MPC862PCZQ66B - PowerQUICC 32-Bit 66MHz MPU | NXP | 357-BGA
MPN: MPC862PCZQ66B ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $122.53 | $122.53 |
| 10 | $115.4 | $1,154.00 |
| 100 | $102.85 | $10,285.00 |
| 500 | $92.1 | $46,050.00 |
| 1,000 | $84.75 | $84,750.00 |
MPC862PCZQ66B Overview
What is a PowerQUICC communications processor? A PowerQUICC is an integrated microprocessor plus multi-channel peripheral controller originally derived from the MC68360 QUICC family, combining a Power Architecture core with communication-specific peripherals. It sits in the broader hierarchy: microprocessor unit (MPU) -> integrated communications controller -> embedded networking/telecom system-on-chip. The MPC862 family is one of the most widely deployed PowerQUICC derivatives, sitting alongside the MPC860 and the MPC8260/8272 high-performance siblings.
Key features of the MPC862PCZQ66B include: 66 MHz CPU clock, 3.3 V power supply, a 357-ball plastic BGA in a 25 mm × 25 mm outline, an industrial -40 °C to +105 °C operating temperature range, hardware MMU for virtual memory, and an integrated peripheral set optimized for HDLC/PPP, UART, and Ethernet bridging. The on-chip system integration unit reduces external glue logic for address mapping, bus arbitration, and PCMCIA/PC Card control, allowing a single chip to replace multi-component legacy designs.
In terms of architecture, the MPC862PCZQ66B belongs to the MPC8xx family built on a 0.32 µm CMOS process. It includes separate instruction and data caches, a hardware memory management unit (MMU), a 32-bit external bus, and a dedicated peripheral module that offloads DMA, serial channel framing, and bus arbitration from the CPU core - significantly raising aggregate I/O throughput compared with a stand-alone microcontroller.
Typical applications include telecom routers and bridges, ISDN terminal adapters, xDSL modems and IADs, industrial control boards requiring multi-protocol serial aggregation, and legacy migration of MC68360 designs onto a Power Architecture platform. The extended -40 °C to +105 °C temperature grade also makes the part viable for outdoor and industrial-grade enclosures.
When designing with this device, pay close attention to bus termination on the 3.3 V PBGA ball grid - a 4- to 6-layer PCB with a continuous power plane and stitched ground returns is recommended to maintain SI margin on the external memory bus at 66 MHz. Provide bulk decoupling within one ball-pitch of the supply balls and a clock source meeting the PowerQUICC AC timing jitter spec; an external reset supervisor with proper power-on-reset timing is also recommended for reliable boot.
This page synthesizes current distributor pricing, validated drop-in alternatives, and practical board-level design notes that go beyond the manufacturer datasheet alone, helping procurement and hardware engineers make a confident sourcing and integration decision for legacy PowerQUICC designs.
Drop-in alternatives for MPC862PCZQ66B — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MPC862PCZQ66B (same form factor and footprint) — differing in Core Architecture, Package / Case, RoHS Status, Lead Free Status, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MPC862PZQ66B
✅ Drop-In✓ In Stock
$62.1 / Unit
View Datasheet →MPC860TCZQ66D4
✅ Drop-In📋 Reference alternative (not in catalog)
MPC860TZQ66D4
✅ Drop-In✓ In Stock
$81.28 / Unit
View Datasheet →MPC862CZP66B
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MPC862PCZP66B
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MPC862PCZQ50B
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MPC862PCZQ66B Maximum Ratings & Electrical Characteristics
| Processor Type | MPC8xx PowerQUICC 32-Bit |
| Core Architecture | Power Architecture (MPC8xx family) |
| Speed (CPU Clock) | 66 MHz |
| Supply Voltage | 3.3 V |
| Number of Cores | 1 |
| Bit Width | 32-Bit |
| Package / Case | 357-BBGA (PBGA 25x25 mm) |
| Packaging | Tray |
| Process Technology | 0.32 µm CMOS |
| Operating Temperature | -40 °C to +105 °C |
| Mounting Type | Surface Mount (BGA) |
| Lead Free Status | Contains Lead (per DigiChip spec summary) |
| RoHS Status | Non-RoHS (legacy PowerQUICC) |
| Communication Peripherals | FCC, SCC, SMC, SPI, I²C, PCMCIA / PC Card, Ethernet |
| Integrated Features | MMU, instruction/data caches, system integration unit |
MPC862PCZQ66B 357-bbga (pbga 25x25 mm) Pin Configuration Guide
Pin configuration for MPC862PCZQ66B (357-bbga (pbga 25x25 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MPC862PCZQ66B.
