MX7575TQ/883B - 8-Bit 5µs SAR ADC, Military, 18-CDIP | Maxim
Teilenummer: MX7575TQ/883B ⚠ Letzte Bestellmöglichkeit| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $65 | $65,00 |
| 10 | $58.5 | $585,00 |
| 100 | $49.75 | $4.975,00 |
| 500 | $42.1 | $21.050,00 |
| 1.000 | $36.4 | $36.400,00 |
MX7575TQ/883B Übersicht
What is an 8-bit SAR ADC? A successive-approximation register ADC is a type of Nyquist-rate data converter that walks an internal DAC one bit per clock cycle to converge on the input voltage, producing a fixed-latency, deterministic conversion in N clock cycles for an N-bit result. SAR ADCs sit in the hierarchy: ADC -> data converter -> data acquisition IC -> signal chain -> mixed-signal semiconductor. The 8-bit resolution places the MX7575 in the precision-but-not-high-accuracy tier, well suited to digital-panel-meter replacement, instrumentation front-ends, and embedded microprocessor analog input boards.
Key features include 8-bit resolution, single +5 V supply operation, parallel output interface for direct µP bus attachment, and a track-and-hold on the analog input. The /883B suffix indicates compliance with MIL-STD-883 Test Method 5008 for Class B screening (burn-in, temperature cycle, hermeticity), making the part suitable for military and aerospace programs that require flight-grade or ruggedized data converters.
The architecture uses an internal 2.5 V bandgap reference and a charge-redistribution CDAC; the LSB weight is therefore (VREF / 256). External clock rates up to approximately 1.25 MHz yield the 5 µs typical conversion time advertised in the datasheet. The robust parallel interface reads the conversion result with a single CS/RD strobe, allowing easy glue-less connection to 8080/6800-style microprocessors.
Typical applications include military avionics sensor digitizers, ruggedized process-control analog input modules, legacy replacement for AD7575 in flight systems, sonar and acoustic front-end sample-and-convert blocks, and instrumentation digitizers that demand a hermetic through-hole part for hi-rel assembly lines.
Design tip: when migrating from the commercial MX7575 to the /883B version, the AC and DC parameters are unchanged - only the screening flow differs - so PCB layout, reference decoupling, and timing budgets are identical. Provide a clean +5 V analog supply and 100 nF decoupling on VDD and VREF pins.
This page synthesizes current distributor pricing, /883B-specific screening context, drop-in equivalents and 18-CDIP PCB layout notes not found in the standalone Maxim datasheet.
Drop-in-Alternativen für MX7575TQ/883B – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MX7575TQ/883B (gleiche Bauform und Footprint) – abweichend in Mounting Type, Resolution, Architecture, Conversion Method, Number of Terminals.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MX7575SQ/883B
✅ Drop-In✓ Auf Lager
$10.75 / Stück
Datenblatt ansehen →AD7575BQ
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
AD7575AQ
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MX7575TQ/883B Grenzwerte & elektrische Eigenschaften
| Auflösung | 8 bit |
| Conversion Method | Successive Approximation (SAR) |
| Conversion Time (Typical) | 5 us |
| Conversion Time (Max) | 10 us |
| Number of Channels | 1 |
| Input Bandwidth (Track/Hold) | 50 kHz full-scale (386 mV/us slew rate) |
| Versorgungsspannung | +5 V single supply |
| Output Interface | Parallel, uP-compatible (8-bit bus) |
| On-Chip Track/Hold | Yes |
| Internal Reference | 2.5 V bandgap (typ) |
| Gehäuse | 18-pin CDIP (Ceramic DIP) |
| Package Code (per partstack) | DIP, RECTANGULAR, 18 terminals |
| Terminal Form | Through-Hole |
| Temperature Grade (per partstack) | MILITARY |
| Screening | MIL-STD-883B (Class B) |
| Montageart | Through-Hole (THT) |
MX7575TQ/883B Pin-Konfiguration
| Pin 1 | VREF — Reference voltage input/output (internal 2.5 V) |
| Pin 2 | AIN — Analog input (to internal T/H and SAR) |
| Pin 3 | AGND — Analog ground |
| Pin 4 | DGND — Digital ground |
| Pin 5 | VDD — +5 V supply |
| Pin 6 | CS — Chip select, active low |
| Pin 7 | RD — Read strobe, active low |
| Pin 8 | BUSY — Conversion-in-progress, active high |
| Pin 9 | DB7 — Data bit 7 (MSB) |
| Pin 10 | DB6 — Data bit 6 |
| Pin 11 | DB5 — Data bit 5 |
| Pin 12 | DB4 — Data bit 4 |
| Pin 13 | DB3 — Data bit 3 |
| Pin 14 | DB2 — Data bit 2 |
| Pin 15 | DB1 — Data bit 1 |
| Pin 16 | DB0 — Data bit 0 (LSB) |
| Pin 17 | CLK — External clock input |
| Pin 18 | NC — Not connected (per datasheet package drawing) |
Typische Anwendungen
MX7575TQ/883B ist geeignet für 6 Anwendungs: Military Avionics Sensor Digitizer, Ruggedized Process-Control Analog Input Module, Legacy Flight-System AD7575 Replacement, Sonar and Acoustic Front-End Sample-and-Convert Block, Hi-Rel Instrumentation Digitizer, Digital Panel Meter Replacement Board.
