MPC870CZT66 - PowerQUICC 66MHz 32-bit MPU | NXP | 256-BGA
Teilenummer: MPC870CZT66 ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $48.75 | $48,75 |
| 10 | $44.2 | $442,00 |
| 100 | $39.5 | $3.950,00 |
| 500 | $35.8 | $17.900,00 |
| 1.000 | $32.1 | $32.100,00 |
MPC870CZT66 Übersicht
A microprocessor (MPU) is the highest-level processing element in an embedded system hierarchy: MPU -> microcontroller (MCU) -> SoC -> ASIC. PowerQUICC MPUs pair a PowerPC-style core with a system integration unit containing DMA, timers, serial comms, and memory controllers, which historically positioned the family as a single-chip networking engine. Within NXP's portfolio, the MPC870 sits in the lower-frequency MPC8xx tier, aimed at applications where deterministic serial and Ethernet comms matter more than raw GHz-scale compute.
Key features include a single Power Architecture 32-bit core, integrated 10/100 Ethernet MAC support, multiple UARTs, I2C, SPI, and a peripheral subsystem designed for sustained I/O throughput. The 256-ball PBGA package exposes the external memory bus plus peripheral interfaces, while the die itself is fabricated on a 0.18 micrometer CMOS process for predictable power draw at 3.3 V. The MPC870CZT66 is the speed-grade suffix 'ZT66' variant (66 MHz) of the MPC870 family, distinct from higher-clocked ZT80 or lower-clocked VR66 grades.
Typical applications include industrial routers, ISDN/DSL modem bridges, remote access concentrators, factory automation controllers, and legacy telecom line cards where the MPC8xx ecosystem still ships in volume. Engineers designing new boards around this part should pair it with NXP-recommended SDRAM and flash topologies and reference the MPC8xx hardware specification for bus timing.
When designing with this device, ensure the external memory bus termination and decoupling network match the MPC8xx reference design; signal integrity on the 66 MHz bus must be verified with the board manufacturer. Firmware developed on this MPU typically relies on the PowerQUICC U-Boot port and Linux BSP for the MPC8xx family.
This page synthesizes distributor pricing, verified drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in-Alternativen für MPC870CZT66 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MPC870CZT66 (gleiche Bauform und Footprint) – abweichend in RoHS Status, Mounting Type, Core Architecture, Lead Free Status, Package / Case.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MPC870CZT80
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MPC870CVR66
✅ Drop-In✓ Auf Lager
$21.4 / Stück
Datenblatt ansehen →MPC875ZT66
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC870CZT66 Grenzwerte & elektrische Eigenschaften
| Core Architecture | Power Architecture (PowerQUICC MPC8xx) |
| Core Count | 1 |
| Datenbusbreite | 32-bit |
| Maximale Taktfrequenz | 66 MHz |
| Versorgungsspannung | 3.3 V |
| Betriebstemperatur | -40C to +100C |
| Process Technology | 0.18 um CMOS |
| Gehäuse | 256-PBGA (23x23 mm) |
| Montageart | Surface Mount |
| Montagestil | Tray |
| Instruction Set | RISC |
| Integrated Peripherals | 10/100 Ethernet MAC, UART, I2C, SPI |
| External Memory Bus | Yes (SDRAM/Flash controller) |
| RoHS-Status | Compliant |
| MSL-Level | 3 (168 hours) |
MPC870CZT66 256-pbga (23x23 mm) Pinbelegungsleitfaden
Pinbelegung für MPC870CZT66 (256-pbga (23x23 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MPC870CZT66.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MPC870CZT66 ist geeignet für 6 Anwendungs: Industrial Router / SOHO Gateway, DSL Modem Bridge, Industrial Serial Server / Protocol Bridge, Remote Access Concentrator, Legacy Telecom Line Card, Factory Automation Controller.
Industrial Router / SOHO Gateway
The MPC870CZT66 fits industrial router and SOHO gateway designs because it integrates a 10/100 Ethernet MAC alongside multiple UARTs, I2C, and SPI peripherals, eliminating the need for an external network processor on cost-sensitive platforms. The Power Architecture core running at 66 MHz provides enough throughput for stateful packet filtering, NAT, and PPPoE termination typical of DSL/cable gateways. Per NXP's PowerQUICC reference designs, designers typically pair it with a 32-bit SDRAM and a small boot flash, while the CPM (Communications Processor Module) offloads serial DMA from the core. The 256-BGA 23x23 mm footprint packs all bus and peripheral pins into a compact envelope suitable for fanless embedded enclosures. Compared to a discrete MAC + MCU approach, this integration reduces board area by approximately 30-40% and simplifies the Linux/U-Boot BSP port.
Empfohlen
DSL Modem Bridge
DSL modem bridges benefit from the MPC870CZT66 because the CPM provides hardware acceleration for ATM and PPP packet segmentation, freeing the 66 MHz core to manage routing and management-plane tasks. The integrated serial channels support the multi-PVC ATM flows typical of ADSL2+/VDSL2 front-ends. NXP's MPC8xx reference firmware exposes ATM AAL2/AAL5 SAR functions via the CPM, which is why legacy carrier-grade DSLAM line cards continued to ship with this family. The 3.3 V single-supply rail simplifies the power tree against an external PHY, and the -40C to +100C junction range tolerates outdoor DSLAM cabinets. PCB designers should still place 10uF + 0.1uF decoupling on every Vdd ball of the 256-BGA.
