MTFDKCC7T6TFR-1BC1ZABYY-TR - 7.68TB NVMe U.3 7450 PRO SSD | Micron
Teilenummer: MTFDKCC7T6TFR-1BC1ZABYY-TR ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $1250 | $1.250,00 |
| 10 | $1190 | $11.900,00 |
| 50 | $1125 | $56.250,00 |
| 100 | $1075 | $107.500,00 |
| 500 | $1015 | $507.500,00 |
MTFDKCC7T6TFR-1BC1ZABYY-TR Übersicht
A U.3 NVMe SSD is a 2.5-inch enterprise storage module that combines the SFF-8639 hot-swap form factor with the NVMe protocol stack on PCIe 4.0, replacing legacy SATA/SAS SSDs in modern servers. Within the storage taxonomy, the part sits under NAND flash memory -> SSD -> enterprise NVMe SSD -> data center NVMe SSD. The 7450 PRO family uses Micron's 176-layer TLC NAND, an in-house controller, and includes features such as AES-256 hardware encryption, power-loss protection (PLP), and TCG-compliant security options.
Key differentiating specifications include 7.68 TB of TLC capacity in a 15 mm z-height, sequential read up to 6,800 MB/s and sequential write up to 5,300 MB/s, 1 DWPD (drive writes per day) over a 5-year warranty for read-intensive workloads, NVMe 1.4 protocol compliance, and AES-256 / TCG Opal security support depending on firmware. The PRO tier differs from the MAX (mixed-use, 3 DWPD) and from the SED/Non-SED firmware options. Compared to SATA SSDs, the 7450 PRO delivers roughly 10x sequential throughput and dramatically higher IOPS.
Typical applications for this drive include hyperscale and enterprise data-center workloads such as read-intensive databases, content-delivery networks (CDN), boot drives for high-density servers, AI/ML training data lakes, virtual desktop infrastructure (VDI), software-defined storage nodes, and large-scale analytics platforms. It is also commonly deployed in mainstream server refresh projects transitioning legacy SATA/SAS storage to NVMe PCIe Gen4.
Design considerations include U.3 backplane compatibility, thermal management under sustained sequential writes (the 15 mm height provides a larger heat-spreading surface than the 7 mm variant), and ensuring the host platform supports NVMe 1.4 with PCIe 4.0 x4 lanes. The -TR suffix indicates Tape-and-Reel / single-pack shipping configuration per Micron's part-number decoder. Unlike the related 7450 MAX drives, the PRO tier is optimized for read-intensive workloads and offers higher capacity at lower cost per GB.
This page synthesizes distributor pricing, same-family Micron alternatives, datasheet references, and practical integration notes that are not aggregated in any single manufacturer document.
Drop-in-Alternativen für MTFDKCC7T6TFR-1BC1ZABYY-TR – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MTFDKCC7T6TFR-1BC1ZABYY-TR (gleiche Bauform und Footprint) – abweichend in Form Factor, Interface, Operating Temperature, Series.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MTFDKCC7T6TFR-1BC1ZABYYR
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MTFDKCB7T6TFR-1BC1ZABYY
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MTFDKCC7T6TFR-1BC1ZABYY
✅ Drop-In✓ Auf Lager
$1099 / Stück
Datenblatt ansehen →MZQL27T6HBLA-00A07
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
SSDPF2KX076T9N1
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
WUSTR6476ASS200
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MTFDKCC7T6TFR-1BC1ZABYY-TR Grenzwerte & elektrische Eigenschaften
| Product Type | Enterprise NVMe SSD (Solid State Drive) |
| Series | Micron 7450 PRO |
| Capacity | 7.68 TB |
| NAND Technology | Micron 176-layer 3D TLC NAND |
| Schnittstelle | PCIe 4.0 x4 NVMe 1.4 |
| Form Factor | U.3 (2.5-inch SFF, 15 mm height) |
| Sequential Read (max) | 6,800 MB/s |
| Sequential Write (max) | 5,300 MB/s |
| Endurance Class | 1 DWPD (Read Intensive) |
| Workload Rating | Read Intensive (RI) |
| Security | AES-256 hardware encryption, TCG Opal (firmware-dependent, Non-SED variant in this part) |
| Power-Loss Protection (PLP) | Yes |
| Betriebstemperatur | 0C to +70C (data center) |
| Form Factor Dimensions | 70.1 mm x 100.45 mm x 15 mm (U.3 15 mm) |
| Shipping Configuration | Tape and Reel (TR suffix) |
| Warranty | 5 years (typical Micron enterprise SSD term) |
| RoHS Compliance | Compliant (per Micron 7450 product page) |
MTFDKCC7T6TFR-1BC1ZABYY-TR standard Pinbelegungsleitfaden
Pinbelegung für MTFDKCC7T6TFR-1BC1ZABYY-TR (standard-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MTFDKCC7T6TFR-1BC1ZABYY-TR.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MTFDKCC7T6TFR-1BC1ZABYY-TR ist geeignet für 7 Anwendungs: Hyperscale Data Center Storage, AI/ML Training Data Lake, Enterprise Database (Read-Intensive), Software-Defined Storage Nodes, Content Delivery Network (CDN) Edge Cache, Virtual Desktop Infrastructure (VDI), Server Boot Drive.
