MSC8103M1100F - SC140 DSP 275MHz | NXP | 332-FCBGA
부품 번호: MSC8103M1100F ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $102.45 | $102.45 |
| 10 | $95.2 | $952.00 |
| 100 | $78.4 | $7,840.00 |
| 500 | $65.1 | $32,550.00 |
| 1,000 | $54.8 | $54,800.00 |
MSC8103M1100F 개요
Key features include a 275 MHz SC140 DSP core, 512 KB on-chip RAM, and a powerful CPM that supports MCC, UART, HDLC, Transparent, Ethernet, Fast Ethernet, and ATM protocols. The peripheral set adds 3 x FCC, 2 x MCC, 4 x SCC, 2 x SMC, plus SPI, I2C, UTOPIA, MII, an interrupt controller, timers, and parallel I/O. Two SDMA RISC engines and a 64-bit dual-ported RAM bridge accelerate data movement between the core and peripherals.
Technically, the part is built on a 0.13 um CMOS process and uses a Harvard-style SC140 architecture with four 16-bit ALUs per ALU core for sustained 4-way SIMD on telecom arithmetic kernels. The CPM offloads the DSP by terminating layer-2 frames (HDLC, Ethernet), so the SC140 core stays focused on voice/video compression and signal processing while the CPM handles the byte-level protocol work.
Typical applications include multi-channel voice-over-IP gateways, DSLAM line cards, wireless base-station channel cards, and protocol-engines for Layer-2 aggregation. The UTOPIA interface also allows direct attachment to ATM SAR devices for legacy DSL and 3G backhaul designs.
When designing with this part, be mindful that the 332-FCBGA package requires a multi-layer PCB with controlled-impedance traces and matched-length routing for the SDRAM interface. JTAG boundary-scan is mandatory for production test; plan fixture access early.
This page synthesizes distributor pricing, parametric comparison, and drop-in alternatives not found in the manufacturer datasheet, making it useful for engineers who need to qualify a second source or replace an obsolete board.
Engineers evaluating the MSC8103M1100F for new designs should also consider the newer MSC8144 (SC3400) family for higher throughput. However, the MSC8103M1100F remains a cost-effective, mature choice for legacy telecom and industrial DSP implementations where software IP has already been validated.
드롭인 대체품: MSC8103M1100F — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MSC8103M1100F (동일 폼 팩터 및 풋프린트) — 차이점: Mounting Type, Package / Case.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MSC8103M1200F
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$65.4 / 개
데이터시트 보기 →MSC8103M1000F
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MSC8103M1100AF
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MSC8103M1100A
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MSC8103M1100F 사양
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Product Type | Network Digital Signal Processor (DSP) |
| DSP Core | StarCore SC140 |
| Core Clock Frequency | 275 MHz |
| 데이터 버스 폭 | 16-bit |
| On-Chip RAM | 512 KB |
| Non-Volatile Memory | External |
| Interface / Module | Communications Processor Module (CPM) |
| Serial Interfaces | 3 x FCC, 4 x SCC, 2 x MCC, 2 x SMC, SPI, I2C |
| Network Protocols | UART, HDLC, Transparent, Ethernet, Fast Ethernet, ATM |
| External Bus | UTOPIA, MII |
| DMA Engines | 2 x SDMA RISC, 64-bit dual-ported RAM bridge |
| 패키지 / 케이스 | 332-FCBGA (17x17 mm) |
| 실장 유형 | Surface Mount (BGA) |
| Packaging | Tray |
MSC8103M1100F 332-fcbga (17x17 mm) 핀 구성 가이드
MSC8103M1100F(332-fcbga (17x17 mm) 패키지)의 핀 구성입니다. 핀 번호, 기능, 연결 다이어그램은 제조사 데이터시트에 정의되어 있습니다. 정확한 풋프린트와 솔더링 지침은 해당 문서를 참조하십시오.
다음에 대한 상세 핀아웃 데이터 없음: MSC8103M1100F.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MSC8103M1100F 적합 용도: 6 애플리케이션s: VoIP Gateway / Media Gateway, DSLAM Line Card Modem Pool, Wireless Base-Station Channel Card, Protocol Engine / Layer-2 Aggregation, Industrial Multi-Channel Motor / Voice Processing, Legacy Telecom / Voice Processing Reference Design.
VoIP Gateway / Media Gateway
The MSC8103M1100F's combination of a 275 MHz SC140 DSP core with an integrated Communications Processor Module makes it well-suited for VoIP and media gateways that must terminate hundreds of TDM/Ethernet channels in parallel. The CPM handles HDLC and Ethernet framing while the SC140 runs G.711/G.729/GSM codec algorithms. Per chipdig.com the CPM supports MCC, UART, HDLC, Transparent, Ethernet, Fast Ethernet, and ATM, so the same design can be reused across TDM, IP, and ATM backhaul products, and the 512 KB on-chip RAM holds several milliseconds of voice jitter buffer without external SRAM.
