MPC885CVR133 - PowerQUICC 32-Bit MPU, 133MHz, 357-PBGA | NXP
Teilenummer: MPC885CVR133 ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $57.2263 | $57,23 |
| 10 | $51.5 | $515,00 |
| 100 | $46.2 | $4.620,00 |
| 500 | $41.8 | $20.900,00 |
| 1.000 | $37.95 | $37.950,00 |
MPC885CVR133 Übersicht
What is a PowerQUICC communications processor? A PowerQUICC (pronounced "power-quick") is an integrated communications processor family from NXP/Freescale that embeds a Power Architecture CPU core alongside communications-engineering modules - typically including a CPM (Communications Processor Module), ATM and Ethernet controllers, HDLC channels, and time-slot assigners - to offload protocol processing from the main core. PowerQUICC devices sit within the broader taxonomy of embedded processors -> microprocessors (MPU) -> 32-bit MPU -> communications processor -> PowerQUICC family, and are commonly classified under power management and embedded system design.
Key features of the MPC885CVR133 include a 133 MHz core clock, 32-bit data bus, integrated communications peripheral module, dual 10/100 Mbps Ethernet MAC, dual UART, I2C, SPI, PCMCIA interface, and 16-bit memory controller supporting SDRAM, SRAM, and ROM. The device operates from a -40C to +100C industrial temperature range and is supplied in a 357-ball Plastic BGA (PBGA) package.
Architecturally, the MPC885CVR133 combines the MPC8xx core with a separate RISC-based CPM that handles serial and networking protocols in hardware, freeing the main core for application-layer processing. This dual-processor architecture delivers high sustained throughput on telecom and datacom workloads while keeping the part within a single-chip BOM.
Typical applications include SOHO and SMB routers, DSL modems, wireless LAN access points, industrial gateways, VoIP media gateways, and embedded serial communications controllers. The wide peripheral integration makes it suitable for legacy telecom infrastructure as well as industrial control nodes.
When laying out a board for the MPC885CVR133, designers must pay close attention to the 357-ball PBGA fanout, provide solid ground and power planes, and ensure the 133 MHz core clock is routed with controlled impedance and minimal skew. Decoupling bulk and ceramic capacitors must be placed close to each power/ball to suppress switching noise from the CPM.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes that go beyond what the manufacturer datasheet alone provides.
Drop-in-Alternativen für MPC885CVR133 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MPC885CVR133 (gleiche Bauform und Footprint) – abweichend in Core Architecture, Manufacturer, Lifecycle Status, Package, RoHS Status.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MPC885VR133
✅ Drop-In✓ Auf Lager
$27.4 / Stück
Datenblatt ansehen →MPC880VR133
✅ Drop-In✓ Auf Lager
$19.45 / Stück
Datenblatt ansehen →MPC885CVR133 Grenzwerte & elektrische Eigenschaften
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Part Number | MPC885CVR133 |
| Series | PowerQUICC, MPC8xx |
| Core Architecture | Power Architecture (MPC8xx) |
| Core Clock Speed | 133 MHz |
| Performance | 176 MIPS |
| Datenbusbreite | 32 bit |
| Number of Cores | 1 |
| Betriebstemperatur | -40C to +100C |
| Gehäuse | 357-PBGA (25x25 mm) |
| Montageart | Surface Mount (BGA) |
| Ethernet MAC | Dual 10/100 Mbps (per family datasheet) |
| Memory Controller | 16-bit, supports SDRAM/SRAM/ROM (per family datasheet) |
| Lebenszyklusstatus | End of Life (discontinued per NXP product page) |
| RoHS-Status | Not detected (non-RoHS variant per DigiKey) |
MPC885CVR133 357-pbga (25x25 mm) Pinbelegungsleitfaden
Pinbelegung für MPC885CVR133 (357-pbga (25x25 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MPC885CVR133.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MPC885CVR133 ist geeignet für 6 Anwendungs: SOHO / SMB Routers, DSL / Cable Modem CPE, VoIP Media Gateways, Industrial Serial Communication Controllers, Wireless LAN Access Points, Legacy Telecom Infrastructure.
SOHO / SMB Routers
The MPC885CVR133 is well-suited to small-office/home-office routers because its dual 10/100 Ethernet MACs and integrated CPM offload NAT, firewall, and PPPoE processing in hardware. The 133 MHz Power Architecture core sustains up to 176 MIPS for routing-table lookups and web-management interfaces, while the CPM frees the core from HDLC/ATM framing. Typical designs pair the MPC885 with an external PHY and SDRAM; PCB space savings versus a CPU-plus-discrete-MAC architecture can exceed 40%. Power is typically delivered from a 3.3V rail with a switching regulator for the core.
Empfohlen
DSL / Cable Modem CPE
In DSL and cable CPE, the MPC885CVR133 acts as the central processor connecting the line interface (ADSL/VDSL transceiver) to the customer-premises Ethernet/Wi-Fi network. The CPM's ATM and HDLC channels directly drive DSL framing, offloading the main core so it can run the customer's management plane and routing stack. 133 MHz provides sufficient headroom for firewall and QoS, while the 357-BGA package suits the small-form-factor CPE enclosures. Typical BOM partners include external SDRAM, a serial configuration flash, and a Wi-Fi module.
