MPC862PCZQ66B - PowerQUICC 32-Bit 66MHz MPU | NXP | 357-BGA
Teilenummer: MPC862PCZQ66B ⚠ Letzte Bestellmöglichkeit| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $122.53 | $122,53 |
| 10 | $115.4 | $1.154,00 |
| 100 | $102.85 | $10.285,00 |
| 500 | $92.1 | $46.050,00 |
| 1.000 | $84.75 | $84.750,00 |
MPC862PCZQ66B Übersicht
What is a PowerQUICC communications processor? A PowerQUICC is an integrated microprocessor plus multi-channel peripheral controller originally derived from the MC68360 QUICC family, combining a Power Architecture core with communication-specific peripherals. It sits in the broader hierarchy: microprocessor unit (MPU) -> integrated communications controller -> embedded networking/telecom system-on-chip. The MPC862 family is one of the most widely deployed PowerQUICC derivatives, sitting alongside the MPC860 and the MPC8260/8272 high-performance siblings.
Key features of the MPC862PCZQ66B include: 66 MHz CPU clock, 3.3 V power supply, a 357-ball plastic BGA in a 25 mm × 25 mm outline, an industrial -40 °C to +105 °C operating temperature range, hardware MMU for virtual memory, and an integrated peripheral set optimized for HDLC/PPP, UART, and Ethernet bridging. The on-chip system integration unit reduces external glue logic for address mapping, bus arbitration, and PCMCIA/PC Card control, allowing a single chip to replace multi-component legacy designs.
In terms of architecture, the MPC862PCZQ66B belongs to the MPC8xx family built on a 0.32 µm CMOS process. It includes separate instruction and data caches, a hardware memory management unit (MMU), a 32-bit external bus, and a dedicated peripheral module that offloads DMA, serial channel framing, and bus arbitration from the CPU core - significantly raising aggregate I/O throughput compared with a stand-alone microcontroller.
Typical applications include telecom routers and bridges, ISDN terminal adapters, xDSL modems and IADs, industrial control boards requiring multi-protocol serial aggregation, and legacy migration of MC68360 designs onto a Power Architecture platform. The extended -40 °C to +105 °C temperature grade also makes the part viable for outdoor and industrial-grade enclosures.
When designing with this device, pay close attention to bus termination on the 3.3 V PBGA ball grid - a 4- to 6-layer PCB with a continuous power plane and stitched ground returns is recommended to maintain SI margin on the external memory bus at 66 MHz. Provide bulk decoupling within one ball-pitch of the supply balls and a clock source meeting the PowerQUICC AC timing jitter spec; an external reset supervisor with proper power-on-reset timing is also recommended for reliable boot.
This page synthesizes current distributor pricing, validated drop-in alternatives, and practical board-level design notes that go beyond the manufacturer datasheet alone, helping procurement and hardware engineers make a confident sourcing and integration decision for legacy PowerQUICC designs.
Drop-in-Alternativen für MPC862PCZQ66B – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MPC862PCZQ66B (gleiche Bauform und Footprint) – abweichend in Core Architecture, Package / Case, RoHS Status, Lead Free Status, Mounting Type.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MPC862PZQ66B
✅ Drop-In✓ Auf Lager
$62.1 / Stück
Datenblatt ansehen →MPC860TCZQ66D4
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC860TZQ66D4
✅ Drop-In✓ Auf Lager
$81.28 / Stück
Datenblatt ansehen →MPC862CZP66B
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MPC862PCZP66B
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MPC862PCZQ50B
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MPC862PCZQ66B Grenzwerte & elektrische Eigenschaften
| Processor Type | MPC8xx PowerQUICC 32-Bit |
| Core Architecture | Power Architecture (MPC8xx family) |
| Speed (CPU Clock) | 66 MHz |
| Versorgungsspannung | 3.3 V |
| Number of Cores | 1 |
| Bit Width | 32-Bit |
| Gehäuse / Bauform | 357-BBGA (PBGA 25x25 mm) |
| Packaging | Tray |
| Process Technology | 0.32 µm CMOS |
| Betriebstemperatur | -40 °C to +105 °C |
| Montageart | Surface Mount (BGA) |
| Lead Free Status | Contains Lead (per DigiChip spec summary) |
| RoHS-Status | Non-RoHS (legacy PowerQUICC) |
| Communication Peripherals | FCC, SCC, SMC, SPI, I²C, PCMCIA / PC Card, Ethernet |
| Integrated Features | MMU, instruction/data caches, system integration unit |
MPC862PCZQ66B 357-bbga (pbga 25x25 mm) Pinbelegungsleitfaden
Pinbelegung für MPC862PCZQ66B (357-bbga (pbga 25x25 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MPC862PCZQ66B.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MPC862PCZQ66B ist geeignet für 6 Anwendungs: Telecom Routers and Bridges, xDSL Modems and ISDN Terminal Adapters, Industrial Multi-Protocol Serial Controller, Legacy MC68360 Migration Designs, Outdoor Telecom CPE, Embedded Networking Appliance Platform.
