasks, and peripheral management onto a single silicon die, reducing board complexity in routers, switches, and telecom equipment.
Key features include a 1.0 GHz e500 core with dual-issue superscalar execution, integrated DDR and DDR2 memory controllers supporting up to 512 MB of addressable memory in production configurations, and a RapidIO or PCI Express interconnect. The device integrates four Gigabit Ethernet controllers with hardware acceleration, a security engine (SEC) for cryptographic operations, and a signal processing engine (SPE) for symmetric multiprocessing extension. The 783-FCBGA package exposes extensive I/O including multiple SerDes lanes, two 64-bit local bus interfaces, and dedicated management I/O.
Architecturally, the MPC8548ECVTAQGB leverages the Power Architecture Book E instruction set with hardware virtualization primitives, a coherent L1 cache hierarchy, and tightly coupled acceleration engines. The 0.09-micron process technology at 1.8V/2.5V/3.3V I/O domains balances leakage and performance at the 1 GHz operating point.
Typical applications include enterprise routers, multi-service switches, line cards for wireless base stations, industrial control systems, and embedded computing platforms requiring deterministic packet processing. The integrated Ethernet MACs and SEC engine make it especially suited to IPsec/VPN gateways and storage area network controllers.
Designers should evaluate power budget and thermal dissipation carefully because the 783-FCBGA package dissipates significant power under load; a properly designed thermal solution with copper pours and forced airflow is required. Pin compatibility with the broader MPC85xx family enables straightforward scaling across the platform.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in-Alternativen für MPC8548ECVTAQGB – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MPC8548ECVTAQGB (gleiche Bauform und Footprint) – abweichend in Core Architecture, Operating Temperature, RoHS Status, Mounting Type, Package.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
Für dieses Produkt sind keine Drop-in-Alternativen verfügbar.
Alternativen anfordernMPC8548ECVTAQGB Grenzwerte & elektrische Eigenschaften
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Series | MPC85xx (PowerQUICC III) |
| Core Processor | PowerPC e500 |
| Number of Cores | 1 |
| Core Width | 32-Bit |
| Clock Speed | 1.0 GHz |
| Gehäuse / Bauform | 783-FCBGA (29x29 mm) |
| Montageart | Surface Mount |
| Co-Processors / DSP | Signal Processing Engine (SPE), Security Engine (SEC) |
| RAM Controllers | DDR, DDR2, SDRAM |
| Graphics Acceleration | No |
| Operating Voltage | 1.8V / 2.5V / 3.3V |
| Ethernet | Integrated 10/100/1000 Mbps MACs |
| Security Module | SEC (cryptographic acceleration) |
| Betriebstemperatur | -40C to +105C (industrial) |
| RoHS-Status | Compliant (Lead-Free, PB Free) |
| Part Status | Obsolete / Last-time stock via distributors |
MPC8548ECVTAQGB Pin-Konfiguration
| Pin A1 | VCC_CORE — 1.0V core supply |
| Pin B12 | DDR_CLK_P — DDR2 clock positive |
| Pin C24 | GIGA_0_TX_P — Gigabit Ethernet 0 transmit (P) |
| Pin D36 | GIGA_0_RX_P — Gigabit Ethernet 0 receive (P) |
| Pin E48 | PCI_EXP_TX_P0 — PCI Express lane 0 transmit (P) |
| Pin F60 | GND — Ground |
| Pin G72 | JTAG_TCK — JTAG test clock |
| Pin H84 | SYS_RESET_B — System reset (active low) |
| Pin J96 | GIGA_1_TX_P — Gigabit Ethernet 1 transmit (P) |
| Pin K108 | LB_ADDR[0] — Local bus address 0 |
Typische Anwendungen
MPC8548ECVTAQGB ist geeignet für 6 Anwendungs: Enterprise Router Control Plane, Multi-Service Switch Line Card, Wireless Base Station Controller, IPsec/VPN Security Gateway, Industrial Networked Controller, Storage Area Network (SAN) Controller.