Hyperscale Data Center Storage
The MTFDKCC7T6TFR-1BC1ZABYY-TR is well suited to hyperscale data center deployments where high density and read-intensive throughput drive TCO. Its 7.68 TB U.3 15 mm form factor fits standard 1U/2U server sleds, while sequential reads up to 6,800 MB/s and 1 DWPD endurance match the workload profile of CDN nodes, object storage, and large-scale analytics clusters. The drive's PLP protects against host-side power faults during heavy read bursts common to multi-tenant workloads.
Empfohlen
AI/ML Training Data Lake
AI training pipelines require large read-throughput pools for dataset streaming to GPU servers. The 7450 PRO's 6,800 MB/s sequential read and 7.68 TB per drive enable high-bandwidth dataset staging, while 1 DWPD accommodates checkpoint writing. Compared to SATA SSDs, the NVMe PCIe 4.0 interface eliminates storage bottlenecks in mixed CPU/GPU racks. Pair with multiple 7450 PROs in a U.3 NVMe RAID array for multi-GB/s dataset loading to GPU hosts.
Empfohlen
Enterprise Database (Read-Intensive)
Read-intensive OLTP replicas, BI dashboards, and reporting databases benefit from the 7450 PRO's high random read IOPS and 7.68 TB capacity. The drive's NVMe 1.4 protocol supports namespaces, multi-stream writes, and predictable latency under mixed workloads. 1 DWPD endurance comfortably supports five years of typical read-heavy database traffic, while hardware AES-256 and PLP add data integrity without performance overhead.
Empfohlen
Software-Defined Storage Nodes
SDS appliances using Ceph, vSAN, or similar distributed storage benefit from the 7450 PRO's capacity density, NVMe bandwidth, and PLP. Multiple 7450 PROs in a single chassis enable high-throughput, capacity-dense storage pools for hyperconverged infrastructure. The 15 mm z-height provides thermal headroom for sustained sequential writes during cluster recovery operations.
Empfohlen
Content Delivery Network (CDN) Edge Cache
CDN edge caches require high read throughput and large per-drive capacity for hot-content storage. The 7450 PRO delivers 6,800 MB/s sequential read at 7.68 TB per drive, enabling high cache density per edge appliance. NVMe PCIe 4.0 x4 outperforms legacy SATA SSDs by roughly 10x, while 1 DWPD endurance is more than sufficient for the predominantly read-only workload. U.3 15 mm fits standard edge-cache sleds.
Empfohlen
Virtual Desktop Infrastructure (VDI)
VDI platforms stream OS images, user profiles, and boot volumes to large fleets of virtual desktops, demanding high random read IOPS and consistent latency. The 7450 PRO's NVMe interface and 7.68 TB capacity make it a strong boot/log-volume drive for VDI hosts running thousands of VMs. 1 DWPD endurance easily handles the boot-storm and login-storm patterns typical of enterprise VDI deployments, while PLP prevents in-flight data loss during host-side faults.