Empfohlen
VoIP Media Gateways
VoIP media gateways benefit from the MPC885CVR133 because the CPM provides hardware TDM time-slot assigners and HDLC channels that interface directly to digital telecom framers. The 133 MHz core runs the VoIP signalling (SIP/H.323) and codec stack (G.711/G.729), while the CPM handles the physical-layer TDM. This split keeps latency low and deterministic. Designs typically add an external DSP for echo cancellation, plus SLIC/SLAC devices on the analog line side.
Empfohlen
Industrial Serial Communication Controllers
The MPC885CVR133 fits industrial serial communications nodes because its CPM provides multi-channel HDLC, UART, and bisync ports with hardware DMA. The -40C to +100C industrial temperature range matches factory-floor enclosures, and the 357-BGA package supports ruggedized PCB designs with via-in-pad and thick copper. The 133 MHz core runs Modbus/Profibus/EtherNet/IP gateway firmware, while the CPM handles the bit-banging of serial protocols in hardware. Typical pairings include RS-485 transceivers and an isolated DC-DC supply.
Empfohlen
Wireless LAN Access Points
Enterprise and SMB wireless access points use the MPC885CVR133 to bridge a Wi-Fi MAC/PHY module to the wired Ethernet backbone. The dual Ethernet MACs allow separate wired-uplink and daisy-chain ports, while the 133 MHz Power Architecture core runs the AP management, RADIUS client, and WPA2 enterprise authentication. The CPM is available for serial console, I2C sensor polling, and SPI host connectivity to the radio module. Typical designs add a small ARM-based Wi-Fi SoC and external SDRAM.
Empfohlen
Legacy Telecom Infrastructure
The MPC885CVR133 supports legacy telecom infrastructure such as T1/E1 channel banks, ISDN PRI termination, and PBX line cards. The CPM's TDM highway and HDLC controllers map directly onto T1/E1 framers (e.g., DS21Q59), while the 133 MHz core handles call-control and signalling. Because the part is end-of-life, customers typically only deploy it as a like-for-like replacement on existing fielded systems. Repair and maintenance depots keep stock for these service contracts.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MPC885CVR133 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MPC885VR133 | MPC880VR133 | MPC860CVR133 |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | Power Architecture (MPC8xx) | Power Architecture (MPC8xx) | Power Architecture (MPC8xx) | Power Architecture (MPC8xx) |
| Core Clock | 133 MHz | 133 MHz | 133 MHz | 133 MHz |
| CPM (Communications Processor Module) | Yes (HDLC/ATM/Ethernet offload) | Yes (HDLC/ATM/Ethernet offload) | No (CPU only) | Yes |
| Lifecycle Status | End of Life | End of Life | End of Life | End of Life |
Wichtigste Unterscheidungsmerkmale
- Integrated CPM for hardware protocol offload (vs. MPC880VR133)
- Drop-in same-package compatibility within the MPC885 family (vs. MPC885VR133)
- Industry-standard PowerQUICC architecture (vs. MPC860CVR133)
Designhinweise
The 357-ball PBGA at 1.27 mm pitch requires via-in-pad or dog-bone fanout; use 0.2 mm microvias on the top layer with a 4-6 mil plating stub to minimize inductance. Place 0.1 uF X7R ceramic decoupling within 100 mil of every power/ground ball pair, with bulk 10 uF tantalum or polymer capacitors on each rail. Solid uninterrupted ground and power planes directly under the BGA are essential to suppress CPM switching noise that would otherwise couple into the analog PLL supply.
Route the 133 MHz SYSCLK with controlled 50 ohm microstrip impedance and match trace lengths within 50 mil to the CLKOUT pin pair to preserve duty cycle. The analog PLL supply (AVDD) should be filtered through a ferrite bead and 10 uF + 0.1 uF decoupling, with the analog ground return isolated from the digital ground return inside the BGA cavity. Keep all high-speed Ethernet signals (MII/RMII) on the top layer with continuous reference ground beneath, never crossing a power-plane split.
Estimated: at 3.3V core supply drawing approximately 1W under full CPM load, the 357-PBGA package yields a theta_JA near 20 C/W on a 4-layer JEDEC board, giving a junction rise of about 20C above ambient. Industrial -40C to +100C operation typically requires only modest airflow, but designs in enclosed housings should add a thermal pad soldered to a copper pour for additional heat spreading. Use the on-chip thermal sensor (if enabled) to throttle CPM throughput under overtemperature conditions.
Do not assume the MPC880 is a drop-in for the MPC885 - the MPC880 omits the CPM, so any code that relies on the CPM's HDLC/ATM/Ethernet offload will fail silently. Always validate the boot ROM contents and BCSR (Bus Configuration) registers against the specific silicon revision, as the MPC885 family has multiple mask updates over its lifetime. Finally, ensure the SDRAM clock delay-locked loop (DLL) is initialized in the recommended sequence; skipping this step produces intermittent memory failures that look like bad solder joints.
Compliance-Informationen
Per DigiKey product page (955074) the MPC885CVR133 variant is not detected as RoHS - the C-suffix parts predate lead-free conversion. For RoHS-compliant equivalents choose the VR133 variant. REACH compliance is presumed as standard NXP EU compliance.
