MTC40F2046S1RC56BD1-TR 64GB DDR5-5600 ECC RDIMM | Micron
Teilenummer: MTC40F2046S1RC56BD1-TR ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $269 | $2.690,00 |
| 100 | $245 | $24.500,00 |
| 500 | $229 | $114.500,00 |
| 1.000 | $215 | $215.000,00 |
MTC40F2046S1RC56BD1-TR Übersicht
A DDR5 RDIMM (Registered Dual In-line Memory Module) is a type of server-class DRAM module distinguished from unbuffered UDIMMs by an on-board register clock driver (RCD) that buffers command, address, and control signals between the host memory controller and the DRAM devices. RDIMMs sit in the hierarchy: DRAM device -> DRAM module -> RDIMM -> server memory subsystem, and are the dominant form factor in enterprise and cloud servers because the register buffer enables higher module densities and improved signal integrity at DDR5 data rates. The module integrates ECC (x80, 72-bit data plus 8-bit ECC) for single-bit error correction and multi-bit error detection.
Key features include 64GB total capacity, 2Rx4 dual-rank architecture (10x4 device organization), on-module voltage regulation via the DDR5 12 V power management IC, a 288-pin edge connector, and on-die thermal sensors compatible with the JEDEC TSE2004 specification. The 5600 MT/s speed grade places the module in the mainstream DDR5 performance band, balancing bandwidth and power efficiency for general-purpose compute workloads.
Technically, the module uses Micron's 1z-generation monolithic DDR5 DRAM die, paired with an on-module PMIC that converts the host-supplied 12 V rail to the voltages required by the DRAM array and RCD. The register buffer reduces stub length and signal loading, enabling the host to populate more DIMM slots per channel than UDIMMs without violating signal-integrity margins. ECC bits provide a Hamming-code-style correction path that is transparent to the application software but critical for hyperscale uptime.
Typical applications include enterprise rack servers, AI training and inference nodes, virtualization hosts, in-memory databases, and high-performance computing clusters. The 64GB density point is the most widely ordered SKU for two-socket and four-socket mainstream servers using Intel Xeon 6 or AMD EPYC 9005-series platforms, where 12 or 24 DIMM slots are commonly populated.
When designing with this module, verify that the platform's memory controller and BIOS support DDR5-5600 speed at the chosen slot population (1DPC vs 2DPC); 2 DIMMs per channel typically downshifts to DDR5-4400 or DDR5-4800. Ensure chassis airflow meets the module's thermal profile, as DDR5 RDIMMs dissipate more heat per DIMM than DDR4 predecessors because the PMIC is on-module rather than on the motherboard VR.
This page synthesizes distributor pricing, JEDEC speed-bin context, and drop-in 64GB DDR5-5600 ECC RDIMM alternatives from Samsung and SK Hynix not consolidated on any single manufacturer datasheet, providing a single-page engineering reference for procurement and qualification engineers.
Drop-in-Alternativen für MTC40F2046S1RC56BD1-TR – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MTC40F2046S1RC56BD1-TR (gleiche Bauform und Footprint) – abweichend in ECC Support, Memory Type, On-Module PMIC.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MTC40F2046S1RC56BG1
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MTC40F2046S1RC56BD1
✅ Drop-In✓ Auf Lager
$425.75 / Stück
Datenblatt ansehen →M321R8GA0BB0-CQK
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
HMCG94AGBRA185N
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
SFPE32G31B01C
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MTC40F2046S1RC56BD1-TR Grenzwerte & elektrische Eigenschaften
| Speichertyp | DDR5 SDRAM |
| Module Type | RDIMM (Registered DIMM) |
| Capacity | 64 GB |
| Data Width | x80 (72-bit data + 8-bit ECC) |
| Rank Organization | 2Rx4 (Dual Rank, 10x4 device stack) |
| Speed Grade | PC5-44800 / 5600 MT/s |
| CAS-Latenz | CL46 |
| Operating Voltage | 1.1 V (DDR5 standard), 12 V on-module PMIC input |
| Pin-Anzahl | 288 |
| Form Factor | RDIMM (server DIMM) |
| ECC Support | Yes (Single-bit correction, multi-bit detection) |
| On-Module PMIC | Yes (DDR5 12 V) |
| Thermal Sensor | Yes (JEDEC TSE2004 compatible) |
| JEDEC Compliance | JEDEC DDR5 |
| Packaging | Tape & Reel (TR suffix) |
| RoHS-Status | Compliant |
| Lead-Free | Yes |
MTC40F2046S1RC56BD1-TR standard Pinbelegungsleitfaden
Pinbelegung für MTC40F2046S1RC56BD1-TR (standard-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MTC40F2046S1RC56BD1-TR.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MTC40F2046S1RC56BD1-TR ist geeignet für 6 Anwendungs: Enterprise Rack Servers, AI Training and Inference Nodes, In-Memory Database Servers, High-Performance Computing Clusters, Virtualization Hosts, Cloud Computing Instances.
