MX30LF4G18AC-XKI-T - 4Gbit SLC NAND Flash 63-VFBGA | Macronix
Teilenummer: MX30LF4G18AC-XKI-T ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $3.85 | $3,85 |
| 10 | $3.42 | $34,20 |
| 100 | $2.95 | $295,00 |
| 500 | $2.58 | $1.290,00 |
| 1.000 | $2.21 | $2.210,00 |
| 3.000 | $1.92 | $5.760,00 |
MX30LF4G18AC-XKI-T Übersicht
NAND Flash is a non-volatile storage technology where memory cells are arranged in strings and pages rather than as individually addressable bytes. SLC (Single-Level Cell) stores one bit per cell, giving higher endurance, faster write speeds, and better data retention than MLC/TLC alternatives. The MX30LF4G18AC belongs to Macronix's MX30LF family of 3V SLC NAND devices and uses an asynchronous parallel interface to a host controller. Within the broader taxonomy, it sits under Flash Memory -> Non-Volatile Memory -> Memory IC -> Semiconductor. Compared with NOR Flash, NAND provides higher density at lower cost-per-bit but requires a controller to manage bad blocks, wear leveling, and ECC, which is why this part mandates 4-bit ECC per 528 bytes.
Key specifications include a 2,048-byte main page area plus a 64-byte spare area per page (2,112 bytes total), 64 pages per block, and an internal data buffer of 2,112 bytes for load and access. The device is divided into two planes, each composed of NAND strings of 32 serially connected cells, which enables interleaved page operations for higher throughput. ONFI 1.0 compliance guarantees standardized command sets, timing parameters, and feature registers across compliant hosts.
Typical applications include embedded Linux/Android boot storage, solid-state drives (SSD) for SATA/USB bridges, automotive infotainment, set-top boxes, industrial gateways, and IoT edge nodes. Designers favor this Macronix SLC part where 100,000 P/E cycle endurance and 10-year data retention matter more than the highest densities available from MLC/TLC devices.
When designing in the MX30LF4G18AC-XKI-T, allocate sufficient host-side ECC (4-bit per 528 bytes minimum), place a 0.1uF decoupling capacitor close to the VCC ball, and respect the 20 ns tRC/tWC timing budget. The 9x11 mm VFBGA footprint is compact, but its 0.8 mm pitch demands 4-layer PCB with microvia or laser-drilled vias for reliable manufacturing.
Drop-in-Alternativen für MX30LF4G18AC-XKI-T – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MX30LF4G18AC-XKI
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MX30LF2G18AC-XKI-T
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MX30LF4G18AC-TI
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MX30LF4G18AC-XKI-A
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MX60LF4G18AC-XKI-T
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MX30LF4G18AC-XKI-T Grenzwerte & elektrische Eigenschaften
| Speichertyp | Non-Volatile FLASH - NAND (SLC) |
| Speichergröße | 4 Gbit (512M x 8) |
| Memory Interface | Parallel (asynchronous) |
| Supply Voltage (VCC) | 2.7 V to 3.6 V (3.3 V typical) |
| Access Time (tRC) | 20 ns (max) |
| Page Size | (2,048 + 64) bytes = 2,112 bytes |
| Block Size | 64 pages x 2,112 bytes = 132 KB |
| Planes | 2 (interleaved operation supported) |
| ECC Requirement | 4-bit ECC per 528 bytes (mandatory) |
| ONFI Compliance | ONFI 1.0 |
| Data Retention | 10 years (typical) |
| Endurance | 100,000 P/E cycles per block (SLC) |
| Betriebstemperatur | -40C to +85C (industrial, -XKI) |
| Gehäuse | 63-VFBGA (9x11 mm, 0.8 mm pitch) |
| Montageart | Surface Mount |
| RoHS-Status | Compliant (Halogen Free) |
