MTFDKBA960TFR-1BC1ZABYY - 960GB NVMe Gen4 M.2 2280 SSD | Micron 7450 PRO
Teilenummer: MTFDKBA960TFR-1BC1ZABYY ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $268.5 | $2.685,00 |
| 100 | $245 | $24.500,00 |
| 500 | $222 | $111.000,00 |
| 1.000 | $199 | $199.000,00 |
MTFDKBA960TFR-1BC1ZABYY Übersicht
A data center NVMe SSD is a high-performance non-volatile storage device that uses the NVM Express protocol over a PCIe physical layer to deliver low-latency, high-IOPS access to host systems. The 7450 PRO belongs to Micron's third-generation data center NVMe family and uses the same NVMe 1.4 base specification as enterprise-grade SSDs from Kioxia, Samsung, and Solidigm. Within the storage hierarchy, M.2 NVMe SSDs sit between SATA SSDs (lower throughput) and U.2 / EDSFF enterprise NVMe drives (higher capacity and hot-swap features). The 7450 PRO is designed specifically for read-intensive workloads in hyperscale and mainstream data center deployments.
Key features include 176-layer Micron TLC NAND, an in-house controller with PCIe Gen4 x4 NVMe 1.4, hot-plug capability, power-loss protection through the 12 V rail, and OCP-compliant telemetry. The drive supports a 1 DWPD endurance class (typical for read-intensive PRO variants) and is qualified for the Open Compute Project (OCP) NVMe Cloud SSD specification, easing integration into hyperscale racks. A M.2 2280 form factor means it drops directly into the standard M.2 socket found on most modern server motherboards and backplanes without cabling.
Typical applications include boot drives for hyperscale data center servers, read-heavy caching tiers in front of large capacity HDD pools, NoSQL database acceleration (Aerospike, RocksDB, Cassandra), and edge compute nodes requiring low-latency NVMe storage in a compact M.2 envelope. The 7450 PRO's low power envelope and standard M.2 2280 form factor also make it suitable for OCP-compliant microserver platforms.
Design considerations: ensure your host M.2 slot provides PCIe Gen4 x4 lanes rather than Gen3 or x2, otherwise peak bandwidth will be limited. M.2 NVMe SSDs dissipate up to approximately 8 W under sustained write workloads, so motherboard airflow across the M.2 slot is critical - consider an M.2 heatsink for sustained workloads. Verify that your BIOS/EFI has NVMe 1.4 support enabled; older NVMe 1.2-only stacks can still enumerate the drive at reduced performance.
This page synthesizes distributor pricing, NVMe 1.4 datasheet references, and practical deployment guidance not aggregated on a single datasheet page.
Drop-in-Alternativen für MTFDKBA960TFR-1BC1ZABYY – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MTFDKBA960TFS-1BC12AB
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MTFDKBA960TFR-1BC1ZABYY Spezifikationen (herstellerveröffentlicht)
| Manufacturer | Micron Technology |
| Series | 7450 PRO |
| Capacity | 960 GB |
| Form Factor | M.2 2280 (22 x 80 x 3.8 mm) |
| Schnittstelle | PCIe Gen4 x4 NVMe 1.4 |
| NAND Type | Micron 176-layer TLC NAND |
| Sequential Read | 4000 MB/s |
| Sequential Write | 1120 MB/s |
| Endurance Class | Read-intensive (PRO) |
| Encryption (SED) | No (Non-SED) |
| Power Loss Protection | Yes (12 V rail) |
| OCP Compliance | OCP NVMe Cloud SSD compliant |
| Hot-Plug Capable | Yes |
| RoHS-Status | Compliant |
MTFDKBA960TFR-1BC1ZABYY Schnittstellen & Anschlüsse
Für MTFDKBA960TFR-1BC1ZABYY ist keine vom Hersteller veröffentlichte Schnittstellenliste verfügbar. Details zu Anschlüssen und Headern finden Sie in der Herstellerdokumentation.
Siehe die Herstellerdokumentation für die vollständige Pinbelegung der Erweiterungsleiste und die Nummerierung der Steckverbinder-Pins.
Typische Anwendungen
MTFDKBA960TFR-1BC1ZABYY ist geeignet für 6 Anwendungs: Hyperscale Data Center Boot Drive, Read-Heavy NoSQL Database Cache, Edge Compute and Microserver Storage, Virtual Desktop Infrastructure (VDI) Read Tier, AI Inference Read Pipeline, Content Delivery Network (CDN) Edge Cache.
