NOPB - TI Lead-Free Package Suffix Designator | Texas Instruments
Teilenummer: NOPB ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
NOPB Übersicht
In the broader taxonomy of electronic component identification, a part-number suffix is a vendor-defined ordering code that distinguishes packaging, reel orientation, lead finish, or qualification grade without changing the underlying silicon die. NOPB specifically maps to the "no lead / no Pb" descriptor: Pb is the chemical symbol for lead, and the suffix signals that the external lead-frame or terminal plating contains no intentionally added lead. This is a packaging-level attribute, not a silicon-level attribute, and is functionally orthogonal to the electrical specifications of the device it qualifies.
Key identifying features include: (1) the literal string "/NOPB" appended after the base MPN with a forward slash separator, (2) a matte tin (Sn) or Sn-Ag-Cu lead-frame finish, (3) peak-package reflow temperature compatibility with the JEDEC J-STD-020 classification for lead-free soldering (typically 260 C peak), and (4) backwards compatibility with mixed-metal (Sn-Pb and lead-free) assembly lines when peak temperatures are properly profiled. A companion suffix "/NOPB" in modern TI datasheets is functionally equivalent to the older "PBFREE" or "Lead-Free" markings used by other vendors.
From an engineering standpoint, the most important consideration when handling a NOPB-qualified device is thermal profile management during board assembly. Lead-free finishes require peak reflow temperatures of approximately 245-260 C versus the 215-225 C window historically used for Sn-Pb eutectic processes. Devices that were originally specified with the older tin-lead finish must be requalified for the new thermal profile, which TI documents in each device's mechanical outline drawing and in the company's packaging terminology guide. Moisture Sensitivity Level (MSL) classification per JEDEC J-STD-033 also affects floor-life and dry-pack requirements.
Typical applications for the NOPB suffix include any commercial, industrial, or automotive system that must be RoHS-compliant for sale into the European Union, California (USA), China, or any other jurisdiction that has adopted substance-restriction regulations similar to RoHS. Engineers sourcing parts for these regions should explicitly order the NOPB (or equivalent) variant.
A practical procurement tip: the absence of NOPB from a base MPN does not always mean the part is non-RoHS. Many modern TI base MPNs default to lead-free finishes without requiring the suffix. Always check the device's data sheet "Lead finish" or "Terminal finish" entry, and confirm RoHS compliance via the manufacturer's declaration.
This page synthesizes the NOPB suffix meaning, packaging terminology, RoHS context, and drop-in ordering alternatives (such as the legacy "/PB" or "/LEADFREE" suffixes) that engineers may encounter on older National Semiconductor or TI datasheets not found in the manufacturer's single datasheet.
Drop-in-Alternativen für NOPB – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit NOPB (gleiche Bauform und Footprint) – abweichend in Mounting Type, Package, Technology.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
CMUDM8004-TR-PBFREE
✅ Drop-In✓ Auf Lager
$0.08 / Stück
Datenblatt ansehen →LEADFREE
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
STL35N75LF3
✅ Drop-In✓ Auf Lager
$0.55 / Stück
Datenblatt ansehen →NOPB Grenzwerte & elektrische Eigenschaften
| Suffix Type | Part-number ordering suffix (not a standalone IC) |
| Meaning | No Lead / No Pb (lead-free packaging) |
| Origin | National Semiconductor ordering system (inherited by TI) |
| Lead Finish | Matte tin (Sn) or Sn-Ag-Cu (lead-free) |
| RoHS Compliance | Yes - compliant with EU Directive 2011/65/EU |
| REACH Compliance | Compliant (per TI declaration) |
| Peak Reflow Temperature | 260 C (JEDEC J-STD-020 lead-free profile) |
| MSL Classification | Per JEDEC J-STD-033 (device-dependent, typically MSL 2 or 3) |
| Montageart | Surface Mount (packaging dependent on base MPN) |
| Betriebstemperatur | Inherits base MPN specification |
| Equivalent Legacy Suffixes | /PBFREE, /LEADFREE, /LF (vendor-specific) |
| Functional Equivalence | Identical die and electrical specs to non-NOPB variant |
| Backwards Compatibility | Compatible with Sn-Pb and lead-free assembly lines when reflow profiled correctly |
| Document Reference | TI Packaging Terminology Guide (ti.com/design-development/packaging) |
| Country of Origin | Multiple (per base MPN country of assembly) |
NOPB standard Pinbelegungsleitfaden
Pinbelegung für NOPB (standard-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für NOPB.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
NOPB ist geeignet für 6 Anwendungs: EU / RoHS-Regulated Product Assembly, Legacy National Semiconductor Part Number Modernization, Mixed-Technology Lead-Free Reflow Assembly, Aerospace & Defense Lead-Free Exception Documentation, Industrial Control & Automation Modules, Consumer Electronics Lead-Free Compliance.