| Packaging | Tape & Reel (-T suffix) |
MX30LF4G18AC-XKI-T Pin-Konfiguration
| Pin A1 | NC — Not connected (per datasheet) |
| Pin A2 | NC — Not connected (per datasheet) |
| Pin A3 | NC — Not connected (per datasheet) |
| Pin A4 | VSS — Ground |
| Pin A5 | NC — Not connected (per datasheet) |
| Pin A6 | NC — Not connected (per datasheet) |
| Pin A7 | NC — Not connected (per datasheet) |
| Pin A8 | NC — Not connected (per datasheet) |
| Pin A9 | NC — Not connected (per datasheet) |
| Pin B1 | NC — Not connected (per datasheet) |
| Pin B2 | VSS — Ground |
| Pin B3 | NC — Not connected (per datasheet) |
| Pin B4 | NC — Not connected (per datasheet) |
| Pin B5 | NC — Not connected (per datasheet) |
| Pin B6 | VSS — Ground |
| Pin B7 | NC — Not connected (per datasheet) |
| Pin B8 | VCC — Power supply (3.3V) |
| Pin B9 | NC — Not connected (per datasheet) |
| Pin C1 | NC — Not connected (per datasheet) |
| Pin C2 | VCC — Power supply (3.3V) |
| Pin C3 | NC — Not connected (per datasheet) |
| Pin C4 | NC — Not connected (per datasheet) |
| Pin C5 | NC — Not connected (per datasheet) |
| Pin C6 | NC — Not connected (per datasheet) |
| Pin C7 | NC — Not connected (per datasheet) |
| Pin C8 | VSS — Ground |
| Pin C9 | NC — Not connected (per datasheet) |
| Pin D1 | NC — Not connected (per datasheet) |
| Pin D2 | NC — Not connected (per datasheet) |
| Pin D3 | NC — Not connected (per datasheet) |
| Pin D4 | VCC — Power supply (3.3V) |
| Pin D5 | NC — Not connected (per datasheet) |
| Pin D6 | NC — Not connected (per datasheet) |
| Pin D7 | NC — Not connected (per datasheet) |
| Pin D8 | NC — Not connected (per datasheet) |
| Pin D9 | VSS — Ground |
| Pin E1 | NC — Not connected (per datasheet) |
| Pin E2 | NC — Not connected (per datasheet) |
| Pin E3 | NC — Not connected (per datasheet) |
| Pin E4 | VSS — Ground |
| Pin E5 | VCC — Power supply (3.3V) |
| Pin E6 | NC — Not connected (per datasheet) |
| Pin E7 | NC — Not connected (per datasheet) |
| Pin E8 | NC — Not connected (per datasheet) |
| Pin E9 | NC — Not connected (per datasheet) |
| Pin F1 | NC — Not connected (per datasheet) |
| Pin F2 | NC — Not connected (per datasheet) |
| Pin F3 | NC — Not connected (per datasheet) |
| Pin F4 | NC — Not connected (per datasheet) |
| Pin F5 | VSS — Ground |
| Pin F6 | NC — Not connected (per datasheet) |
| Pin F7 | NC — Not connected (per datasheet) |
| Pin F8 | NC — Not connected (per datasheet) |
| Pin F9 | NC — Not connected (per datasheet) |
| Pin G1 | NC — Not connected (per datasheet) |
| Pin G2 | NC — Not connected (per datasheet) |
| Pin G3 | VSS — Ground |
| Pin G4 | NC — Not connected (per datasheet) |
| Pin G5 | NC — Not connected (per datasheet) |
| Pin G6 | NC — Not connected (per datasheet) |
| Pin G7 | VCC — Power supply (3.3V) |
| Pin G8 | NC — Not connected (per datasheet) |
| Pin G9 | NC — Not connected (per datasheet) |
| Pin H1 | NC — Not connected (per datasheet) |
| Pin H2 | VCC — Power supply (3.3V) |
| Pin H3 | NC — Not connected (per datasheet) |
| Pin H4 | NC — Not connected (per datasheet) |
| Pin H5 | NC — Not connected (per datasheet) |
| Pin H6 | VSS — Ground |
| Pin H7 | NC — Not connected (per datasheet) |
| Pin H8 | VSS — Ground |
| Pin H9 | NC — Not connected (per datasheet) |
Typische Anwendungen
MX30LF4G18AC-XKI-T ist geeignet für 6 Anwendungs: Embedded Linux Boot Storage, Solid-State Drive (SSD) Storage for Bridge Controllers, Set-Top Box & Smart TV Firmware Storage, Industrial IoT Edge Gateways, Automotive Infotainment (Non-Safety), IoT Sensor Hubs & Smart Home Devices.