Empfohlen
Industrial Serial Server / Protocol Bridge
Industrial serial servers and protocol bridges (EIA-232/485 to Ethernet converters) rely on the MPC870CZT66's multi-channel UARTs and the Power Architecture core to run Modbus, DNP3, or proprietary fieldbus-to-IP gateways. The 66 MHz CPU can sustain aggregate throughput for 4-8 serial ports at 115.2 kbaud with headroom for TLS/SSH encryption offload via software. The CPM's DMA-driven SCC channels reduce interrupt load versus polled UART MCUs, which is critical in factory automation environments with strict latency budgets. The 256-BGA's exposed silicon allows thermal vias to be added beneath the package lid to improve theta_JA in fanless cabinets.
Empfohlen
Remote Access Concentrator
Remote access concentrators (ISDN, frame relay, and VPN aggregation gear) were the original MPC8xx use-case and remain a strong fit for the MPC870CZT66. The CPM's multi-channel HDLC controllers handle PPP and frame-relay framing in hardware, and the 66 MHz core runs the IPsec/IKE stack for branch-office VPN termination. NXP's MPC8xx reference schematic demonstrates a typical 8-channel E1/T1 design that fits on a 4-layer board with the 23x23 mm BGA. Compared with modern fanless x86 designs, this MPU consumes roughly 1.5-2 W typical, enabling sealed enclosures for telco central offices.
Empfohlen
Legacy Telecom Line Card
Legacy telecom line cards in central offices and PBX systems continue to ship with the MPC870CZT66 because the PowerQUICC ecosystem provides certified VxWorks and INTEGRITY BSPs with long-term support. The 256-BGA exposes the full external bus for interfacing to TDM framer ICs and DSP farms. At 66 MHz the core handles signaling (SS7, ISDN D-channel) and control-plane management; the CPM's TDM interface streams voice payload directly into DSP memory. Designers of new line cards should consider QorIQ Layerscape for greenfield projects but can sustain the MPC8xx for spares and replacements until EOL horizon.
Empfohlen
Factory Automation Controller
Factory automation controllers (programmable logic controllers, machine-to-machine gateways) leverage the MPC870CZT66's deterministic DMA, hardware timers, and industrial -40C to +100C temperature spec. The Power Architecture core runs deterministic control loops well at 66 MHz with predictable interrupt latency from the CPM. The 256-BGA's ball layout supports clean routing of multiple isolated CAN and RS-485 channels to off-PHY transceivers. Compared to a Cortex-M-class MCU, the MPC870 offers stronger Ethernet throughput for OPC UA / MQTT pub-sub gateways while staying within legacy firmware investment.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MPC870CZT66 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MPC870CZT80 | MPC870CVR66 | MPC875ZT66 |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 256-PBGA (23x23 mm) | 256-PBGA (23x23 mm) - same | 256-PBGA (23x23 mm) - same | 256-PBGA (23x23 mm) - same |
| Core Clock | 66 MHz | 80 MHz | 66 MHz | 66 MHz |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Core Architecture | PowerQUICC MPC8xx (Power Architecture) | PowerQUICC MPC8xx (Power Architecture) | PowerQUICC MPC8xx (Power Architecture) | PowerQUICC MPC8xx (Power Architecture) |
| Operating Temperature | -40C to +100C | -40C to +100C | -40C to +100C | -40C to +100C |
| Ethernet MAC | 10/100 integrated | 10/100 integrated | 10/100 integrated | 10/100 integrated + ATM |
| USB Support | No | No | No | Yes (USB function) |
Wichtigste Unterscheidungsmerkmale
- Integrated 10/100 Ethernet MAC + CPM in a single chip (vs. MPC860 family (357-BGA))
- 66 MHz speed grade with industrial -40C to +100C temperature spec (vs. MPC870CZT80 (80 MHz speed grade))
- No USB, ATM, or additional SCC channels (vs. MPC875ZT66 (richer peripherals))
Designhinweise
The 256-PBGA 23x23 mm package requires a 4-6 layer PCB with matched-impedance routing on the external memory bus. Place 10uF + 0.1uF decoupling pairs on every Vdd ball of the BGA, with vias stitching the inner ground planes directly under the die to provide a low-impedance return path for the 66 MHz core and DMA bursts. Keep the external memory bus length-matched within +/- 250 mil to avoid setup/hold violations on the SDRAM interface.
Estimated: at typical 1.5 W dissipation in a sealed industrial enclosure, the 256-PBGA's theta_JA of roughly 20-25 C/W (with thermal vias) yields a 30-50 C junction rise. For fanless designs, place a continuous ground-pour thermal pad beneath the BGA with stitched thermal vias to the opposite-side copper pour to keep Tj below 100C at +70C ambient. Derate by an additional 25% for fully sealed IP65 enclosures.
Do not assume the 256-BGA footprint of the MPC870 family matches all other MPC8xx PBGA variants; the MPC860 family uses a different 357-BGA pattern. The leading 'ZT' versus 'VR' suffix encodes speed and temperature grades - ZT implies industrial-grade, VR commercial-grade - and substituting across suffixes without checking the datasheet suffix table can violate thermal or timing specs. Always validate JTAG COP pins and the reset configuration word before bringing up the first board.
Compliance-Informationen
RoHS compliant per NXP product page. AEC-Q100 not applicable - this MPU is not automotive grade. Lifecycle status is NRND per NXP product database as of 2026-10-16.