추천
DSLAM Line Card Modem Pool
In DSLAM line cards and next-generation broadband aggregators, the MSC8103M1100F executes xDSL codec routines, channel equalization, and bit-loading algorithms using the SC140's quad-ALU SIMD capabilities. The CPM terminates multiple ATM AAL5 channels per DSP, sharing upstream TDM buses via UTOPIA. The 64-bit dual-ported RAM bridge provides high-throughput sample transfers between the DSP and the CPM, and the 17 mm x 17 mm FCBGA332 footprint fits the dense line-card form factors of central-office shelves.
추천
Wireless Base-Station Channel Card
Wireless base-station channel cards deploy the MSC8103M1100F for channel filtering, pulse shaping, and voice/speech transcoding between the RF front end and the backhaul network. The SC140 SIMD lanes accelerate viterbi, turbo, and AMR-WB codecs directly, while the CPM offloads layer-2 transport (Ethernet/ATM) so the DSP remains free for physical-layer processing. Per the datasheet, the CPM exposes 3 x FCC plus 4 x SCC, enabling redundant links to the BTS backhaul without a separate serial controller chip.
추천
Protocol Engine / Layer-2 Aggregation
The MSC8103M1100F functions as a protocol engine in multi-service aggregation routers, performing layer-2/3 classification, HDLC/PPP termination, and traffic-shaping in software. The CPM's hardware assist for HDLC, Transparent, and ATM eliminates firmware-state-machine overhead, so the SC140 is fully available for routing and QoS processing. The MII and UTOPIA interfaces connect directly to external PHYs and ATM SAR devices, removing glue logic on the PCB.
추천
Industrial Multi-Channel Motor / Voice Processing
Industrial platforms repurposing the MSC8103M1100F for multi-channel motor-control or voice-announcement systems benefit from the SC140 SIMD engine and the rich serial peripheral set. SPI and I2C ports connect to sensor and audio DAC chains, while the parallel I/O and timers handle synchronisation. The 512 KB on-chip RAM allows dozens of channel state machines to coexist with DSP filter banks.
추천
Legacy Telecom / Voice Processing Reference Design
Engineers maintaining legacy telecom reference designs continue to choose the MSC8103M1100F because mature firmware and reference designs are widely available. The CPM supports TDM buses via MCC channels for backplane connection, and the 64-bit dual-ported RAM bridge keeps the SDRAM interface efficient even at 275 MHz. The 332-FCBGA package requires controlled-impedance PCB layout but is well documented in the manufacturer's reference design notes.
추천
추천 제품 요약
엔지니어링 참조 데이터: MSC8103M1100F — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MSC8103M1200F | MSC8103M1000F | MSC8103M1100AF | MSC8103M1100A | MSC8144ETVT1000B |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| DSP Core | SC140 StarCore | SC140 StarCore | SC140 StarCore | SC140 StarCore | SC140 StarCore | SC3400 StarCore |
| Core Clock Frequency | 275 MHz | 300 MHz | 250 MHz | 275 MHz | 275 MHz | 1 GHz |
| Communications Processor Module | Yes (CPM with HDLC/Ethernet/ATM) | Yes (same CPM) | Yes (same CPM) | Yes (same CPM) | Yes (same CPM) | Different peripheral set |
| Data Bus Width | 16-bit | 16-bit | 16-bit | 16-bit | 16-bit | 32-bit |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Integrates CPM with HDLC/Ethernet/ATM acceleration directly on-die (vs MSC8101 (no CPM))
- Highest 275 MHz speed grade with mature firmware availability (vs MSC8144ETVT1000B (SC3400 core))
- 512 KB on-chip RAM reduces external memory cost (vs DSPs with no on-chip RAM)
설계 노트
The 332-FCBGA package (17x17 mm) requires microvia PCB technology (laser-drilled stacked vias on the breakout layer) because 0.8 mm pitch BGA balls cannot be reliably hand-routed. Per the manufacturer datasheet, designers should use a 4-6-4 (or higher) layer stack-up with dedicated ground and 1.8V/3.3V power planes beneath the BGA, and route matched-length traces on the SDRAM interface to meet the SDMA timing budget at 275 MHz.
Estimated: at full 275 MHz core activity with all CPM peripherals enabled, the MSC8103M1100F typically dissipates 1.5-2.5 W. Designers should provide a continuous copper thermal pad on the top layer beneath the BGA (per the manufacturer's reference design) and avoid stacking tall heatsinks that interfere with the system-level air channel. For fanless deployments, derate the ambient to 70 C or lower.
Because all MSC8103 speed grades share the same FCBGA332 footprint, engineers sometimes assume MSC8103M1200F (300 MHz) is a free upgrade; in practice the higher speed grade tightens timing closure for the SDRAM interface, and boards laid out for 275 MHz may not pass production at 300 MHz without re-tuning the SDRAM trace lengths. Conversely, stepping down to MSC8103M1000F is usually safe but reduces DSP throughput by 9%.
Long BGA breakout traces between the SC140 DSP core and SDRAM are the largest source of SI issues on MSC8103 boards. Per the manufacturer datasheet, use short breakouts on the top layer with reference changes minimised; place a 4.7 ohm series damping resistor at the SDRAM clock driver if the net length exceeds 30 mm. Always validate with TDR measurements on first builds.
규정 준수 정보
RoHS / lead-free / REACH status not present in the verified web data. The part is marked obsolete by NXP; consult the manufacturer datasheet or contact NXP for up-to-date compliance statements.