Enterprise Rack Servers
The MTC40F2046S1RC56BD1-TR is the mainstream memory building block for 2-socket and 4-socket enterprise rack servers running virtualization, ERP, and database workloads. Its 64GB DDR5-5600 ECC RDIMM 2Rx4 specification and 288-pin JEDEC pinout make it compatible with Intel Xeon 6 and AMD EPYC 9005-series platforms, which typically support 12 or 24 DIMM slots per node for up to 1.5TB of system memory. The on-module PMIC reduces motherboard VR design complexity, and the integrated ECC corrects soft-bit errors that would otherwise crash mission-critical applications. Compared to consumer UDIMMs, the registered buffer enables denser population without signal-integrity violations at 5600 MT/s.
Empfohlen
AI Training and Inference Nodes
The MTC40F2046S1RC56BD1-TR suits AI training and inference servers that require large host-memory capacity for dataset staging, model parameter caching, and KV-cache buffering. With 64GB per module and 1DPC 5600 MT/s operation, a 2-socket node with 24 DIMM slots achieves 1.5TB of high-bandwidth memory, which is critical for large language model inference servers with 70B-parameter models. The on-module PMIC and ECC protect against silent data corruption that would degrade model accuracy over multi-day training runs. Compared to lower-density 32GB modules, the 64GB density halves the DIMM count and improves MTBF in production AI clusters.
Empfohlen
In-Memory Database Servers
The MTC40F2046S1RC56BD1-TR is well matched to in-memory database servers running SAP HANA, Redis Enterprise, or Aerospike, where the entire working dataset must reside in DRAM to meet sub-millisecond query latency targets. The 64GB DDR5-5600 ECC RDIMM 2Rx4 specification provides 64GB of addressable memory per slot at 5600 MT/s, which doubles the per-channel bandwidth versus DDR4-3200 RDIMM predecessors. ECC is mandatory for financial and transactional databases where a silent bit flip could corrupt customer balances. The 288-pin JEDEC form factor allows hot-swap upgrade of existing 32GB nodes to 64GB without motherboard replacement.
Empfohlen
High-Performance Computing Clusters
The MTC40F2046S1RC56BD1-TR is selected for HPC cluster nodes running CFD, FEA, weather modeling, and genomics workloads where memory bandwidth and capacity scale linearly with core count. The 5600 MT/s speed and 2Rx4 dual-rank organization deliver approximately 67 GB/s of peak bandwidth per module, which is critical for memory-bandwidth-bound scientific applications. ECC prevents silent corruption that would invalidate long-running simulation results. The JEDEC 288-pin RDIMM form factor allows procurement of multi-vendor equivalents to mitigate DRAM supply shortages.
Empfohlen
Virtualization Hosts
The MTC40F2046S1RC56BD1-TR is widely deployed in virtualization hosts running VMware vSphere, Microsoft Hyper-V, or KVM, where dozens of virtual machines share a single physical server's memory pool. The 64GB capacity per DIMM enables high VM density per host - a 2-socket server with 24 DIMM slots can host 256+ lightweight VMs at 64GB average allocation. The registered buffer isolates command/address loading from the memory controller, which is essential when all 24 slots are populated. ECC corrects the soft-bit errors that are statistically significant across thousands of VM memory pages.
