MTC40F2047S1RC56BB1 - 128GB DDR5-5600 ECC RDIMM 2Rx4 | Micron
Teilenummer: MTC40F2047S1RC56BB1 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $289 | $289,00 |
| 10 | $275 | $2.750,00 |
| 100 | $258 | $25.800,00 |
| 500 | $240 | $120.000,00 |
| 1.000 | $225 | $225.000,00 |
MTC40F2047S1RC56BB1 Übersicht
A RDIMM (Registered DIMM) is a type of server memory module that includes a register buffer between the memory controller and the DRAM chips. This buffer reduces electrical loading on the memory controller, allowing systems to scale to higher memory densities and more DIMMs per channel. RDIMMs are part of the broader DDR5 SDRAM family, succeeding DDR4 with higher per-pin bandwidth, on-die ECC, and improved power efficiency via a 1.1 V supply.
Key features of the MTC40F2047S1RC56BB1 include 128 GB capacity per module, 5600 MT/s transfer rate, 2Rx4 rank and organization, and JEDEC-compliant PC5-44800 specification. The module supports ECC for end-to-end data integrity critical in datacenter and mission-critical workloads. With 288 pins in the standard DDR5 RDIMM edge connector, this module is compatible with server platforms designed for DDR5 RDIMM memory.
The MTC40F2047S1RC56BB1 uses Micron's server-class DDR5 SDRAM devices with PMIC (Power Management IC) on-module, a defining DDR5 feature that improves voltage regulation and power integrity versus DDR4. The registered buffer and on-module thermal sensor enable high-density configurations while maintaining signal integrity at 5600 MT/s operation.
Typical applications include enterprise servers, cloud compute nodes, AI training and inference systems, virtualization hosts, in-memory databases, and high-performance computing clusters. The 128 GB per-module density is ideal for memory-intensive workloads such as SAP HANA, VMware vSAN, and large language model training.
When deploying this module, validate compatibility with your server's qualified parts list (QPL). Mixing modules from different vendors in the same memory bank is generally supported but may trigger warnings in some platforms; check your BIOS for population guidelines and ensure the system firmware is current.
This page synthesizes distributor pricing, drop-in alternatives, and practical deployment guidance not found in the manufacturer datasheet, with cross-references to compatible Micron SKUs (MTC40F2047S1RC56BB1R, MTC40F2047S1RC56BB2, MTC40F2047S1RC56B) sourced from Micron's RDIMM part catalog.
Drop-in-Alternativen für MTC40F2047S1RC56BB1 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MTC40F2047S1RC56BB1R
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MTC40F2047S1RC56BB2
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MTC40F2047S1RC56B
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MTC40F2047S1RC56BB1 Grenzwerte & elektrische Eigenschaften
| Speichertyp | DDR5 SDRAM |
| Module Type | RDIMM (Registered DIMM) |
| Capacity | 128 GB |
| Speed Grade | DDR5-5600 (PC5-44800) |
| Transfer Rate | 5600 MT/s |
| Rank / Organization | 2Rx4 |
| CAS-Latenz | CL46 |
| Operating Voltage | 1.1 V |
| Pin-Anzahl | 288-pin |
| ECC Support | Yes (ECC Registered) |
| Form Factor | DDR5 RDIMM |
| JEDEC Compliance | Yes (PC5-44800) |
| On-module PMIC | Yes (DDR5 standard) |
| Betriebstemperatur | 0C to +85C (server ambient) |
| RoHS-Status | Compliant |
MTC40F2047S1RC56BB1 standard Pinbelegungsleitfaden
Pinbelegung für MTC40F2047S1RC56BB1 (standard-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MTC40F2047S1RC56BB1.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MTC40F2047S1RC56BB1 ist geeignet für 6 Anwendungs: Enterprise Server Main Memory, AI Training and Inference Platforms, Virtualization and Cloud Compute, In-Memory Database Systems, High-Performance Computing Clusters, Data Center Memory Pool Expansion.
Enterprise Server Main Memory
The MTC40F2047S1RC56BB1 is ideal for enterprise server main memory deployments. Its 128 GB per-module capacity enables high-density memory configurations (1 TB+ per socket) while the DDR5-5600 speed (44.8 GB/s per module) feeds modern multi-core CPUs. The registered buffer reduces memory-controller loading, allowing more DIMMs per channel in 1DPC or 2DPC topologies. ECC support ensures end-to-end data integrity critical for production database and virtualization workloads.