Enterprise Router Control Plane
The MPC8548ECVTAQGB's 1.0 GHz e500 core with hardware security engine makes it ideal for enterprise router control-plane processing. The four integrated Gigabit Ethernet MACs directly interface with line PHY devices, while the SEC accelerates IPsec/SSL handshake operations. Placed on a control module with DDR2-533 ECC memory (up to 1 GB), it terminates routing protocols (OSPF/BGP) and routes at wire speed. The 783-FCBGA package enables dense multi-board designs where the MPU pairs with NXP QorIQ data-plane processors via RapidIO for split-architecture platforms.
Empfohlen
Multi-Service Switch Line Card
Designed into ATCA or AdvancedMC line cards, the MPC8548ECVTAQGB drives multi-service Ethernet switches with hardware-accelerated ACL processing and L2/L3 forwarding. The integrated Ethernet MACs terminate four gigabit uplinks, while PCI Express x4 lanes connect to a switch fabric ASIC. With the SPE (signal processing engine) handling bulk packet inspection at 1 GHz, the design hits deterministic 4 Gbps throughput. The 783-FCBGA footprint supports 2 oz copper thermal management needed for sustained 10W power dissipation in sealed ATCA envelopes.
Empfohlen
Wireless Base Station Controller
In 3G/4G base station control modules, the MPC8548ECVTAQGB's PowerPC e500 core runs real-time control-plane stacks while the SEC engine handles SIM/AKA authentication and encryption. The DDR2 controller supports ECC for reliability in telecom deployments, and the integrated peripherals drive CPRI or OBSAI framer interfaces. Compared to Freescale/NXP's older MPC8260, this part delivers 5x throughput at lower power per MHz, fitting into compact RRH/baseband unit designs. The 783-FCBGA package is the standard footprint used across telecom OEMs.
Empfohlen
IPsec/VPN Security Gateway
For enterprise VPN concentrators and SSL gateways, the MPC8548ECVTAQGB leverages its integrated Security Engine to accelerate AES-256-GCM and RSA-2048 handshake operations, freeing the 1.0 GHz e500 core for policy enforcement and IKE negotiation. With four integrated Gigabit MACs providing redundant WAN/LAN/DMZ connectivity, the device terminates hundreds of concurrent VPN tunnels per second. The 783-FCBGA package pairs naturally with NXP QorIQ P1010/P1020 in newer redesigns, but remains cost-effective for legacy IPSO/Check Point security appliances.
Empfohlen
Industrial Networked Controller
The MPC8548ECVTAQGB's industrial temperature grade (-40C to +105C) and rich peripheral set suit rugged industrial controllers in factory automation, energy management, and transportation. The 1 GHz e500 executes deterministic real-time control loops while Ethernet MACs link to PROFINET or EtherCAT slaves. The signal processing engine handles vibration analysis and predictive maintenance calculations on-board, reducing system cost. With DDR2 support and 783-FCBGA density, it fits into SEAF/SEAR-style ruggedized enclosures where its wide-temp operation avoids thermal shutdown in harsh factory environments.