Telecom Routers and Bridges
The MPC862PCZQ66B is well-suited for small-to-medium telecom routers and bridging equipment where the integrated peripheral set bundles HDLC/PPP framing, fast Ethernet MAC, and PCMCIA-style glue logic onto one die. Why it fits: the 66 MHz Power Architecture core and dedicated CPM channels let one chip service multiple WAN ports and one Ethernet LAN port while sustaining wire-speed framing on serial links. How it is used: the CPU runs the routing/bridge stack (VxWorks, Linux, or pSOS+) while the CPM module handles DMA-driven serial framing, offloading the CPU to maintain latency budgets. Practical benefit: a single chip replaces a CPU plus a separate serial controller, reducing BOM count versus discrete designs.
Empfohlen
xDSL Modems and ISDN Terminal Adapters
The MPC862PCZQ66B is widely deployed in xDSL customer-premises equipment and ISDN terminal adapters that need a PowerPC-class CPU plus multi-channel serial aggregation in a single package. Why it fits: its FCC/SCC blocks can drive DSL framer interfaces and TDM/ISDN buses while the CPU runs the PPPoE/PPPoA stack. How it is used: the CPM module serves multiple serial endpoints and the on-chip Ethernet MAC terminates the LAN side, allowing the same BOM to scale across residential gateway variants. Practical benefit: industrial-grade -40 to +105 °C temperature support enables outdoor CPE enclosures without a heatsink derating curve.
Empfohlen
Industrial Multi-Protocol Serial Controller
Industrial controllers frequently aggregate Modbus RTU/ASCII, Profibus, and proprietary serial fieldbuses; the MPC862PCZQ66B is a natural fit because its CPM block can frame multiple SCC lines while the CPU runs the PLC logic. Why it fits: 66 MHz CPU is sufficient for ladder-logic scan times under 10 ms in many discrete applications, and the integrated MMU supports protected OS environments. How it is used: each SCC/UART channel handles one fieldbus segment; the CPU supervises scan cycles via a real-time OS. Practical benefit: a single -40 to +105 °C qualified BGA absorbs both the control and the communication duties, simplifying thermal design.
Empfohlen
Legacy MC68360 Migration Designs
Engineers migrating from MC68360 QUICC designs onto a Power Architecture platform can use the MPC862PCZQ66B to retain software compatibility at the source level while moving forward to a more capable part. Why it fits: the PowerQUICC retains the QUICC peripheral model while upgrading to a Power Architecture CPU core. How it is used: existing firmware stacks (including pSOS+, VxWorks, and many RTOS ports) can be recompiled against the new core with minimal source change. Practical benefit: a 0.32 µm CMOS process gives repeatable timing margin for long-life industrial products.
Empfohlen
Outdoor Telecom CPE
The -40 °C to +105 °C industrial temperature range of the MPC862PCZQ66B makes it attractive for outdoor telecom CPE that has to survive harsh enclosures: surge suppression cabinets, weatherproof NIDs, and PoE-powered access devices. Why it fits: industrial-grade temperature and integrated peripheral consolidation minimize external components that could fail in outdoor stress. How it is used: the device terminates Ethernet on the LAN side and one or more DSL/E1 links on the WAN side, with power and environmental monitoring handled by an external MCU. Practical benefit: a single BGA device eliminates board-level reliability issues caused by marginal commercial-only devices in outdoor duty cycles.
