MPC8560VTAQFC vs MPC8555EVTAQF Vergleich
Detaillierter Direktvergleich von MPC8560VTAQFC von NXP Semiconductors und MPC8555EVTAQF von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MPC8555EVTAQF - PowerQUICC III 1GHz e500 MPU | NXP 783-FCPBGA
MPC8555EVTAQF ObsoleteSpezifikationsvergleich
| Parameter | MPC8560VTAQFC | MPC8555EVTAQF |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | NRND | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $178,90 | $92,40 |
| Series | PowerQUICC III (MPC85xx) | PowerQUICC III, MPC85xx |
| Core Processor | PowerPC e500 | — |
| Number of Cores | 1 | — |
| Core Architecture | 32-Bit (64-Bit data bus) | PowerPC e500 |
| Core Frequency | 1.0 GHz | 1.0 GHz |
| Co-Processor / DSP | Communications; CPM | — |
| Supply Voltage - Core | 1.2 V | — |
| RAM Controllers | DDR, SDRAM | — |
| Graphics Acceleration | No | — |
| Package Type | 783-FCPBGA (29x29 mm, 1.0 mm pitch) | FC-PBGA, flip-chip plastic BGA |
| Package Height | 3.75 mm | — |
| Montageart | Surface Mount (Flip-Chip) | Surface Mount |
| MSL-Level | 3 (168 Hours) | [DATA_NEEDED: MSL rating] |
| REACH Status | REACH Unaffected | — |
| HTSUS Code | 8542.31.0001 | — |
| RoHS-Status | Lead-Free / Compliant | [DATA_NEEDED: RoHS compliance] |
| Betriebstemperatur | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Manufacturer | — | NXP USA Inc. |
| Core Count | — | 1 |
| Datenbusbreite | — | 32-bit |
| Gehäuse | — | 783-FCPBGA (29x29 mm) |
| Pin-Anzahl | — | 783 |
| Ball Pitch | — | 1.0 mm |
| Supply Voltage (Core) | — | 1.2 V |
| L1 Cache | — | 32 KB instruction / 32 KB data |