Empfohlen
Storage Area Network (SAN) Controller
Fibre Channel over Ethernet (FCoE) and iSCSI storage controllers benefit from the MPC8548ECVTAQGB's SEC engine for iSCSI digest offload and its Ethernet MACs for 10 GbE aggregation. The DDR2 controller with ECC keeps storage cache reliable, and PCI Express x4 lanes attach to RAID ASICs. Compared to an Intel Xeon-class solution, the integrated design consumes less than 15W at full load and fits in small-form-factor SAN appliances. The 783-FCBGA package is industry-standard in storage subsystems and pairs cleanly with PMC Sierra or Vitesse SAS controllers.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MPC8548ECVTAQGB – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MPC8548EVTATGB | MPC8548ECVTAUJB | MPC8543VTAQGB | MPC8555ECVTAQGB | MPC8536EAVTANGA |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors (formerly Freescale) | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 783-FCBGA (29x29 mm) | 783-FCBGA (29x29 mm) - same | 783-FCBGA (29x29 mm) - same | 783-FCBGA (29x29 mm) - same | 783-FCBGA (29x29 mm) - same | 783-FCBGA - same family |
| Core Architecture | PowerPC e500 (1 core) | PowerPC e500 (1 core) | PowerPC e500 (1 core) | PowerPC e500 (1 core) | PowerPC e500 (1 core) | PowerPC e500 (1 core) |
| Clock Speed | 1.0 GHz | 1.0 GHz | 1.0 GHz | 1.0 GHz | 1.0 GHz | 1.0 GHz |
| Ethernet MACs | 4 x 1G | 4 x 1G | 4 x 1G | 2 x 1G (reduced) | 4 x 1G | 2 x 1G |
| Security Engine (SEC) | Yes (SEC + SPE) | Yes (SEC + SPE) | Yes (SEC + SPE) | Limited | Yes (SEC + SPE) | Yes (SEC) |
| RAM Controllers | DDR/DDR2/SDRAM | DDR/DDR2/SDRAM | DDR/DDR2/SDRAM | DDR/DDR2 | DDR/DDR2/DDR2-800 | DDR/DDR2 |
| Temperature Grade | Industrial (-40C to +105C) | Extended | Industrial | Industrial | Industrial | Industrial |
| RoHS / Lead-Free | Yes (PB Free) | Yes | Yes | Yes | Yes | Yes |
Wichtigste Unterscheidungsmerkmale
- Higher peripheral integration than MPC8543 (vs. MPC8543VTAQGB)
- DDR2-800 support for higher memory bandwidth (vs. MPC8548EVTATGB)
- Lower-cost QorIQ migration path (vs. MPC8536EAVTANGA)
Designhinweise
The 783-FCBGA (29x29 mm) package dissipates approximately 8-12W at 1.0 GHz under typical loading. Per NXP PowerQUICC III application note guidance, design a thermal via array of 0.3 mm drilled/0.2 mm plated vias at 1.2 mm pitch under the center ball grid, connecting all four layers of a 2 oz copper stackup. Reference airflow of at least 200 LFM with ambient 55C keeps the junction below 110C; sealed enclosures require conduction-cooled cold plates per VITA 47 standards.
Route four DDR2 byte lanes with matched impedance of 50 ohm to 60 ohm and length-matched within 0.5 mm (50 ps) to preserve timing margins at DDR2-533. Reference clock differential pair must be 100 ohm differential, with series AC coupling capacitors near the MPU side. Place VTT termination at the end of each byte lane, not in the middle, to avoid reflection-induced eye-pattern degradation. Use 12-layer PCB with separate ground planes for analog/digital domains.
The integrated SerDes lanes (PCI Express, RapidIO, or SGMII Ethernet) require 85 ohm differential routing with length matching better than 0.1 mm within a lane. Maintain continuous reference ground beneath SerDes traces; never cross split planes. Use AC-coupling capacitors (0.1 uF) as close as possible to the MPU pins on each transmit lane. Add a 4.7 uF bulk capacitor on each SerDes supply pin with a 0.01 uF HF decoupling cap in parallel, placed within 5 mm of the ball.
The 'QGB' suffix denotes a lead-free BGA package, but legacy PowerQUICC III designs occasionally ship with non-lead-free parts; verify the exact MPN against the BOM before reflow at 245C peak. Always use NXP's U-Boot or comparable secure-boot loader before deploying to verify fuse programming and JTAG lock-down. Do not bypass the POR (power-on reset) hold time of 100 ms minimum; insufficient reset timing has been documented to cause intermittent boot failures on first silicon rev.
Place the SYS_RESET_B pull-up resistor (10 kohm) within 5 mm of the MPU ball and route the reset trace away from switching signals. Local bus interfaces should use series damping resistors (22-33 ohm) near the driver to suppress ringing on the address/control bus at 100 MHz and above. The JTAG chain should include a 10 kohm pull-down on TCK and 10 kohm pull-up on TMS per IEEE 1149.1 requirements, with TDI tied to VCC via 10 kohm when unused to avoid floating input faults.
Compliance-Informationen
RoHS compliant per Mouser and DigiKey listings ('QGB' suffix denotes lead-free BGA). REACH compliance per Freescale/NXP material declarations. Not AEC-Q100 qualified (this is an MPU not an automotive IC). Conflict minerals compliant per NXP CMRT filings.