EU / RoHS-Regulated Product Assembly
The NOPB suffix is the explicit ordering code engineers use to source RoHS-compliant TI parts for products sold into the European Union, China RoHS, California RoHS, and similar substance-restricted markets. By selecting the NOPB variant of a base MPN (for example LM338T/NOPB or LM75AIMX/NOPB), the buyer receives a matte-tin or Sn-Ag-Cu lead-frame finish that contains no intentionally added lead above the RoHS threshold of 1000 ppm. This satisfies EU Directive 2011/65/EU and the related delegated acts. For production lines running lead-free reflow profiles at 245-260 C peak per JEDEC J-STD-020, NOPB-suffixed devices drop into the same land pattern as the legacy Pb-bearing parts without PCB rework. Engineers should still verify MSL classification per JEDEC J-STD-033 and observe the documented floor-life for moisture-sensitive packages.
Empfohlen
Legacy National Semiconductor Part Number Modernization
Many NOPB-suffixed parts originate in the National Semiconductor product catalog, which TI acquired in 2011. Engineers maintaining older National Semi designs (LM317, LM35, LM338, LM7805 families) typically re-order the NOPB variant when refreshing their BOMs for current RoHS compliance. The NOPB suffix is identical in meaning to the legacy National Semi /PBFREE marking, and TI's ordering system preserves this convention across the combined product line. This makes NOPB particularly useful as a search term when re-sourcing obsolete or NRND National Semi parts at modern distributors such as DigiKey and Mouser. The functional equivalence of the silicon die ensures no design changes are required when transitioning from a legacy Pb-bearing to an NOPB-suffixed variant.
Empfohlen
Mixed-Technology Lead-Free Reflow Assembly
In mixed-technology SMT lines that assemble both lead-free and legacy Sn-Pb boards, NOPB-suffinished parts are required to satisfy lead-free reflow profiles (245-260 C peak) per JEDEC J-STD-020. The matte-tin or Sn-Ag-Cu lead-frame finish survives multiple lead-free reflow cycles within MSL limits. A typical SMT line running NOPB parts will configure the oven profile with a 60-90 second TAL (Time Above Liquidus at 217 C) and a 260 C peak for 20-40 seconds, then cool at 2-4 C/sec. This is the JEDEC-recommended profile for SAC305 (Sn-Ag-Cu) lead-free finishes. Engineers who must also accommodate legacy Sn-Pb parts in the same line can set a dual-profile recipe and apply the more aggressive profile only to NOPB boards.
Empfohlen
Aerospace & Defense Lead-Free Exception Documentation
Some aerospace, defense, and high-reliability programs (DO-254, MIL-STD-810, certain ITAR-controlled assemblies) historically specified tin-lead (Sn-Pb) lead-frame finishes to mitigate the tin-whisker risk in long-life deployed systems. For these programs, the NOPB suffix is typically NOT used; instead the legacy Pb-bearing variant is specified and qualified per the program-specific parts list. However, when such a legacy part is no longer available (NRND or EOL), the NOPB variant may be substituted with a tin-whisker mitigation strategy (conformal coating, underfill, or hermetic packaging) approved by the program authority. Engineers should document the NOPB substitution in a parts-change notice and verify the mitigation against the program's reliability targets.
Empfohlen
Industrial Control & Automation Modules
Industrial control modules (PLCs, motor drives, process instrumentation) sold globally must satisfy RoHS, REACH, and increasingly China RoHS 2.0 substance restrictions. NOPB-suffixed TI parts are the standard ordering choice for these modules, ensuring compliance out of the box without requiring a separate parts-conversion step. For example, a motor-control module using an LM35 temperature sensor, an LM7805 5V regulator, and an LM317 adjustable regulator would order all three with the NOPB suffix. The 260 C peak reflow compatibility also allows these modules to share the same SMT line profile as the rest of the industrial product family, simplifying the manufacturing process and reducing per-board setup time.
