MPC8560VTAQFC - 1GHz PowerQUICC III MPU | NXP 783-FCPBGA
Teilenummer: MPC8560VTAQFC ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $295 | $295,00 |
| 10 | $268.5 | $2.685,00 |
| 100 | $232.4 | $23.240,00 |
| 500 | $201.75 | $100.875,00 |
| 1.000 | $178.9 | $178.900,00 |
MPC8560VTAQFC Übersicht
A microprocessor (MPU) is a single-chip or chip-set implementation of a CPU combined with peripheral subsystems and memory interfaces; the PowerQUICC III family sits within the broader taxonomy of microprocessor IC -> embedded processor -> communications processor -> SoC. The MPC8560 is part of the MPC85xx PowerQUICC III series, sharing architectural lineage with the MPC8540, MPC8555, and MPC8533 families while targeting higher-bandwidth networking applications that demand dedicated serial controllers and fast DDR memory access.
Key features include a 1.0 GHz core frequency, integrated 32-bit PowerPC e500 core, DDR/SDRAM memory controllers, hardware-accelerated communications peripherals, 64-bit data bus, and a flip-chip plastic BGA package optimized for high-speed signal integrity. The part is specified for industrial networking and embedded communications workloads where deterministic serial performance and deterministic latency matter more than raw single-thread throughput.
Architecturally, the e500 core is a superscalar PowerPC implementation with Book E instruction set support, dual-issue pipelines, and dedicated L1 caches. The on-chip CPM offloads DMA, serial, and protocol handling from the core, leaving the e500 free to run control-plane and routing software. The 1.2 V core supply and separate I/O rails are managed through an external power sequencer, while the flip-chip package keeps the die-to-ball inductance path short for GHz-class clocks.
Typical applications include multi-gigabit Ethernet routers, DSLAM line cards, wireless base station control, secure VPN appliances, and industrial protocol bridges. The CPM's multichannel serial controllers make the MPC8560 particularly well suited to T1/E1 aggregation, ATM, HDLC, and PPP termination alongside packet processing.
When designing with the MPC8560VTAQFC, plan for a multi-rail power tree (1.2 V core, 1.8 V/2.5 V DDR, 3.3 V I/O) with controlled sequencing, and provide matched-length DDR routing to the integrated memory controller. PCB designers should also budget thermal dissipation - the FCBGA exposes only the topside for cooling, and airflow or a heatsink is typically required for sustained 1 GHz operation.
This page synthesizes distributor inventory snapshots, drop-in PowerQUICC III family alternatives, and PCB-level design notes not collated in the standalone manufacturer datasheet.
Drop-in-Alternativen für MPC8560VTAQFC – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MPC8560VTAQFC (gleiche Bauform und Footprint) – abweichend in Core Architecture, Package, RoHS Status, Series, Mounting Type.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MPC8560PXAQFC
✅ Drop-In✓ Auf Lager
$137.81 / Stück
Datenblatt ansehen →MPC8560CVT667JC
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC8555EVTAQF
✅ Drop-In✓ Auf Lager
$92.4 / Stück
Datenblatt ansehen →MPC8555EVTAPF
✅ Drop-In✓ Auf Lager
$218.75 / Stück
Datenblatt ansehen →MPC8535AVTAQG
✅ Drop-In✓ Auf Lager
$185.25 / Stück
Datenblatt ansehen →MPC8560VTAQFC Grenzwerte & elektrische Eigenschaften
| Series | PowerQUICC III (MPC85xx) |
| Core Processor | PowerPC e500 |
| Number of Cores | 1 |
| Core Architecture | 32-Bit (64-Bit data bus) |
| Core Frequency | 1.0 GHz |
| Co-Processor / DSP | Communications; CPM |
| Supply Voltage - Core | 1.2 V |
| RAM Controllers | DDR, SDRAM |
| Graphics Acceleration | No |
| Package Type | 783-FCPBGA (29x29 mm, 1.0 mm pitch) |
| Package Height | 3.75 mm |
| Montageart | Surface Mount (Flip-Chip) |
| MSL-Level | 3 (168 Hours) |
| REACH Status | REACH Unaffected |
| HTSUS Code | 8542.31.0001 |
| RoHS-Status | Lead-Free / Compliant |
MPC8560VTAQFC 3.75 mm Pinbelegungsleitfaden
Pinbelegung für MPC8560VTAQFC (3.75 mm-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MPC8560VTAQFC.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MPC8560VTAQFC ist geeignet für 6 Anwendungs: Multi-Gigabit Ethernet Router, DSLAM Line Card Aggregation, Wireless Base Station Control, Secure VPN / SSL Appliance, Industrial Protocol Bridge, Print Engine and Imaging Controller.
Multi-Gigabit Ethernet Router
The MPC8560VTAQFC's 1.0 GHz e500 core plus on-chip CPM enables multi-gigabit Ethernet router line cards that need deep packet buffering and deterministic serial DMA. The integrated DDR/SDRAM controller feeds the CPM's multichannel controllers without external memory bridge glue, so designers can sustain wire-speed forwarding across multiple GbE or 10GbE uplinks. Compared with discrete CPU + NIC solutions, the single-chip 783-FCPBGA reduces BOM cost and PCB area while preserving PowerPC software compatibility for legacy routing stacks.
Empfohlen
DSLAM Line Card Aggregation
In DSLAM aggregation designs, the MPC8560VTAQFC's CPM offloads ATM and HDLC termination from the e500 core, freeing the CPU for PPPoE, IGMP, and traffic shaping. The 1.0 GHz clock and 64-bit DDR interface provide the throughput headroom required for hundreds of bonded ADSL2+/VDSL2 subscribers per line card. The 783-FCPBGA package exposes all serial and memory signals on a controlled-impedance footprint optimized for backplane routing to xDSL PHY ASICs.