Military Avionics Sensor Digitizer
The MX7575TQ/883B is well matched to military avionics sensor digitizers that demand MIL-STD-883B screened converters on a through-hole PCB. Its 5 µs conversion time supports per-channel update rates above 100 kSPS aggregate when multiple channels are multiplexed, while the on-chip track-and-hold digitizes fast avionics signals (e.g., 400 Hz synchro-derived analog outputs, vibration accelerometer buffers up to 50 kHz) without external SHA. The 18-CDIP package meets the ruggedized assembly standards of DO-254 hardware programs. Place the part adjacent to its anti-aliasing RC network, keep VREF decoupled with a 10 µF tantalum plus 100 nF ceramic, and route the 8-bit parallel bus away from switching power traces to preserve 8-bit noise-free code resolution across the military -55 °C to +125 °C operating envelope.
Empfohlen
Ruggedized Process-Control Analog Input Module
The MX7575TQ/883B serves ruggedized process-control analog input modules where ceramic-DIP through-hole construction is mandated by long-term field-repair logistics. With 8-bit resolution (1 LSB = 19.5 mV at 5 V full-scale), the converter accepts 4-20 mA loop outputs scaled to 0-5 V, or 0-10 V transducer signals at update rates to ~200 kSPS using an external sample clock. The internal 2.5 V bandgap reference simplifies BOM, and the parallel interface drops straight onto legacy 8080/6800 I/O expanders used in industrial PLCs. Use the part alongside an external op-amp buffer (e.g., AD8628) to drive ADC VREF and present a low-impedance source to the analog input; this preserves 8-bit linearity in noisy plant environments.
Empfohlen
Legacy Flight-System AD7575 Replacement
The MX7575TQ/883B is the natural drop-in for the discontinued AD7575 in legacy flight systems that already have a CDIP-18 socketed analog front-end. It delivers identical 5 µs typical conversion time, same +5 V supply, and same 8-bit parallel µP bus protocol, so existing firmware and timing budgets remain valid. Designers use the /883B suffix to procure a part with full MIL-STD-883 Class B screening - burn-in, temperature cycle, and hermeticity - required for line-replaceable units (LRUs) in avionics. For each MX7575 socket, leave a 10 µF/100 nF decoupling pair on VDD and route digital outputs through a 74HCT244 buffer if multiple ADCs share the data bus.
Empfohlen
Sonar and Acoustic Front-End Sample-and-Convert Block
The MX7575TQ/883B is suitable for sonar and acoustic front-end sample-and-convert blocks where hydrophone signals must be digitized into 8-bit words at audio rates. With a 50 kHz full-scale input bandwidth and integrated track-and-hold, the device captures acoustic transients above the audio band without an external SHA, while the 5 µs conversion time gives 200 kSPS throughput when successive conversions are pipelined via the BUSY handshake. The 18-CDIP hermetic package tolerates the temperature and humidity swings of marine deployment. Pair the ADC with an AD8628 low-noise buffer on the analog input and a 2.5 V reference filter (10 Ω + 10 µF) to achieve 8-bit noise-free codes at full speed.
Empfohlen
Hi-Rel Instrumentation Digitizer
The MX7575TQ/883B supports hi-rel instrumentation digitizers that must digitize analog sensor outputs (strain gauges, RTD bridges, pressure transducers) for MIL-spec data acquisition. Its 8-bit resolution and 5 µs conversion time suit instrumentation channels where 1 %FS accuracy is adequate and where conversion latency must be deterministic for synchronous sampling. The /883B screening provides the lot traceability and burn-in data required by many defense and aerospace procurement specs. Use an external AD584 precision reference for higher absolute accuracy, and buffer the analog input with an AD8628 to preserve AC performance at full input bandwidth up to 50 kHz.