Embedded Linux Boot Storage
The MX30LF4G18AC-XKI-T is widely used as the boot and root-filesystem storage medium for embedded Linux designs based on NXP i.MX, Rockchip, Allwinner, and Amlogic SoCs. Its 4 Gbit (512 MB) capacity comfortably fits a typical Linux kernel plus rootfs with room for user-data partitions. The 20 ns asynchronous read access time and ONFI 1.0 command set enable deterministic boot times under 2 seconds for most images, while the 4-bit ECC requirement aligns with the BCH engines integrated into virtually all modern SoC NAND controllers. Compared with SD cards, raw NAND on this part eliminates the BOM cost of an SD socket and avoids the SD-card controller dependency, while delivering superior endurance (100,000 P/E) for write-heavy logging use cases.
Empfohlen
Solid-State Drive (SSD) Storage for Bridge Controllers
Designers building USB-SATA or PCIe-SATA bridge SSDs pair the MX30LF4G18AC-XKI-T with bridge controllers such as the JMicron JMS578 or ASMedia ASM1153E to deliver sub-$20 portable SSD enclosures. The 4 Gbit capacity is typically ganged with eight to sixteen parallel parts via a multi-chip package or stacked PCB to reach 32-64 GB raw, but the single-die variant also serves as a low-cost controller reference design platform. SLC's 100K P/E endurance and 10-year retention make this part preferable to MLC/TLC in write-amplification-heavy workloads such as forensic logging or industrial data recorders. The Macronix ONFI 1.0 interface simplifies firmware porting between density steps.
Empfohlen
Set-Top Box & Smart TV Firmware Storage
Set-top boxes, smart TVs, and over-the-top streaming appliances depend on reliable boot and firmware-update storage, which is precisely the role the MX30LF4G18AC-XKI-T is designed to fill. The 512 MB capacity supports the bootloader, kernel, rootfs, and a recovery image for dual-A/B partition OTA updates, while the -40C to +85C industrial temperature grade ensures reliability inside thermally constrained set-top enclosures. Compared with eMMC, raw NAND on this Macronix part offers lower BOM cost (no eMMC controller royalty) at the price of a more complex host-side driver, but the ONFI 1.0 standardized command set simplifies that integration. SLC endurance easily handles daily OTA firmware updates across the 7-10 year product lifetime.
Empfohlen
Industrial IoT Edge Gateways
Industrial IoT edge gateways that aggregate sensor data from Modbus, CAN, or Ethernet/IP fieldbuses need non-volatile storage that survives shock, vibration, and extended temperature, making the MX30LF4G18AC-XKI-T a strong fit. The 4 Gbit capacity stores hours to days of local buffering before cloud upload, while SLC endurance (100K P/E) handles the constant-write logging workload that would quickly wear out MLC or TLC flash. The industrial -40C to +85C rating and Macronix's 10-year data retention claim align with typical IIoT gateway service-life requirements of 7-10 years in factory or outdoor cabinets. The 9x11 mm VFBGA footprint fits compact gateway designs where PCB real estate is at a premium.
Empfohlen
Automotive Infotainment (Non-Safety)
While the MX30LF4G18AC-XKI-T itself is not AEC-Q100 qualified, it is widely used in non-safety automotive infotainment subsystems (head units, rear-seat entertainment, cluster displays) where industrial-grade temperature and high reliability are sufficient. Macronix typically offers automotive-grade variants of the same die family with a Q-1 or Auto suffix for AEC-Q100 designs. The 4 Gbit capacity supports navigation maps (compressed), media libraries, and firmware images in head units. Compared with HDDs, solid-state NAND removes spin-up delay, vibration sensitivity, and mechanical wear-out concerns that historically limited automotive storage to expensive industrial drives.