Empfohlen
Wireless Base Station Control
The MPC8560VTAQFC is widely used in 2G/3G base station control-plane cards where the e500 core runs real-time OS tasks and the CPM handles E1/T1 backhaul and HDLC framing. Its 1.2 V core supply and deterministic interrupt latency make it suitable for telecom-grade environments requiring extended-temperature operation. The 783-FCPBGA's flip-chip interconnect minimizes die-to-ball inductance, which is critical for the multi-GHz SerDes clocks used in CPRI links to the radio head.
Empfohlen
Secure VPN / SSL Appliance
VPN and SSL appliance designers leverage the MPC8560VTAQFC's e500 core for IPsec and TLS handshake acceleration while the integrated CPM terminates multiple Gigabit Ethernet WAN ports with hardware crypto offload hooks. The 1.0 GHz dual-issue pipeline executes encryption kernels at sustained throughput, and the DDR controller feeds large session-table lookups without starving the cipher engine. The 783-FCPBGA package's flip-chip thermal path supports the higher sustained power of crypto workloads.
Empfohlen
Industrial Protocol Bridge
Industrial protocol bridges use the MPC8560VTAQFC to translate between Modbus, PROFIBUS, EtherCAT, and PROFINET on the factory floor. The e500 core runs the deterministic protocol stack while the CPM manages multiple TDM and serial channels without external DMA controllers. With its industrial temperature tolerance and long-life NXP roadmap through the PowerQUICC III family, the MPC8560VTAQFC fits long-life industrial automation platforms.
Empfohlen
Print Engine and Imaging Controller
High-end print engines and imaging controllers use the MPC8560VTAQFC's CPM to drive multiple scanner/copier scan bars and feeders in parallel, while the e500 core handles raster image processing and page description language interpretation. The 1.0 GHz throughput is sufficient for 60+ ppm color pages, and the DDR controller supports the large page buffers required at 600 dpi. The 783-FCPBGA footprint simplifies mechanical integration into compact printer mainboards.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MPC8560VTAQFC – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MPC8560PXAQFC | MPC8560CVT667JC | MPC8555EVTAQF | MPC8555EVTAPF | MPC8535AVTAQG |
|---|---|---|---|---|---|---|
| Package | 783-FCPBGA (29x29) | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same |
| Brand | NXP Semiconductors | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same |
| Core Frequency | 1.0 GHz | 1.0 GHz | 667 MHz | 1.0 GHz | 1.0 GHz | 1.0 GHz |
| Core Processor | PowerPC e500 | PowerPC e500 | PowerPC e500 | PowerPC e500 | PowerPC e500 | PowerPC e500 |
| CPM Revision | CPM (full channel count) | CPM (full channel count) | CPM (full channel count) | MPC8555E CPM revision | MPC8555E CPM revision | MPC8535 CPM (lower count) |
| Core Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | Active |
| RAM Controller | DDR, SDRAM | DDR, SDRAM | DDR, SDRAM | DDR, SDRAM | DDR, SDRAM | DDR, SDRAM |
| Architecture | 32-Bit e500 / 64-Bit data bus | 32-Bit e500 / 64-Bit data bus | 32-Bit e500 / 64-Bit data bus | 32-Bit e500 / 64-Bit data bus | 32-Bit e500 / 64-Bit data bus | 32-Bit e500 / 64-Bit data bus |
Wichtigste Unterscheidungsmerkmale
- Highest clock speed in the MPC8560 family (vs. MPC8560CVT667JC)
- Full CPM channel count (vs. MPC8535AVTAQG)
- VT temperature grade (vs. MPC8560PXAQFC)
- Successor silicon within the same family (vs. MPC8568)
Designhinweise
The MPC8560VTAQFC requires a sequenced multi-rail power tree: 1.2 V core, 1.8 V/2.5 V DDR, and 3.3 V I/O. Power-up sequencing must follow the order specified in the NXP MPC85xx hardware specification, with the core rail last. Use a dedicated sequencing supervisor or the NXP MC34712/MC34713 sequencer to avoid latch-up during cold start; failure to sequence correctly can permanently damage the e500 core.
Estimated: at 1.0 GHz core clock and 1.2 V supply, the MPC8560VTAQFC dissipates approximately 8-12 W core power. The 783-FCPBGA exposes only the top side for thermal attachment; design in a heatsink with thermal interface material or forced-air cooling for sustained workloads. Without active airflow the junction temperature will exceed 100C in typical industrial ambient, triggering thermal protection or accelerating silicon wear.
The 1.0 mm BGA pitch demands 4-6 layer PCB stack-up with controlled impedance for DDR, Ethernet, and SerDes traces. Match DDR trace lengths to within 50 mil per byte lane as required by the integrated DDR controller; use the NXP IBIS model for SI simulation. Provide a continuous ground reference plane under the BGA and stitch vias around the perimeter to suppress GHz-radiated emissions.
Do not assume the MPC8560VTAQFC is interchangeable with newer PowerQUICC III derivatives without verifying the CPM firmware image and boot ROM revision - software loaders are silicon-revision specific. Also verify the JTAG and boundary-scan chain because some MPC85xx variants route TRST differently. Engineers porting from the MPC8560 to the MPC8568 must update the DDR initialization sequence as well as the CPM microcode loader.
Compliance-Informationen
Lead-free 783-FCPBGA package per Rochester Electronics listing. REACH unaffected per GlobalSpec datasheet snippet. AEC-Q100 not applicable - this is a communications MPU, not an automotive-qualified IC.