Empfohlen
Digital Panel Meter Replacement Board
The MX7575TQ/883B works in digital panel meter replacement boards that originally used the MX7575 or AD7575, where the through-hole CDIP-18 footprint and ±5 V supply simplify PCB reuse. With 8-bit resolution over a 0-5 V input range, the meter provides a 0-255 count display with ±1 LSB differential nonlinearity, and the parallel output drives LED or LCD decoder/driver logic directly. The /883B screening extends operating life in harsh industrial panels where vibration and thermal cycling are common. Add an external input-protection resistor (1 kΩ) and a clamping diode pair to survive ESD at the front-panel BNC, and decouple VDD with 10 µF + 100 nF as close to the IC as possible.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MX7575TQ/883B – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MX7575SQ/883B | AD7575BQ | AD7575AQ |
|---|---|---|---|---|
| Brand | Maxim Integrated | Maxim Integrated | Analog Devices | Analog Devices |
| Package | 18-CDIP (through-hole) | 18-pin CERDIP (SOIC-style) - different outline | 18-CERDIP (through-hole) - same | 18-CERDIP (through-hole) - same |
| Resolution | 8 bit | 8 bit | 8 bit | 8 bit |
| Conversion Time (typ) | 5 us | 5 us | 5 us | 5 us |
| Conversion Method | SAR | SAR | SAR | SAR |
| On-Chip Track/Hold | Yes | Yes | Yes | Yes |
| Input Bandwidth | 50 kHz (FS step) | 50 kHz | 50 kHz | 50 kHz |
| Temperature Grade | Military (-55C to +125C) | Military (-55C to +125C) | Extended industrial / MIL | Commercial |
| Screening | MIL-STD-883B (Class B) | MIL-STD-883B (Class B) | MIL-PRF-38534 (BQ grade) | Commercial (no MIL screen) |
| Approx Unit Price (1 pc, 2026-10) | $65.00 | $60.00 | $70.00 | $25.00 |
Wichtigste Unterscheidungsmerkmale
- MIL-STD-883B Class B screening with through-hole CDIP package (vs. AD7575AQ)
- Original Maxim die, second-source compatible with AD7575 footprint (vs. AD7575BQ)
- Through-hole ceramic DIP package for ruggedized assembly (vs. MX7575SQ/883B)
Designhinweise
The MX7575TQ/883B requires a single +5 V analog supply on VDD (pin 5). Place a 10 µF tantalum in parallel with a 100 nF ceramic as close to pin 5 as possible; for VREF (pin 1), use a 10 µF tantalum plus 100 nF ceramic to filter the internal 2.5 V bandgap reference. Separate analog (AGND, pin 3) and digital (DGND, pin 4) grounds and join them only at the ADC ground pin to avoid digital switching noise coupling into the analog input. Do not back-drive the analog input above VDD or below AGND - the absolute maximum rating is VDD + 0.3 V and AGND - 0.3 V.
Route the 8-bit parallel data bus (DB0-DB7) away from the analog input trace and the +5 V supply trace. Place a ground guard ring around the AIN pin and use a small RC anti-aliasing filter (typically 1 kΩ + 1 nF for a ~150 kHz cutoff) right at the input pin. Keep the BUSY line (pin 8) short; this signal transitions during the conversion and can couple into the analog front-end if routed in parallel with AIN. The ceramic DIP through-hole footprint allows generous copper pours on both sides of the board, which simplifies thermal and decoupling layout relative to a surface-mount alternative.
Three recurring pitfalls when designing with the MX7575TQ/883B: (1) driving the analog input from a high-impedance source without a buffer op-amp - the T/H acquire time degrades; always use a low-output-impedance driver such as AD8628. (2) Using CS as a level-controlled signal instead of a strobe - CS must be asserted before RD and held through the read cycle to avoid bus contention. (3) Powering the part from a noisy switching regulator without adequate LC filtering - the 8-bit parallel output will show switching ripple on the lower bits; use a linear post-regulator after the switching pre-regulator.
At +5 V supply and 50 kHz conversion rate the MX7575TQ/883B dissipates approximately 30 mW internally. The CDIP-18 ceramic package has a thermal resistance of roughly 90 °C/W (theta_JA) in still air, so the junction-to-ambient temperature rise is only 2-3 °C above ambient - thermal management is normally not a concern. In sealed enclosures with no convection, however, derate the ambient temperature by 10-15 °C to maintain the same junction temperature.
Compliance-Informationen
The CDIP-18 ceramic package uses tin-lead (SnPb) lead finishes for military soldering compatibility; RoHS non-compliance is by design for MIL-STD-883B parts. AEC-Q100 not applicable - this is a military-temp ADC, not an automotive-grade part. Verify REACH and conflict-mineral status with the franchised distributor at order entry.
