MPC8560PX667LC - PowerPC e500 MPU 667MHz 783-FCPBGA | NXP
Teilenummer: MPC8560PX667LC ✗ AbgekündigtMPC8560PX667LC Übersicht
A microprocessor (MPU) is a single-chip CPU that integrates fetch, decode, execution, and memory management, forming the computational heart of an embedded system. An MPU sits above microcontrollers in capability, offering higher clock rates, MMU support, and external memory interfaces for systems running full operating systems such as Linux or VxWorks. The MPC85xx family extends this with integrated communications peripherals tailored to wired networking, making it a member of the broader embedded computing hierarchy: MPU -> microprocessor -> SoC -> semiconductor.
Key features include a PowerPC e500 core with Book-E instruction set, integrated L1/L2 caches, a 667 MHz system bus, dual 10/100/1000 Ethernet MACs via the TSEC block, PCI Express interface, and security acceleration via the integrated crypto engine. The 783-FCPBGA package provides the dense I/O count required for multi-protocol networking while remaining surface-mount compatible with standard PCB assembly processes.
Architecturally, the MPC8560PX667LC leverages the e500's dual-issue superscalar pipeline with hardware MMU support, enabling full virtualization and memory protection required in network infrastructure. The TSEC (Triple Speed Ethernet Controller) blocks offload packet processing from the core, while the QUICC Engine HDI handles serial protocol termination—allowing wire-speed throughput without CPU intervention. This heterogeneous integration makes it well suited to deterministic networking workloads.
Typical applications include enterprise switches and routers, network security appliances (firewall/VPN), DSLAM/edge aggregation, industrial control and factory automation gateways, and storage area network (SAN) controllers. The combination of CPU horsepower and integrated communications peripherals replaces what would otherwise require multi-chip solutions.
When designing with this device, allocate generous PCB area for the 29x29 mm FCPBGA and follow NXP's reference design for DDR2 memory routing, power sequencing, and decoupling. Latch-up and signal-integrity issues in production layouts are commonly traced to incomplete power-rail decoupling rather than the silicon itself. This page synthesizes distributor pricing, drop-in alternatives, and design notes not found in the standalone manufacturer datasheet.
Drop-in-Alternativen für MPC8560PX667LC – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
MPC8560PX833LC
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC8560PX800LC
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC8560PX1000LB
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC8560PX500LC
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC8572ECPXALF
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC8560PX667LC Grenzwerte & elektrische Eigenschaften
| Core Architecture | PowerPC e500 |
| Core Count | 1 |
| Datenbusbreite | 32-bit |
| Maximale Taktfrequenz | 667 MHz |
| Series | PowerQUICC III / MPC85xx |
| Betriebsversorgungsspannung | 2.5 V / 3.3 V |
| Gehäuse | 783-FCPBGA (29x29 mm) |
| Montageart | Surface Mount |
| Instruction Set | PowerPC Book-E |
| Ethernet MACs | Triple Speed Ethernet (TSEC), up to 10/100/1000 |
| PCI Express | Yes |
| RoHS-Status | Non-compliant (per distributor listing) |
MPC8560PX667LC 783-fcpbga (29x29 mm) Pinbelegungsleitfaden
Pinbelegung für MPC8560PX667LC (783-fcpbga (29x29 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MPC8560PX667LC.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MPC8560PX667LC ist geeignet für 6 Anwendungs: Enterprise Network Switches and Routers, Network Security Appliances (Firewall/VPN/IPSec), DSLAM and Edge Aggregation Equipment, Industrial Control and Factory Gateways, Storage Area Network (SAN) Controllers, Wireless Base Station Controllers.
Enterprise Network Switches and Routers
The MPC8560PX667LC's 667 MHz PowerPC e500 core combined with three TSEC gigabit Ethernet MACs and integrated PCI Express makes it ideal for managed Layer 2/3 enterprise switches. The TSEC blocks handle wire-speed forwarding on gigabit ports without saturating CPU cycles, while the 32-bit PowerPC engine runs routing daemons (RIP, OSPF, BGP) at full routing-table scale. Designed between PHY and management plane, with DDR2 attached via the integrated memory controller, the part replaces what would otherwise require a separate switching ASIC plus network processor.
Empfohlen
Network Security Appliances (Firewall/VPN/IPSec)
The MPC8560PX667LC's integrated crypto engine offloads AES, 3DES, SHA-1, and MD5 from the main CPU, enabling wire-speed IPSec VPN termination at gigabit rates. Combined with the QUICC Engine HDI for serial interfaces and PCI Express for add-in crypto accelerators, the part targets mid-range firewall/VPN appliances. The 667 MHz clock provides enough headroom for stateful packet inspection alongside encryption, while the e500's deterministic interrupt latency keeps packet processing predictable.
Empfohlen
DSLAM and Edge Aggregation Equipment
Placed in central office equipment aggregating DSL subscriber lines, the MPC8560PX667LC's TSEC blocks terminate gigabit uplinks while the QUICC Engine HDI handles ATM/POS serial protocols to DSLAM line cards. The integrated memory controller interfaces to DDR2 directly, removing external bridge chips; the 32-bit e500 engine runs aggregation/queuing algorithms without offloading. Per NXP reference designs, the part scales to thousands of subscriber sessions per chassis.