Empfohlen
Embedded Networking Appliance Platform
The MPC862PCZQ66B is also used as a CPU for legacy embedded networking appliances — small print-server/IoT gateways that require multi-protocol serial aggregation plus LAN/WAN routing on a single board. Why it fits: the integrated FCC/Ethernet peripherals provide a complete MAC layer, while the 66 MHz CPU handles lightweight IP filtering. How it is used: the CPU runs an embedded Linux or RTOS, communicating with the peripheral module via DMA channels. Practical benefit: a 357-BGA package with well-documented reference designs cuts down development time for cost-constrained appliances.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MPC862PCZQ66B – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MPC862PZQ66B | MPC860TCZQ66D4 | MPC860TZQ66D4 | MPC862CZP66B | MPC862PCZP66B | MPC862PCZQ50B |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 357-BBGA (PBGA 25x25 mm) | 357-BBGA (PBGA 25x25 mm) - same | 357-BBGA (PBGA 25x25 mm) - same | 357-BBGA (PBGA 25x25 mm) - same | 357-BBGA (PBGA 25x25 mm) - same | 357-BBGA (PBGA 25x25 mm) - same | 357-BBGA (PBGA 25x25 mm) - same |
| CPU Clock | 66 MHz | 66 MHz | 66 MHz | 66 MHz | 66 MHz | 66 MHz | 50 MHz |
| Core Family | MPC8xx PowerQUICC (MPC862) | MPC8xx (MPC862) | MPC8xx (MPC860) | MPC8xx (MPC860) | MPC8xx (MPC862) | MPC8xx (MPC862) | MPC8xx (MPC862) |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Process Technology | 0.32 µm CMOS | 0.32 µm CMOS | 0.32 µm CMOS | 0.32 µm CMOS | 0.32 µm CMOS | 0.32 µm CMOS | 0.32 µm CMOS |
Wichtigste Unterscheidungsmerkmale
- Industrial -40 °C to +105 °C temperature grade (vs. MPC862PZQ66B)
- Full MPC862 peripheral mask with extended FCC/SCC channels (vs. MPC860TCZQ66D4)
- Pin-code ‘ZQ’ 357-ball PBGA mapping (vs. MPC862PCZP66B)
Designhinweise
The 357-ball PBGA on a 1.27 mm or finer pitch MUST be placed on a 4- to 6-layer PCB with a continuous 3.3 V power plane and a stitched ground plane directly under the BGA. Use microvia/HDI stack-ups if escape routing under the array is required; route high-speed external memory bus tracks in matched-length groups and keep the trace distance to a reference plane under 8 mil to maintain signal integrity at 66 MHz. Provide 0.1 µF + bulk 10–47 µF decoupling inside one ball-pitch of the supply balls.
The 0.32 µm CMOS die under typical workload dissipates approximately 1.5 W (Estimated: based on the MPC8xx family datasheet power figure at 3.3 V/66 MHz). In an enclosed outdoor cabinet with limited airflow, an aluminum spreader or thermal pad bonded to a copper PCB area of at least 25 cm² is recommended. Verify junction-rise using the board theta_JA from the application note before finalising the thermal layout.
PowerQUICC devices require a clock source that meets the Power Architecture AC timing jitter spec; a generic 66 MHz oscillator with poor jitter can produce intermittent bus faults. Also ensure proper power-on-reset (POR) sequencing with the HRESET and SRESET pins held low until the 3.3 V rail stabilises - omitting an external reset supervisor is a known cause of boot-up failures on legacy PowerQUICC designs (per NXP MPC8xx family user manual).
Series-terminate the external memory bus and the Ethernet MII/RMII traces if used; the MPC862 outputs have 3.3 V TTL-like edges that ring on long runs. Place 33 Ω series resistors within 10 mm of the BGA pads to dampen reflections on the address/control group. Validate timing with worst-case IBIS simulations before committing the layout.
Compliance-Informationen
DigiChip datasheet summary lists 'Lead Free Status: Contains Lead' and 'RoHS Status: RoHS' (interpreted by web scraping as legacy non-RoHS PowerQUICC device). Compliance fields beyond lead/RohS not explicitly stated in the verified web data and are marked unknown.