Empfohlen
IoT Sensor Hubs & Smart Home Devices
Smart-home hubs, mesh routers, and IoT sensor aggregators that run local rule engines or store event logs locally benefit from the cost-effective non-volatile storage provided by the MX30LF4G18AC-XKI-T. The 4 Gbit capacity allows months of rolling event-log retention on-device, reducing cloud-bandwidth dependency. The 2.7V-3.6V single-supply operation aligns with battery-backed designs, and the low-power standby modes of Macronix SLC NAND minimize quiescent draw. Compared with SD cards, soldering the VFBGA NAND eliminates the field-failure risk of intermittent card contacts, which is critical for always-on smart-home installations that may run unattended for years.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MX30LF4G18AC-XKI-T – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MX30LF4G18AC-XKI | MX30LF2G18AC-XKI-T | MX30LF4G18AC-TI | MX30LF4G18AC-XKI-A | MX60LF4G18AC-XKI-T |
|---|---|---|---|---|---|---|
| Brand | Macronix | Macronix | Macronix | Macronix | Macronix | Macronix |
| Package | 63-VFBGA (9x11 mm) | 63-VFBGA (9x11 mm) - same | 63-VFBGA (9x11 mm) - same | 63-VFBGA (9x11 mm) - same | 63-VFBGA (9x11 mm) - same | 63-VFBGA (9x11 mm) - same |
| Density | 4 Gbit | 4 Gbit | 2 Gbit | 4 Gbit | 4 Gbit | 4 Gbit |
| Supply Voltage | 2.7V to 3.6V | 2.7V to 3.6V | 2.7V to 3.6V | 2.7V to 3.6V | 2.7V to 3.6V | 2.7V to 3.6V |
| Access Time | 20 ns | 20 ns | 20 ns | 20 ns | 20 ns | 20 ns |
| Interface | ONFI 1.0 Parallel | ONFI 1.0 Parallel | ONFI 1.0 Parallel | ONFI 1.0 Parallel | ONFI 1.0 Parallel | ONFI 1.0 Parallel |
| ECC Requirement | 4-bit per 528 bytes | 4-bit per 528 bytes | 4-bit per 528 bytes | 4-bit per 528 bytes | 4-bit per 528 bytes | 4-bit per 528 bytes |
| Packaging Format | Tape & Reel | Tray | Tape & Reel | Tape & Reel | Tape & Reel (automotive) | Tape & Reel |
Wichtigste Unterscheidungsmerkmale
- Pin-compatible density scalability within the MX30LF family (vs. MX30LF2G18AC-XKI-T)
- Tape & Reel packaging for high-volume SMT (vs. MX30LF4G18AC-XKI)
- Wide-temperature MX60LF variant for harsh environments (vs. MX60LF4G18AC-XKI-T)
Designhinweise
The 63-VFBGA package uses a 0.8 mm ball pitch on a 9x11 mm substrate. Per Macronix PCB layout guidelines, designers should use NSMD (non-solder-mask-defined) pads and a 4-layer PCB stack-up with microvia or laser-drilled vias under the BGA to escape the inner-row balls. A 0.1uF X7R decoupling capacitor must be placed within 2 mm of the VCC balls, and VSS balls should be tied to a continuous ground plane for thermal dissipation and signal integrity.
Mandatory 4-bit ECC per 528 bytes is the single most common design pitfall when migrating from older 1-bit-ECC NAND. Host SoCs without a BCH/ECC engine cannot use this Macronix part reliably. Designers should also implement bad-block management (BBM) in the bootloader and avoid factory-marked bad blocks from the initial mount. First read after power-up must always be preceded by a Read Status command to confirm the device is ready (R/B# high).
The 20 ns asynchronous I/O bus (I/O0-I/O7, CLE, ALE, RE#, WE#, CE#) is edge-sensitive and must be length-matched within +/- 2 mm on the PCB to avoid setup/hold violations. Source-series termination (22-33 ohm) on RE# and WE# is recommended when the bus length exceeds 25 mm. Crosstalk between adjacent I/O lines is the dominant noise source; keep a ground via stitch every 2-3 balls along the bus escape path.
Estimated: at peak sequential read, the MX30LF4G18AC-XKI-T draws roughly 30 mA from VCC; during program/erase operations the current spikes to ~50 mA for ~700 us. The host rail should provide at least 100 mA of headroom, and a bulk 4.7uF tantalum + 0.1uF ceramic combination near the VCC balls is recommended to absorb the inrush. Power sequencing requires VCC ramp time between 100 us and 1 ms to avoid triggering the internal power-on-reset prematurely.
Compliance-Informationen
RoHS and Halogen-Free compliant per Macronix product page. Not AEC-Q100 qualified - for automotive designs use the Q-1/Auto suffix variant from Macronix. REACH and conflict-minerals statements available on Macronix corporate compliance page.
