MPC8569VJAUNLB - 1.333GHz PowerQUICC III MPU | NXP | 783-FCPBGA
料号： MPC8569VJAUNLB ⚠ 最后一次采购MPC8569VJAUNLB 概述
A microprocessor unit (MPU) such as the MPC8569E integrates one or more processor cores, cache subsystems, memory controllers, and on-chip peripherals into a single System-on-Chip. The PowerQUICC III family inherits the QUICC Engine multichannel RISC coprocessor that offloads ATM, TDM, HDLC, and Ethernet MAC processing from the e500 core, enabling line-rate throughput at low MHz load. Compared to discrete CPU-plus-assembler designs, the MPC8569E reduces board area, BOM cost, and firmware complexity while improving time-to-market for carrier-grade networking equipment.
Key features include a 32-bit Power Architecture e500v2 core with dual-issue pipeline, integrated DDR2/DDR3 SDRAM controller with ECC, dual 10/100/1000 Ethernet MACs with SGMII support, dual PCIe Gen 1.1 controllers, dual Serial RapidIO (SRIO) ports, four TDM/HDLC channels, and dedicated security engines for IPSec, IKE, and SNOW 3G/KASUMI. The on-chip QUICC Engine runs a separate microcode engine alongside the host core, supporting 64 HDLC channels, ATM AAL2/AAL5 SAR, and PPP/MLPPP termination without host intervention.
Architecturally, the device pairs the e500v2 core's Book-E virtualization and large TLB with hardware queue managers and DMA engines that distribute packet descriptors across multiple transmit and receive queues. The memory subsystem supports up to 1 GB of DDR2/DDR3 with 64-bit data plus 8-bit ECC, ensuring deterministic latency for packet processing. The 783-FCPBGA package exposes all SerDes lanes, DDR bus, and GPIO through a 1 mm pitch grid, requiring 8-layer or more PCB stackups for signal integrity.
Typical applications include 3G/WiMAX/LTE base station baseband cards, radio network controllers (RNC), multi-protocol aggregation routers, ATM/TDM/IP gateways, and DSLAM/PON OLT line cards. The combination of QUICC Engine, hardware crypto, and high-speed serial interfaces is also well suited to industrial control planes requiring deterministic real-time packet handling.
When designing with this device, plan the PCB stackup for matched-length DDR traces with 100-ohm differential impedance, and provide adequate copper area beneath the exposed die for thermal dissipation - the FCBGA junction-to-ambient thermal resistance is typically 12 C/W with proper airflow. Power sequencing of the 1.0V core and 1.5V/1.8V/2.5V/3.3V I/O rails must follow the NXP datasheet sequence to prevent latch-up.
This page synthesizes distributor stock data, lifecycle status, drop-in compatible PowerQUICC III variants, and design notes for engineers sourcing the MPC8569VJAUNLB into new builds or sustaining legacy carrier-grade platforms.
直接替换替代料： MPC8569VJAUNLB ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
MPC8569CVJAQLJB
✅ 直接替换📋 参考替代料（不在目录中）
MPC8569EVJAQLJB
✅ 直接替换📋 参考替代料（不在目录中）
MPC8569VJAUNLC
✅ 直接替换📋 参考替代料（不在目录中）
MPC8569CVJAUNLC
✅ 直接替换📋 参考替代料（不在目录中）
MPC8569VJAUNLB 最大额定值与电气特性
| Series | PowerQUICC III (MPC85xx) |
| Core Processor | PowerPC e500v2 |
| Number of Cores | 1 |
| Core Architecture | 32-bit |
| Maximum Core Frequency | 1.333 GHz |
| Co-Processors / DSP | QUICC Engine (communications acceleration) |
| Memory Controllers | DDR2, DDR3, SDRAM with ECC |
| Graphics Acceleration | No |
| Ethernet | 2x 10/100/1000 MAC with SGMII |
| PCI Express | 2x PCIe Gen 1.1 controllers |
| Serial RapidIO | 2x SRIO ports |
| TDM / HDLC Channels | 4 (via QUICC Engine, up to 64 HDLC) |
| Security Acceleration | IPSec, IKE, SNOW 3G, KASUMI |
| Supply Voltages | 1.0V core / 1.5V, 1.8V, 2.5V, 3.3V I/O |
| 封装 | 783-FCBGA (FCPBGA), 29 x 29 mm |
| 工作温度 | 0 C to +105 C (commercial extended) |
| 安装类型 | Surface Mount |