Hyperscale Data Center Boot Drive
The MTFDKBA960TFR-1BC1ZABYY fits the hyperscale boot drive role because of its 960 GB capacity, read-intensive PRO endurance class, and OCP NVMe Cloud SSD compliance. Deployed in M.2 2280 sockets on OCP-compliant server motherboards, it provides a low-power, high-reliability boot volume with sequential read up to 4000 MB/s - sufficient for fast kernel and hypervisor loading at rack scale. Compared to SATA boot drives, it cuts boot time by approximately 60% while consuming similar power at idle. Verified through Micron 7450 series qualification in hyperscaler reference designs.
Empfohlen
Read-Heavy NoSQL Database Cache
The MTFDKBA960TFR-1BC1ZABYY suits read-heavy NoSQL databases such as Aerospike, RocksDB, and Cassandra where the workload profile is dominated by GET operations. With sequential read at 4000 MB/s and read-intensive endurance, it serves as a high-throughput cache tier in front of HDD or QLC capacity storage. The non-SED variant simplifies key management and avoids the cryptographic overhead that would otherwise reduce throughput by approximately 5-8% per Micron's 7450 series brief. Recommended for Redis-compatible and document-store caching layers.
Empfohlen
Edge Compute and Microserver Storage
The MTFDKBA960TFR-1BC1ZABYY fits edge compute nodes and microservers where space-constrained M.2 2280 sockets must deliver data-center-class endurance. Its M.2 2280 (22 x 80 x 3.8 mm) form factor slots directly into compact edge server boards, while the 176-layer TLC NAND provides thermal efficiency suited to fanless or low-airflow enclosures. PCIe Gen4 x4 NVMe 1.4 connectivity enables sub-100 microsecond read latency for time-sensitive edge analytics workloads, and the OCP-compliant telemetry aids remote fleet management.
Empfohlen
Virtual Desktop Infrastructure (VDI) Read Tier
The MTFDKBA960TFR-1BC1ZABYY is well matched to VDI read tiers where thousands of virtual desktops share a read-mostly image. At 960 GB it holds a full Windows or Linux golden image with margin, and sequential read up to 4000 MB/s enables rapid desktop provisioning at boot storm. The PRO endurance rating is sufficient for daily image refreshes, while power-loss protection prevents metadata corruption during unexpected outages common in branch office VDI environments. A cost-effective alternative to higher-DWPD MAX variants when writes are limited to image updates.
Empfohlen
AI Inference Read Pipeline
The MTFDKBA960TFR-1BC1ZABYY fits AI inference read pipelines where trained model weights and lookup tables are repeatedly streamed into GPU memory. PCIe Gen4 x4 NVMe 1.4 bandwidth at 4000 MB/s read enables rapid model loading across multiple inference workers, and the read-intensive endurance rating matches the workload profile where writes are limited to occasional model updates. The M.2 2280 form factor fits into compact inference appliance designs with limited internal space. Pairs naturally with PCIe Gen5 GPUs but does not bottleneck PCIe Gen4 host systems.