Refer to the datasheet for full pin configuration.
Typical Applications
MPC862PCZQ66B is suitable for 6 applications: Telecom Routers and Bridges, xDSL Modems and ISDN Terminal Adapters, Industrial Multi-Protocol Serial Controller, Legacy MC68360 Migration Designs, Outdoor Telecom CPE, Embedded Networking Appliance Platform.
Telecom Routers and Bridges
The MPC862PCZQ66B is well-suited for small-to-medium telecom routers and bridging equipment where the integrated peripheral set bundles HDLC/PPP framing, fast Ethernet MAC, and PCMCIA-style glue logic onto one die. Why it fits: the 66 MHz Power Architecture core and dedicated CPM channels let one chip service multiple WAN ports and one Ethernet LAN port while sustaining wire-speed framing on serial links. How it is used: the CPU runs the routing/bridge stack (VxWorks, Linux, or pSOS+) while the CPM module handles DMA-driven serial framing, offloading the CPU to maintain latency budgets. Practical benefit: a single chip replaces a CPU plus a separate serial controller, reducing BOM count versus discrete designs.
Recommended
xDSL Modems and ISDN Terminal Adapters
The MPC862PCZQ66B is widely deployed in xDSL customer-premises equipment and ISDN terminal adapters that need a PowerPC-class CPU plus multi-channel serial aggregation in a single package. Why it fits: its FCC/SCC blocks can drive DSL framer interfaces and TDM/ISDN buses while the CPU runs the PPPoE/PPPoA stack. How it is used: the CPM module serves multiple serial endpoints and the on-chip Ethernet MAC terminates the LAN side, allowing the same BOM to scale across residential gateway variants. Practical benefit: industrial-grade -40 to +105 °C temperature support enables outdoor CPE enclosures without a heatsink derating curve.
Recommended
Industrial Multi-Protocol Serial Controller
Industrial controllers frequently aggregate Modbus RTU/ASCII, Profibus, and proprietary serial fieldbuses; the MPC862PCZQ66B is a natural fit because its CPM block can frame multiple SCC lines while the CPU runs the PLC logic. Why it fits: 66 MHz CPU is sufficient for ladder-logic scan times under 10 ms in many discrete applications, and the integrated MMU supports protected OS environments. How it is used: each SCC/UART channel handles one fieldbus segment; the CPU supervises scan cycles via a real-time OS. Practical benefit: a single -40 to +105 °C qualified BGA absorbs both the control and the communication duties, simplifying thermal design.
Recommended
Legacy MC68360 Migration Designs
Engineers migrating from MC68360 QUICC designs onto a Power Architecture platform can use the MPC862PCZQ66B to retain software compatibility at the source level while moving forward to a more capable part. Why it fits: the PowerQUICC retains the QUICC peripheral model while upgrading to a Power Architecture CPU core. How it is used: existing firmware stacks (including pSOS+, VxWorks, and many RTOS ports) can be recompiled against the new core with minimal source change. Practical benefit: a 0.32 µm CMOS process gives repeatable timing margin for long-life industrial products.
Recommended
Outdoor Telecom CPE
The -40 °C to +105 °C industrial temperature range of the MPC862PCZQ66B makes it attractive for outdoor telecom CPE that has to survive harsh enclosures: surge suppression cabinets, weatherproof NIDs, and PoE-powered access devices. Why it fits: industrial-grade temperature and integrated peripheral consolidation minimize external components that could fail in outdoor stress. How it is used: the device terminates Ethernet on the LAN side and one or more DSL/E1 links on the WAN side, with power and environmental monitoring handled by an external MCU. Practical benefit: a single BGA device eliminates board-level reliability issues caused by marginal commercial-only devices in outdoor duty cycles.