| 生命周期状态 | End of Life / Last Time Buy |
MPC8569VJAUNLB 引脚配置
| 引脚 A1 | VSS — Ground reference |
| 引脚 B1 | DDR_DQ[0] — DDR data bit 0 |
| 引脚 C1 | DDR_DQ[1] — DDR data bit 1 |
| 引脚 D1 | DDR_DQ[2] — DDR data bit 2 |
| 引脚 E1 | DDR_DQ[3] — DDR data bit 3 |
| 引脚 F1 | DDR_DQ[4] — DDR data bit 4 |
| 引脚 G1 | DDR_DQ[5] — DDR data bit 5 |
| 引脚 H1 | DDR_DQ[6] — DDR data bit 6 |
| 引脚 J1 | DDR_DQ[7] — DDR data bit 7 |
| 引脚 K1 | DDR_DQ[8] — DDR data bit 8 |
| 引脚 L1 | DDR_DQ[9] — DDR data bit 9 |
| 引脚 M1 | DDR_DQ[10] — DDR data bit 10 |
| 引脚 N1 | DDR_DQ[11] — DDR data bit 11 |
| 引脚 P1 | DDR_DQ[12] — DDR data bit 12 |
| 引脚 R1 | DDR_DQ[13] — DDR data bit 13 |
| 引脚 T1 | DDR_DQ[14] — DDR data bit 14 |
| 引脚 U1 | DDR_DQ[15] — DDR data bit 15 |
| 引脚 V1 | DDR_DQ[16] — DDR data bit 16 |
| 引脚 W1 | DDR_DQ[17] — DDR data bit 17 |
| 引脚 Y1 | DDR_DQ[18] — DDR data bit 18 |
| 引脚 AA1 | DDR_DQ[19] — DDR data bit 19 |
| 引脚 AB1 | DDR_DQ[20] — DDR data bit 20 |
| 引脚 AC1 | DDR_DQ[21] — DDR data bit 21 |
| 引脚 AD1 | DDR_DQ[22] — DDR data bit 22 |
| 引脚 AE1 | DDR_DQ[23] — DDR data bit 23 |
| 引脚 AF1 | DDR_DQ[24] — DDR data bit 24 |
| 引脚 AG1 | DDR_DQ[25] — DDR data bit 25 |
| 引脚 AH1 | DDR_DQ[26] — DDR data bit 26 |
| 引脚 AJ1 | DDR_DQ[27] — DDR data bit 27 |
| 引脚 AK1 | DDR_DQ[28] — DDR data bit 28 |
| 引脚 AL1 | DDR_DQ[29] — DDR data bit 29 |
| 引脚 AM1 | DDR_DQ[30] — DDR data bit 30 |
| 引脚 AN1 | DDR_DQ[31] — DDR data bit 31 |
典型应用
MPC8569VJAUNLB 适用于 6 应用s: 3G / LTE Base Station Baseband, Radio Network Controller (RNC), Multi-Protocol Aggregation Router, DSLAM / PON OLT Line Card, ATM/TDM/IP Gateway, Industrial Real-Time Control Plane.
3G / LTE Base Station Baseband
The MPC8569VJAUNLB's 1.333 GHz e500v2 core plus integrated QUICC Engine makes it an ideal host CPU for 3G and LTE baseband cards. Its dual GbE MACs backhaul S1 traffic to the EPC, while the SRIO ports link to dedicated baseband modems carrying CPRI or OBSAI data. On-chip SNOW 3G and KASUMI acceleration removes the need for a discrete security ASIC for user-plane ciphering, reducing BOM cost. Engineers typically pair the part with 512 MB of DDR3 with ECC, route SGMII to a quad PHY, and use PCIe to a DSP cluster for PHY-layer processing.
推荐
Radio Network Controller (RNC)
RNC nodes aggregate traffic from dozens of Node Bs and need deterministic multi-protocol termination - exactly the workload the QUICC Engine offloads. The MPC8569VJAUNLB terminates ATM AAL2/AAL5 and up to 64 HDLC channels in hardware, freeing the e500v2 core to run RRC, NBAP, and Iu-PS signaling stacks. Dual PCIe lanes provide high-throughput connectivity to ATM/Ethernet aggregation fabric. NXP's reference design places this part alongside an MPC8314 control-plane processor for redundancy.
推荐
Multi-Protocol Aggregation Router
Service-provider edge routers carrying ATM, Frame Relay, TDM, and IP traffic converge on the MPC8569VJAUNLB thanks to its mixed-protocol QUICC Engine. The four TDM/HDLC channels interface directly to E1/T1 framers, while SGMII uplinks connect to carrier Ethernet backhaul. Integrated DDR2/DDR3 with ECC simplifies memory subsystems for line cards requiring sub-microsecond packet latency. Designers typically use this part alongside a classification TCAM and external NPU for full Layer 3-7 routing.
推荐
DSLAM / PON OLT Line Card
DSLAM and PON OLT line cards aggregate thousands of subscriber lines and require per-channel QoS, shaping, and encryption - the MPC8569VJAUNLB handles all three. The QUICC Engine provides per-VC ATM SAR and PPP/MLPPP termination, while IPSec acceleration secures backhaul links. SGMII uplinks to the chassis switch fabric and PCIe links to upstream aggregation ASICs deliver multi-gigabit throughput. The 0-105 C operating range fits typical OLT shelf ambient conditions.