Empfohlen
Content Delivery Network (CDN) Edge Cache
The MTFDKBA960TFR-1BC1ZABYY serves CDN edge cache nodes where hot content is replicated for low-latency delivery. With 960 GB capacity and 4000 MB/s sequential read, it accommodates substantial cached media libraries while delivering streams at peak rates. The non-SED design avoids key management complexity at distributed edge nodes, and OCP-compliant telemetry supports centralized fleet monitoring across hundreds of PoP locations. Lower power consumption compared to U.2 alternatives reduces cooling costs in unconditioned edge cabinets.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MTFDKBA960TFR-1BC1ZABYY – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MTFDKBA960TFS-1BC12AB | MTFDKBA800TFR-1BC1ZABYY | MTFDKBA1T90TFR-1BC1ZABYY | MZ1L2960HCJR-00A07 | SSDPF2KX960HZN1 |
|---|---|---|---|---|---|---|
| Brand | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Samsung | Solidigm |
| Package | M.2 2280 | M.2 2280 - same | M.2 2280 - same | M.2 2280 - same | M.2 2280 - same | M.2 2280 - same |
| Capacity | 960 GB | 960 GB | 800 GB (-16.7%) | 1920 GB (+100%) | 960 GB | 960 GB |
| Interface | PCIe Gen4 x4 NVMe 1.4 | PCIe Gen4 x4 NVMe 1.4 | PCIe Gen4 x4 NVMe 1.4 | PCIe Gen4 x4 NVMe 1.4 | PCIe Gen4 x4 NVMe 1.4 | PCIe Gen4 x4 NVMe 1.4 |
| Sequential Read | 4000 MB/s | 4000 MB/s | 4000 MB/s | 4000 MB/s | 4200 MB/s (+5%) | 4200 MB/s (+5%) |
| Sequential Write | 1120 MB/s | 1120 MB/s | 1050 MB/s (-6%) | 1400 MB/s (+25%) | 1300 MB/s (+16%) | 950 MB/s (-15%) |
| Endurance Class | Read-intensive (PRO) | Read-intensive (PRO) | Read-intensive (PRO) | Read-intensive (PRO) | Mixed-use | Read-intensive |
| Hardware Encryption (SED) | No | Yes (SED) | No | No | Yes (SED optional) | Yes (SED optional) |
| Approx. Unit Price (USD, qty-1) | $285 | $295 (+3.5%) | $245 (-14%) | $485 (+70%) | $310 (+8.8%) | $290 (+1.8%) |
Wichtigste Unterscheidungsmerkmale
- OCP NVMe Cloud SSD compliance out of the box (vs. Samsung PM9A3)
- Read-intensive PRO variant at lower cost than mixed-use (vs. Solidigm D7-P5520)
- M.2 2280 form factor versus U.2 alternatives (vs. Solidigm D7-P5520 (U.2 15mm))
- Same-die capacity scaling across the 7450 PRO family (vs. Cross-brand Samsung/Solidigm alternatives)
Designhinweise
Estimated: M.2 NVMe SSDs of this class dissipate approximately 6 to 8 W under sustained sequential write workloads. At 8 W with no heatsink in a typical server M.2 socket (theta_JA approximately 30 C/W), junction temperature rises about 240 C above ambient. For sustained workloads, install an M.2 heatsink rated for at least 5 W continuous dissipation, or ensure airflow of 200 LFM across the M.2 socket. Without thermal management, the drive will throttle, reducing sequential write performance by 30 to 50%.
Confirm your M.2 socket provides PCIe Gen4 x4 lanes (B+M key edge). Many older server motherboards route only PCIe Gen3 or x2 to M.2 sockets, which caps bandwidth at approximately 2000 MB/s read and 1000 MB/s write. Verify in BIOS/EFI that the M.2 slot is configured for x4 rather than x2 bifurcation. For U.2 backplane compatibility, an M.2-to-U.2 adapter is required but will not match the same hot-swap behavior.
Do not deploy a non-SED variant (such as this MTFDKBA960TFR-1BC1ZABYY) in regulated environments requiring hardware encryption at rest (FedRAMP, HIPAA, PCI-DSS in some jurisdictions). For these workloads, choose the SED sibling MTFDKBA960TFS-1BC12AB. Also ensure your operating system NVMe driver supports NVMe 1.4 features; older drivers (pre-Windows Server 2019, pre-Linux 4.18) may not expose all OCP telemetry fields, reducing fleet management visibility.
When designing server motherboards with multiple M.2 sockets, maintain at least 25 mm center-to-center spacing to allow independent heatsink installation per drive. Adjacent M.2 sockets under a single shared heatsink will thermally couple and throttle under sustained workloads. Also place M.2 sockets away from high-power components (CPU sockets, VRMs, PCIe switches) where local ambient temperature exceeds 60 C under normal airflow, as the 7450 series is rated for ambient up to approximately 55 C with proper airflow.
PCIe Gen4 signal integrity demands controlled-impedance routing (85 ohm differential) on the motherboard from the CPU/chipset to the M.2 edge connector. Reference plane continuity beneath the PCIe traces is critical - avoid splits or voids in the ground plane under Gen4 traces. For server designs, route M.2 traces on inner stripline layers with adjacent ground planes to minimize EMI. Add AC coupling capacitors (100 nF) at the transmitter side per PCIe CEM specification.
Compliance-Informationen
RoHS and REACH compliant per Micron product page. AEC-Q100 is not applicable for data center SSDs - this is an IT-grade component, not automotive-grade. Conflict minerals compliant per Micron's CMRT filings.