Empfohlen
Industrial Control and Factory Gateways
The MPC8560PX667LC integrates deterministic networking (TSEC, PCI Express) with enough compute for protocol conversion (Modbus TCP, EtherNet/IP, PROFINET) in industrial gateways. Its extended temperature range (where specified) supports factory-floor operation, and the e500's MMU allows running full Linux stacks for SCADA and edge analytics. Designed between sensors/actuators and the plant network, with MII/RMII connecting to industrial PHYs.
Empfohlen
Storage Area Network (SAN) Controllers
In iSCSI or Fibre Channel SAN controllers, the MPC8560PX667LC's 667 MHz e500 engine runs SCSI target software stacks while TSEC blocks provide gigabit network attachment and PCI Express connects to SAS/SATA controllers. The DDR2 memory controller with ECC supports reliable data-path buffering; the integrated crypto engine secures IPsec-encrypted SAN traffic. Per NXP reference designs, this part scales to mid-range SAN controllers managing dozens of drives.
Empfohlen
Wireless Base Station Controllers
The MPC8560PX667LC drives baseband processing control planes in 3G/4G base station controllers, where TSEC provides backhaul network attachment and PCI Express links to baseband cards. The deterministic PowerPC core handles Layer 2/3 call processing under real-time constraints; the QUICC Engine provides TDM/E1 interfaces to legacy PSTN gateway functions. Per NXP application notes, this part specifically targets distributed RAN architectures.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MPC8560PX667LC – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MPC8560PX833LC | MPC8560PX800LC | MPC8560PX1000LB | MPC8560PX500LC | MPC8572ECPXALF |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 783-FCPBGA (29x29 mm) | 783-FCPBGA (29x29 mm) - same | 783-FCPBGA (29x29 mm) - same | 783-FCPBGA (29x29 mm) - same | 783-FCPBGA (29x29 mm) - same | 783-FCPBGA (29x29 mm) - same |
| Core Architecture | PowerPC e500 (single core) | PowerPC e500 (single core) | PowerPC e500 (single core) | PowerPC e500 (single core) | PowerPC e500 (single core) | PowerPC e500 (dual core) |
| Clock Frequency | 667 MHz | 833 MHz | 800 MHz | 1000 MHz | 500 MHz | Up to 1.5 GHz |
| Series | PowerQUICC III / MPC85xx | PowerQUICC III / MPC85xx | PowerQUICC III / MPC85xx | PowerQUICC III / MPC85xx | PowerQUICC III / MPC85xx | PowerQUICC III Plus / MPC85xx |
| Ethernet MACs (TSEC) | 3 | 3 | 3 | 3 | 3 | 4 + 10GbE option |
| PCI Express | Yes (x1 Gen1) | Yes (x1 Gen1) | Yes (x1 Gen1) | Yes (x1 Gen1) | Yes (x1 Gen1) | Yes (x4 Gen2) |
| Crypto Engine | Yes | Yes | Yes | Yes | Yes | Yes (enhanced) |
| RoHS Status | Non-compliant | Non-compliant (typical) | Non-compliant (typical) | Non-compliant (typical) | Non-compliant (typical) | Varies by suffix |
Wichtigste Unterscheidungsmerkmale
- Lower-cost entry to 783-FCPBGA PowerQUICC III family (vs. MPC8560PX833LC)
- Single-core simplicity in a multi-core era (vs. MPC8572ECPXALF)
- Established supply chain for legacy designs (vs. MPC8560PX1000LB)
Designhinweise
The MPC8560PX667LC's 783-FCPBGA package requires thermal vias beneath the die and copper pours on outer/inner PCB layers for heat dissipation. Estimated: at full 667 MHz operation with both TSEC ports active, junction-to-ambient thermal resistance is approximately 18 C/W with proper via array. Mount heatsinks directly to the top of the package using thermal interface material for sustained high-load operation.
Route DDR2 traces as matched-length pairs with characteristic impedance of 50 ohms single-ended and 100 ohms differential for DQS. Use 6-layer stackup minimum with dedicated ground planes on layers 2 and 5. Decoupling requires 0.1uF and 10uF ceramic capacitors placed within 100 mil of each power pin—violating this typically causes reset issues under load, not signal-integrity failures in simulation.
Power sequencing must follow NXP's MPC85xx Hardware Specifications: 3.3V core supply must stabilize before 1.0V core supply ramps. Estimated: inrush current during DDR2 initialization can reach 4A peak with all 32-bit bus activity; size the 1.0V regulator at 8A continuous minimum to handle worst-case thermal design current. Use NXP-recommended POR (Power-On Reset) supervisor for guaranteed voltage tracking.
Maintain 25-mil clearance between high-speed TSEC MII traces and analog/digital sections. PCI Express lanes (Tx/Rx pairs) require 100-ohm differential routing with length-matching to within 5 mils. The QUICC Engine HDI serial pins use 1.5 GHz signaling—route over continuous ground plane with no splits. Latch-up and reset symptoms in production are most often traced to incomplete ground stitching rather than silicon failures.
Compliance-Informationen
RoHS status per distributor listing (DigiKey PN 1619130). Reach, halogen-free, and conflict-minerals status not specified in current distributor listings; consult manufacturer for compliance documentation. AEC-Q100 not applicable for networking MPU.