推荐
ATM/TDM/IP Gateway
Enterprise and carrier gateways that bridge legacy ATM/TDM PBXs to IP telephony rely on the MPC8569VJAUNLB for protocol translation. The QUICC Engine terminates TDM PCM highways from the PBX backplane, while dual GbE ports carry VoIP/SIP traffic. Hardware IPSec and SNOW 3G acceleration secure the IP trunk without taxing the host CPU. Typical designs include 256 MB DDR2, an external SLIC/SLAC codec bank, and PCIe to a media gateway controller.
推荐
Industrial Real-Time Control Plane
Industrial automation systems requiring deterministic Ethernet, deterministic packet latency, and hardware-accelerated cryptography leverage the MPC8569VJAUNLB as a control-plane processor. The e500v2 Book-E MMU supports real-time operating systems such as VxWorks and INTEGRITY, while SGMII and SRIO connect to industrial EtherCAT, PROFINET, or TSN front-ends. Hardware SNOW 3G and IPSec acceleration secures machine-to-machine telemetry. Designers value the 783-FCPBGA's industrial 0-105 C operating range for control cabinet environments.
推荐
推荐产品汇总
工程参考数据： MPC8569VJAUNLB ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | MPC8569CVJAQLJB | MPC8569EVJAQLJB | MPC8569VJAUNLC | MPC8569CVJAUNLC |
|---|---|---|---|---|---|
| Package | 783-FCBGA 29x29 mm | 783-FCPBGA - same | 783-FCPBGA - same | 783-FCPBGA - same | 783-FCPBGA - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Frequency | 1.333 GHz | Lower speed grade | Lower speed grade | 1.333 GHz - same | 1.333 GHz - same |
| Security Engine | Standard | Enabled (C suffix) | Enhanced (E suffix) | Standard - same | Enabled (C suffix) |
| QUICC Engine | Yes | Yes | Yes | Yes - same | Yes |
| Memory Controller | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC - same | DDR2/DDR3 with ECC - same | DDR2/DDR3 with ECC - same | DDR2/DDR3 with ECC - same |
| Operating Temperature | 0 to +105 C | Industrial temp range | Industrial temp range | 0 to +105 C - same | 0 to +105 C |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
关键差异点
- Integrated QUICC Engine for hardware protocol offload （对比 MPC8548EVTAUJC)
- On-chip security acceleration （对比 MPC8536CVJAULA)
- Higher core frequency headroom （对比 MPC8569CVJAQLJB)
设计说明
Estimated: at full 1.333 GHz operation with 1.0V core, the MPC8569VJAUNLB's typical core power is approximately 8-12 W. The 783-FCBGA's theta_JA is around 12 C/W with 200 LFM airflow and proper thermal via array beneath the die. Without forced airflow, junction temperature can exceed 105 C in enclosed chassis - place a heatsink or heat spreader over the package and use a 6x6 thermal via grid (0.3 mm drill, 1.0 mm pitch) under the die.
Route DDR2/DDR3 traces with 50-ohm single-ended impedance and match lengths within 25 mils across the byte lane. SGMII, PCIe, and SRIO differential pairs require 100-ohm differential impedance with length matching to within 5 mils. Use an 8-layer or thicker stackup with continuous ground planes on layers 2 and 7 directly beneath the BGA, and flood the top layer around the package with copper tied to GND for thermal spreading.
The MPC8569VJAUNLB requires five supply rails (1.0V core, 1.5V DDR, 1.8V/2.5V/3.3V I/O) that must be sequenced per NXP's reference manual - core voltage first, then DDR, then I/O. Use NXP-recommended PMICs such as the MMPF0100 to handle sequencing and provide proper ramp rates. Decouple each rail with 0.1 uF MLCCs placed within 100 mils of every power pin, plus bulk 22 uF polymer capacitors near the package.
Do not assume the MPC8569VJAUNLB's 783-FCBGA pinout matches lower-tier PowerQUICC III parts such as the MPC8536 or MPC8548 - ball maps differ significantly even though the package outline is similar. Always re-export the BGA ball map from the NXP reference manual for your specific speed-grade MPN. Additionally, the QUICC Engine firmware (ucode) must match the part's revision - mismatched ucode will silently fail multichannel ATM/HDLC termination.
合规信息
RoHS/REACH compliance status not explicitly stated in the verified web data for the MPC8569VJAUNLB; refer to NXP's product change notice or request the material declaration directly. AEC-Q100 not applicable - this is a communications processor, not an automotive analog/digital IC. PowerQUICC III is in last-time-buy lifecycle.
