MSC8103M1100F - SC140 DSP 275MHz | NXP | 332-FCBGA
Teilenummer: MSC8103M1100F ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $102.45 | $102,45 |
| 10 | $95.2 | $952,00 |
| 100 | $78.4 | $7.840,00 |
| 500 | $65.1 | $32.550,00 |
| 1.000 | $54.8 | $54.800,00 |
MSC8103M1100F Übersicht
Key features include a 275 MHz SC140 DSP core, 512 KB on-chip RAM, and a powerful CPM that supports MCC, UART, HDLC, Transparent, Ethernet, Fast Ethernet, and ATM protocols. The peripheral set adds 3 x FCC, 2 x MCC, 4 x SCC, 2 x SMC, plus SPI, I2C, UTOPIA, MII, an interrupt controller, timers, and parallel I/O. Two SDMA RISC engines and a 64-bit dual-ported RAM bridge accelerate data movement between the core and peripherals.
Technically, the part is built on a 0.13 um CMOS process and uses a Harvard-style SC140 architecture with four 16-bit ALUs per ALU core for sustained 4-way SIMD on telecom arithmetic kernels. The CPM offloads the DSP by terminating layer-2 frames (HDLC, Ethernet), so the SC140 core stays focused on voice/video compression and signal processing while the CPM handles the byte-level protocol work.
Typical applications include multi-channel voice-over-IP gateways, DSLAM line cards, wireless base-station channel cards, and protocol-engines for Layer-2 aggregation. The UTOPIA interface also allows direct attachment to ATM SAR devices for legacy DSL and 3G backhaul designs.
When designing with this part, be mindful that the 332-FCBGA package requires a multi-layer PCB with controlled-impedance traces and matched-length routing for the SDRAM interface. JTAG boundary-scan is mandatory for production test; plan fixture access early.
This page synthesizes distributor pricing, parametric comparison, and drop-in alternatives not found in the manufacturer datasheet, making it useful for engineers who need to qualify a second source or replace an obsolete board.
Engineers evaluating the MSC8103M1100F for new designs should also consider the newer MSC8144 (SC3400) family for higher throughput. However, the MSC8103M1100F remains a cost-effective, mature choice for legacy telecom and industrial DSP implementations where software IP has already been validated.
Drop-in-Alternativen für MSC8103M1100F – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MSC8103M1100F (gleiche Bauform und Footprint) – abweichend in Mounting Type, Package / Case.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MSC8103M1200F
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$65.4 / Stück
Datenblatt ansehen →MSC8103M1000F
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MSC8103M1100AF
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MSC8103M1100A
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MSC8103M1100F Technische Daten
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Product Type | Network Digital Signal Processor (DSP) |
| DSP Core | StarCore SC140 |
| Core Clock Frequency | 275 MHz |
| Datenbusbreite | 16-bit |
| On-Chip RAM | 512 KB |
| Non-Volatile Memory | External |
| Interface / Module | Communications Processor Module (CPM) |
| Serial Interfaces | 3 x FCC, 4 x SCC, 2 x MCC, 2 x SMC, SPI, I2C |
| Network Protocols | UART, HDLC, Transparent, Ethernet, Fast Ethernet, ATM |
| External Bus | UTOPIA, MII |
| DMA Engines | 2 x SDMA RISC, 64-bit dual-ported RAM bridge |
| Gehäuse / Bauform | 332-FCBGA (17x17 mm) |
| Montageart | Surface Mount (BGA) |
| Packaging | Tray |
MSC8103M1100F 332-fcbga (17x17 mm) Pinbelegungsleitfaden
Pinbelegung für MSC8103M1100F (332-fcbga (17x17 mm)-Gehäuse). Pin-Nummerierung, Funktionen und Anschlussdiagramme sind im Herstellerdatenblatt definiert. Entnehmen Sie diesem den genauen Footprint und Lötrichtlinien.
Keine detaillierten Pinbelegungsdaten verfügbar für MSC8103M1100F.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MSC8103M1100F ist geeignet für 6 Anwendungs: VoIP Gateway / Media Gateway, DSLAM Line Card Modem Pool, Wireless Base-Station Channel Card, Protocol Engine / Layer-2 Aggregation, Industrial Multi-Channel Motor / Voice Processing, Legacy Telecom / Voice Processing Reference Design.
VoIP Gateway / Media Gateway
The MSC8103M1100F's combination of a 275 MHz SC140 DSP core with an integrated Communications Processor Module makes it well-suited for VoIP and media gateways that must terminate hundreds of TDM/Ethernet channels in parallel. The CPM handles HDLC and Ethernet framing while the SC140 runs G.711/G.729/GSM codec algorithms. Per chipdig.com the CPM supports MCC, UART, HDLC, Transparent, Ethernet, Fast Ethernet, and ATM, so the same design can be reused across TDM, IP, and ATM backhaul products, and the 512 KB on-chip RAM holds several milliseconds of voice jitter buffer without external SRAM.
Empfohlen
DSLAM Line Card Modem Pool
In DSLAM line cards and next-generation broadband aggregators, the MSC8103M1100F executes xDSL codec routines, channel equalization, and bit-loading algorithms using the SC140's quad-ALU SIMD capabilities. The CPM terminates multiple ATM AAL5 channels per DSP, sharing upstream TDM buses via UTOPIA. The 64-bit dual-ported RAM bridge provides high-throughput sample transfers between the DSP and the CPM, and the 17 mm x 17 mm FCBGA332 footprint fits the dense line-card form factors of central-office shelves.