Empfohlen
Cloud Computing Instances
The MTC40F2046S1RC56BD1-TR is deployed in hyperscale cloud computing instances operated by AWS, Azure, Google Cloud, and large colocation providers, where memory-optimized instance families require high-capacity registered memory. The 64GB DDR5-5600 ECC RDIMM 2Rx4 specification is the standard SKU for memory-optimized cloud instances such as AWS R8i or Azure E-series v6. ECC and on-module PMIC are mandatory for multi-tenant cloud workloads where instance isolation and reliability are contractual. The 288-pin JEDEC form factor enables drop-in replacement and capacity upgrade at end-of-life server refresh.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MTC40F2046S1RC56BD1-TR – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MTC40F2046S1RC56BG1 | MTC40F2046S1RC56BD1 | M321R8GA0BB0-CQK | HMCG94AGBRA185N | SFPE32G31B01C |
|---|---|---|---|---|---|---|
| Brand | Micron Technology | Micron Technology | Micron Technology | Samsung Electronics | SK Hynix | Samsung Electronics |
| Package | 288-pin RDIMM | 288-pin RDIMM - same | 288-pin RDIMM - same | 288-pin RDIMM - same | 288-pin RDIMM - same | 288-pin RDIMM - same |
| Capacity | 64 GB | 64 GB | 64 GB | 64 GB | 64 GB | 64 GB |
| Speed Grade | 5600 MT/s (PC5-44800) | 5600 MT/s | 5600 MT/s | 5600 MT/s | 5600 MT/s | 5600 MT/s |
| Rank Organization | 2Rx4 | 2Rx4 | 2Rx4 | 2Rx4 | 2Rx4 | 2Rx4 |
| CAS Latency | CL46 | CL46 | CL46 | CL46 | CL46 | CL46 |
| ECC Support | Yes (x80) | Yes | Yes | Yes | Yes | Yes |
| Operating Voltage | 1.1 V (12 V PMIC input) | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| On-Module PMIC | Yes | Yes | Yes | Yes | Yes | Yes |
| Packaging | Tape & Reel (-TR) | Tray | Tray | Tray | Tray | Tray |
Wichtigste Unterscheidungsmerkmale
- Tape-and-Reel packaging for OEM automation (vs. MTC40F2046S1RC56BD1 (tray version))
- Multi-vendor cross-reference qualification (vs. Single-vendor Micron-only BOM)
- Mainstream 5600 MT/s speed bin for broadest platform support (vs. Faster 6400 MT/s or 7200 MT/s modules)
Designhinweise
DDR5-5600 is the native JEDEC speed for this module only when the memory controller and BIOS are configured for 1 DIMM per channel (1DPC). When the server is populated at 2DPC (2 DIMMs per channel), the speed typically downshifts to DDR5-4400 or DDR5-4800 per the platform specification. Always verify the platform's memory population guide and BIOS memory training before quoting 5600 MT/s on multi-DIMM servers. Population-order restrictions also apply - DIMM slot 1 must be populated before slot 2 on most Intel Xeon 6 platforms.
DDR5 RDIMMs dissipate more heat per DIMM than DDR4 predecessors because the on-module PMIC converts 12 V to the DRAM voltages on the DIMM rather than on the motherboard VR. At 1.1 V operation with 64GB capacity, the MTC40F2046S1RC56BD1-TR typically draws 8-12 W per module under sustained workload. Ensure chassis airflow delivers at least 5 CFM across each DIMM bank at 1DPC, and 8-10 CFM at 2DPC, to keep DIMM thermal sensors below the JEDEC TSE2004 throttle threshold. Hot-aisle/cold-aisle data center layouts should validate DIMM intake temperature stays below 55 C.
For OEM server board designs using the MTC40F2046S1RC56BD1-TR, the 12 V PMIC input must be supplied through a dedicated VR with at least 8 A continuous capability per DIMM socket. The DDR5 register clock driver (RCD) and PMIC both communicate via I2C/I3C for training and telemetry - route these buses away from switching power traces and add 4.7 kohm pull-ups on the I3C SDA/SCL lines. Place 100 nF decoupling capacitors adjacent to every PMIC and RCD supply pin, and follow the Micron PCB layout reference design for trace impedance.
The MTC40F2046S1RC56BD1-TR is qualified for 5600 MT/s operation in JEDEC channel environments. To preserve margin, route the DDR5 byte-lane groups on the motherboard using 85 ohm differential impedance with matched lengths within the byte group (less than 5 mil length mismatch), and minimize via stubs on the address/command bus. The RCD reduces command-loading but does not eliminate address bus signal-integrity concerns, so simulate the channel with the Micron SI tool or vendor IBIS models before committing to layout.
Compliance-Informationen
RoHS and REACH compliant per Micron product page. Not AEC-Q100 qualified (server DRAM modules are not typically AEC-Q100 qualified - this is a data-center server module, not an automotive grade part).