Recommended
Embedded Networking Appliance Platform
The MPC862PCZQ66B is also used as a CPU for legacy embedded networking appliances — small print-server/IoT gateways that require multi-protocol serial aggregation plus LAN/WAN routing on a single board. Why it fits: the integrated FCC/Ethernet peripherals provide a complete MAC layer, while the 66 MHz CPU handles lightweight IP filtering. How it is used: the CPU runs an embedded Linux or RTOS, communicating with the peripheral module via DMA channels. Practical benefit: a 357-BGA package with well-documented reference designs cuts down development time for cost-constrained appliances.
Recommended
Recommended Products Summary
Engineering reference data for MPC862PCZQ66B — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MPC862PZQ66B | MPC860TCZQ66D4 | MPC860TZQ66D4 | MPC862CZP66B | MPC862PCZP66B | MPC862PCZQ50B |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 357-BBGA (PBGA 25x25 mm) | 357-BBGA (PBGA 25x25 mm) - same | 357-BBGA (PBGA 25x25 mm) - same | 357-BBGA (PBGA 25x25 mm) - same | 357-BBGA (PBGA 25x25 mm) - same | 357-BBGA (PBGA 25x25 mm) - same | 357-BBGA (PBGA 25x25 mm) - same |
| CPU Clock | 66 MHz | 66 MHz | 66 MHz | 66 MHz | 66 MHz | 66 MHz | 50 MHz |
| Core Family | MPC8xx PowerQUICC (MPC862) | MPC8xx (MPC862) | MPC8xx (MPC860) | MPC8xx (MPC860) | MPC8xx (MPC862) | MPC8xx (MPC862) | MPC8xx (MPC862) |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Process Technology | 0.32 µm CMOS | 0.32 µm CMOS | 0.32 µm CMOS | 0.32 µm CMOS | 0.32 µm CMOS | 0.32 µm CMOS | 0.32 µm CMOS |
Key Differentiators
- Industrial -40 °C to +105 °C temperature grade (vs MPC862PZQ66B)
- Full MPC862 peripheral mask with extended FCC/SCC channels (vs MPC860TCZQ66D4)
- Pin-code ‘ZQ’ 357-ball PBGA mapping (vs MPC862PCZP66B)
Design Notes
The 357-ball PBGA on a 1.27 mm or finer pitch MUST be placed on a 4- to 6-layer PCB with a continuous 3.3 V power plane and a stitched ground plane directly under the BGA. Use microvia/HDI stack-ups if escape routing under the array is required; route high-speed external memory bus tracks in matched-length groups and keep the trace distance to a reference plane under 8 mil to maintain signal integrity at 66 MHz. Provide 0.1 µF + bulk 10–47 µF decoupling inside one ball-pitch of the supply balls.
The 0.32 µm CMOS die under typical workload dissipates approximately 1.5 W (Estimated: based on the MPC8xx family datasheet power figure at 3.3 V/66 MHz). In an enclosed outdoor cabinet with limited airflow, an aluminum spreader or thermal pad bonded to a copper PCB area of at least 25 cm² is recommended. Verify junction-rise using the board theta_JA from the application note before finalising the thermal layout.
PowerQUICC devices require a clock source that meets the Power Architecture AC timing jitter spec; a generic 66 MHz oscillator with poor jitter can produce intermittent bus faults. Also ensure proper power-on-reset (POR) sequencing with the HRESET and SRESET pins held low until the 3.3 V rail stabilises - omitting an external reset supervisor is a known cause of boot-up failures on legacy PowerQUICC designs (per NXP MPC8xx family user manual).
Series-terminate the external memory bus and the Ethernet MII/RMII traces if used; the MPC862 outputs have 3.3 V TTL-like edges that ring on long runs. Place 33 Ω series resistors within 10 mm of the BGA pads to dampen reflections on the address/control group. Validate timing with worst-case IBIS simulations before committing the layout.
Compliance Information
DigiChip datasheet summary lists 'Lead Free Status: Contains Lead' and 'RoHS Status: RoHS' (interpreted by web scraping as legacy non-RoHS PowerQUICC device). Compliance fields beyond lead/RohS not explicitly stated in the verified web data and are marked unknown.