Empfohlen
Wireless Base-Station Channel Card
Wireless base-station channel cards deploy the MSC8103M1100F for channel filtering, pulse shaping, and voice/speech transcoding between the RF front end and the backhaul network. The SC140 SIMD lanes accelerate viterbi, turbo, and AMR-WB codecs directly, while the CPM offloads layer-2 transport (Ethernet/ATM) so the DSP remains free for physical-layer processing. Per the datasheet, the CPM exposes 3 x FCC plus 4 x SCC, enabling redundant links to the BTS backhaul without a separate serial controller chip.
Empfohlen
Protocol Engine / Layer-2 Aggregation
The MSC8103M1100F functions as a protocol engine in multi-service aggregation routers, performing layer-2/3 classification, HDLC/PPP termination, and traffic-shaping in software. The CPM's hardware assist for HDLC, Transparent, and ATM eliminates firmware-state-machine overhead, so the SC140 is fully available for routing and QoS processing. The MII and UTOPIA interfaces connect directly to external PHYs and ATM SAR devices, removing glue logic on the PCB.
Empfohlen
Industrial Multi-Channel Motor / Voice Processing
Industrial platforms repurposing the MSC8103M1100F for multi-channel motor-control or voice-announcement systems benefit from the SC140 SIMD engine and the rich serial peripheral set. SPI and I2C ports connect to sensor and audio DAC chains, while the parallel I/O and timers handle synchronisation. The 512 KB on-chip RAM allows dozens of channel state machines to coexist with DSP filter banks.
Empfohlen
Legacy Telecom / Voice Processing Reference Design
Engineers maintaining legacy telecom reference designs continue to choose the MSC8103M1100F because mature firmware and reference designs are widely available. The CPM supports TDM buses via MCC channels for backplane connection, and the 64-bit dual-ported RAM bridge keeps the SDRAM interface efficient even at 275 MHz. The 332-FCBGA package requires controlled-impedance PCB layout but is well documented in the manufacturer's reference design notes.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MSC8103M1100F – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MSC8103M1200F | MSC8103M1000F | MSC8103M1100AF | MSC8103M1100A | MSC8144ETVT1000B |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| DSP Core | SC140 StarCore | SC140 StarCore | SC140 StarCore | SC140 StarCore | SC140 StarCore | SC3400 StarCore |
| Core Clock Frequency | 275 MHz | 300 MHz | 250 MHz | 275 MHz | 275 MHz | 1 GHz |
| Communications Processor Module | Yes (CPM with HDLC/Ethernet/ATM) | Yes (same CPM) | Yes (same CPM) | Yes (same CPM) | Yes (same CPM) | Different peripheral set |
| Data Bus Width | 16-bit | 16-bit | 16-bit | 16-bit | 16-bit | 32-bit |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Wichtigste Unterscheidungsmerkmale
- Integrates CPM with HDLC/Ethernet/ATM acceleration directly on-die (vs. MSC8101 (no CPM))
- Highest 275 MHz speed grade with mature firmware availability (vs. MSC8144ETVT1000B (SC3400 core))
- 512 KB on-chip RAM reduces external memory cost (vs. DSPs with no on-chip RAM)
Designhinweise
The 332-FCBGA package (17x17 mm) requires microvia PCB technology (laser-drilled stacked vias on the breakout layer) because 0.8 mm pitch BGA balls cannot be reliably hand-routed. Per the manufacturer datasheet, designers should use a 4-6-4 (or higher) layer stack-up with dedicated ground and 1.8V/3.3V power planes beneath the BGA, and route matched-length traces on the SDRAM interface to meet the SDMA timing budget at 275 MHz.
Estimated: at full 275 MHz core activity with all CPM peripherals enabled, the MSC8103M1100F typically dissipates 1.5-2.5 W. Designers should provide a continuous copper thermal pad on the top layer beneath the BGA (per the manufacturer's reference design) and avoid stacking tall heatsinks that interfere with the system-level air channel. For fanless deployments, derate the ambient to 70 C or lower.
Because all MSC8103 speed grades share the same FCBGA332 footprint, engineers sometimes assume MSC8103M1200F (300 MHz) is a free upgrade; in practice the higher speed grade tightens timing closure for the SDRAM interface, and boards laid out for 275 MHz may not pass production at 300 MHz without re-tuning the SDRAM trace lengths. Conversely, stepping down to MSC8103M1000F is usually safe but reduces DSP throughput by 9%.
Long BGA breakout traces between the SC140 DSP core and SDRAM are the largest source of SI issues on MSC8103 boards. Per the manufacturer datasheet, use short breakouts on the top layer with reference changes minimised; place a 4.7 ohm series damping resistor at the SDRAM clock driver if the net length exceeds 30 mm. Always validate with TDR measurements on first builds.
Compliance-Informationen
RoHS / lead-free / REACH status not present in the verified web data. The part is marked obsolete by NXP; consult the manufacturer datasheet or contact NXP for up-to-date compliance statements.