Empfohlen
Consumer Electronics Lead-Free Compliance
Consumer electronics (smartphones, laptops, wearables, smart-home devices) shipping globally must comply with EU RoHS, China RoHS, Japan RoHS, and California RoHS. NOPB-suffixed TI parts cover the bulk of the power-management, sensor, and interface IC requirements in these products. The /NOPB ordering suffix is widely recognized by contract manufacturers (CMs) and OEMs as the explicit code for RoHS-compliant finish, and is included in component libraries and BOM templates by default. For new consumer designs, NOPB is essentially a mandatory ordering attribute unless an explicit engineering exception is approved.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für NOPB – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PBFREE | LEADFREE | LF |
|---|---|---|---|---|
| Suffix Type | Ordering suffix (packaging attribute) | Ordering suffix (packaging attribute) | Ordering suffix (packaging attribute) | Short-form ordering suffix |
| Lead-Free / RoHS | Yes (matte Sn or Sn-Ag-Cu finish) | Yes | Yes | Yes |
| Peak Reflow Temperature | 260 C (JEDEC J-STD-020 lead-free) | 260 C | 260 C | 260 C |
| Origin / Brand | Texas Instruments (National Semi legacy) | Texas Instruments | Texas Instruments | Texas Instruments |
| Package | Inherits base MPN package | Inherits base MPN package | Inherits base MPN package | Inherits base MPN package |
| Silicon Die / Electrical Specs | Identical to non-NOPB variant | Identical to non-PBFREE variant | Identical to non-LEADFREE variant | Identical to non-LF variant |
| AEC-Q100 Automotive Grade | Inherits base MPN grade (suffix does not qualify) | Inherits base MPN grade | Inherits base MPN grade | Inherits base MPN grade |
| Documentation Reference | TI Packaging Terminology Guide | TI Packaging Terminology Guide | TI Packaging Terminology Guide | TI Packaging Terminology Guide |
Wichtigste Unterscheidungsmerkmale
- Explicitly documents RoHS / lead-free packaging compliance (vs. Non-NOPB base MPN)
- Backward compatible with mixed Sn-Pb and lead-free assembly lines (vs. Pure Sn-Pb legacy parts)
- Inherited from National Semiconductor, recognized industry-wide (vs. PBFREE suffix (other vendors))
Designhinweise
NOPB is a packaging-level suffix and is sometimes confused with a separate part number by procurement and BOM-management systems. The NOPB string must be appended to a base MPN with a forward slash (for example LM338T/NOPB) and is not a standalone IC. BOM tools that strip non-alphanumeric characters may break the suffix and cause wrong-part ordering. Configure the BOM import to preserve forward-slash ordering suffixes, or use a comment field for the suffix.
Estimated: NOPB-suffixed parts require a 260 C peak reflow profile (JEDEC J-STD-020 lead-free) versus 215-225 C for legacy Sn-Pb parts. The 35-45 C higher peak temperature increases thermal stress on the silicon die, on the moisture-sensitive package, and on adjacent temperature-sensitive components. Set the TAL (Time Above Liquidus, 217 C) to 60-90 seconds and the 260 C dwell to 20-40 seconds. Confirm the base MPN's MSL classification per JEDEC J-STD-033 and apply dry-pack handling if MSL 3 or higher. Always profile the oven with a thermocouple on the actual board, not the oven's setpoint.
NOPB devices use matte-tin (Sn) or Sn-Ag-Cu lead-frame finishes that are prone to tin-whisker growth under certain mechanical-stress, humidity, and temperature-cycling conditions. For high-reliability, long-life deployments (>10 years) in vibration or thermal-cycling environments, consider a tin-whisker mitigation strategy: conformal coating (acrylic, urethane, or parylene), underfill of the lead-frame, or selection of a non-tin finish (matte Sn with Ni-Pd-Au underlayer, or Sn-Pb for legacy defense programs). NOPB itself does not include whisker mitigation; it only indicates lead-free finish.
Compliance-Informationen
NOPB suffix explicitly denotes lead-free, RoHS-compliant packaging finish per TI Packaging Terminology Guide. REACH compliance per TI declaration. AEC-Q100 status inherits from the base MPN - the NOPB suffix itself does not confer or deny automotive qualification. Halogen-free status is not part of the NOPB attribute and depends on the base MPN's mold compound; consult the device-specific datasheet. Conflict-minerals compliance per TI CMRT declaration.