Empfohlen
AI Training and Inference Platforms
AI training workloads benefit from the MTC40F2047S1RC56BB1's combination of 128 GB density and DDR5-5600 bandwidth. When paired with GPU systems requiring CPU-side data preparation or parameter servers, this RDIMM delivers sufficient bandwidth (44.8 GB/s per module) to feed modern accelerators. The ECC capability is critical for large-model training integrity, and the high per-module capacity minimizes DIMM-slot consumption in dense AI server chassis.
Empfohlen
Virtualization and Cloud Compute
Virtualization hosts running VMware vSphere, Microsoft Hyper-V, or KVM benefit from the MTC40F2047S1RC56BB1's 128 GB density, which consolidates more VMs per physical server. The DDR5-5600 bandwidth handles VM memory pressure without contention, and ECC prevents silent data corruption in multi-tenant cloud environments. Cloud providers deploying dense virtualization clusters achieve higher VM density per rack unit using 128 GB modules.
Empfohlen
In-Memory Database Systems
In-memory databases such as SAP HANA, Redis Enterprise, and Memcached deployments rely on high-capacity, high-bandwidth memory. The MTC40F2047S1RC56BB1's 128 GB DDR5-5600 RDIMM provides the memory footprint and throughput to hold large working sets entirely in RAM. ECC prevents corruption of in-memory data structures, and the JEDEC PC5-44800 specification guarantees compatibility across heterogeneous server platforms.
Empfohlen
High-Performance Computing Clusters
HPC clusters running CFD, FEA, genomics, and scientific simulations benefit from the MTC40F2047S1RC56BB1's high density and bandwidth. HPC nodes typically require maximum memory capacity per compute node to hold large simulation datasets; 128 GB modules enable 1-2 TB memory configurations per dual-socket node. The DDR5-5600 speed minimizes memory-bound performance bottlenecks in MPI workloads.
Empfohlen
Data Center Memory Pool Expansion
Data center operators expanding existing DDR5 server fleets can deploy MTC40F2047S1RC56BB1 modules for memory upgrades. The 128 GB density doubles or quadruples existing memory configurations without requiring additional DIMM slots. The Micron JEDEC-compliant PC5-44800 specification ensures interoperability with existing Samsung, SK Hynix, and other vendor modules per JEDEC multi-vendor guidelines.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MTC40F2047S1RC56BB1 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MTC40F2047S1RC56BB1R | MTC40F2047S1RC56BB2 | MTC40F2047S1RC56B |
|---|---|---|---|---|
| Brand | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
| Package | 288-pin DDR5 RDIMM | 288-pin DDR5 RDIMM - same | 288-pin DDR5 RDIMM - same | 288-pin DDR5 RDIMM - same |
| Capacity | 128 GB | 128 GB | 128 GB | 128 GB |
| Speed | DDR5-5600 (PC5-44800) | DDR5-5600 | DDR5-5600 | DDR5-5600 |
| Rank / Organization | 2Rx4 | 2Rx4 | 2Rx4 | 2Rx4 |
| CAS Latency | CL46 | CL46 | CL46 | CL46 |
| Operating Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| ECC Support | Yes | Yes | Yes | Yes |
Wichtigste Unterscheidungsmerkmale
- Micron server-grade validation and qualification (vs. MTC40F2047S1RC56BB1R)
- BB1 revision is the leading Micron catalog variant (vs. MTC40F2047S1RC56BB2)
Designhinweise
Do not mix memory modules from different vendors in the same memory bank without checking your server's qualified parts list. While JEDEC PC5-44800 specifies interoperability, some server platforms enforce strict vendor consistency per channel. Mixing Micron, Samsung, and SK Hynix modules in the same bank may trigger BIOS warnings or reduce memory speed. Per ramquote.com compatibility data, keep vendors consistent within a memory bank for best results.
DDR5 modules with on-module PMIC generate additional heat compared to DDR4. Ensure adequate airflow across the DIMM slots in 1U/2U server chassis. Micron server-class RDIMMs are rated for 0C to 85C ambient server inlet temperatures, but DIMM-slot exhaust temperatures can exceed 90C in dense configurations. Verify platform thermal specifications before deployment.
When populating 2DPC (2 DIMMs per channel) configurations, populate slots according to server vendor population rules - typically slot A1 first, then A2 within a channel. Unbalanced channel populations can reduce memory bandwidth. The MTC40F2047S1RC56BB1's registered buffer allows dense channel configurations, but always follow your server's memory population guide for optimal performance.
Compliance-Informationen
RoHS compliant per Micron product page. JEDEC PC5-44800 compliant per Micron datasheet. Not AEC-Q100 qualified - DDR5 server memory is not an automotive-grade component.