Empfohlen
Server Boot Drive
Boot-volume NVMe SSDs in enterprise servers must offer high reliability, predictable latency, and PLP. The 7450 PRO 7.68 TB is over-provisioned for boot but provides ample headroom for caching, logging, and OS images. Its U.3 hot-swap form factor allows field replacement without downtime, while NVMe 1.4 namespaces simplify per-OS isolation. The Non-SED variant avoids SED firmware overhead for boot-only workloads.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MTFDKCC7T6TFR-1BC1ZABYY-TR – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MTFDKCC7T6TFR-1BC1ZABYYR | MTFDKCB7T6TFR-1BC1ZABYY | MTFDKCC7T6TFR-1BC1ZABYY | MZQL27T6HBLA-00A07 | SSDPF2KX076T9N1 | WUSTR6476ASS200 |
|---|---|---|---|---|---|---|---|
| Brand | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Samsung Electronics | Solidigm | Western Digital |
| Package | U.3 2.5-inch 15mm | U.3 2.5-inch 15mm | U.3 2.5-inch 7mm | U.3 2.5-inch 15mm | U.3 2.5-inch 15mm | U.2 2.5-inch 15mm | U.3 2.5-inch 15mm |
| Capacity | 7.68 TB | 7.68 TB | 7.68 TB | 7.68 TB | 7.68 TB | 7.68 TB | 7.68 TB |
| Interface | PCIe 4.0 x4 NVMe 1.4 | PCIe 4.0 x4 NVMe 1.4 | PCIe 4.0 x4 NVMe 1.4 | PCIe 4.0 x4 NVMe 1.4 | PCIe 4.0 x4 NVMe 1.4 | PCIe 4.0 x4 NVMe 1.4 | PCIe 4.0 x4 NVMe 1.4 |
| Endurance (DWPD) | 1 DWPD | 1 DWPD | 1 DWPD | 1 DWPD | 1 DWPD | 1 DWPD | 1 DWPD |
| Sequential Read (max) | 6,800 MB/s | 6,800 MB/s | 6,800 MB/s | 6,800 MB/s | 6,500 MB/s (approx) | 6,200 MB/s (approx) | 6,400 MB/s (approx) |
| Sequential Write (max) | 5,300 MB/s | 5,300 MB/s | 5,300 MB/s | 5,300 MB/s | 4,000 MB/s (approx) | 4,200 MB/s (approx) | 4,300 MB/s (approx) |
| Power-Loss Protection | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
Wichtigste Unterscheidungsmerkmale
- Tape-and-Reel packaging for OEM integration lines (vs. MTFDKCC7T6TFR-1BC1ZABYY)
- Same Micron 7450 PRO die with 15 mm z-height for thermal headroom (vs. MTFDKCB7T6TFR-1BC1ZABYY)
- Higher sequential write throughput than cross-brand U.3 alternatives (vs. MZQL27T6HBLA-00A07 (Samsung PM9A3 7.68TB))
Designhinweise
The U.3 15 mm form factor provides a larger thermal mass than the 7 mm variant, but sustained sequential writes on PCIe 4.0 NVMe SSDs at this capacity can exceed 8 W of drive power. Ensure server airflow provides at least 5 CFM over the drive bay and verify chassis inlet temperature remains below 35 C for sustained workloads. Use Micron's SMART temperature telemetry via NVMe-CLI to monitor thermal headroom. In dense sleds, consider deploying drives in alternating bays to prevent adjacent-drive thermal coupling.
Do not deploy this U.3 drive in a legacy U.2 backplane that does not support the SFF-TA-1001 (U.3) pinout. While U.3 is mechanically backward compatible with U.2 connectors, some older U.2 backplanes wire only PCIe lanes without the SAS/SATA tri-mode pins, which can cause link-training failures. Verify backplane compatibility with the host platform vendor before large-scale deployment. Also note that the -TR suffix denotes Tape-and-Reel packaging, distinct from bulk tray packaging, which may affect OEM integration lines.
For multi-drive NVMe configurations, ensure the host platform supports PCIe bifurcation across U.3 backplane connectors. Each U.3 bay consumes x4 PCIe 4.0 lanes, so a 1U server with 10 NVMe bays requires 40 lanes from the CPU or PCIe switch. Confirm that the system BIOS or BMC supports NVMe hot-plug, surprise-removal, and thermal-shutdown signaling. For RAID configurations, use a hardware RAID controller with NVMe support or a software-defined storage stack such as Ceph, vSAN, or Microsoft Storage Spaces Direct.
Compliance-Informationen
RoHS compliance confirmed per Micron 7450 product page; REACH and halogen-free status not explicitly stated in verified web data; AEC-Q100 not applicable for enterprise storage modules; Micron publishes a Conflict Minerals Report covering all its products.
