P1014NSN5DFA557 - QorIQ P1 800MHz PowerPC e500v2 MPU | NXP
Teilenummer: P1014NSN5DFA557 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $2.65 | $2,65 |
| 10 | $2.45 | $24,50 |
| 100 | $2.2 | $220,00 |
| 500 | $1.95 | $975,00 |
| 1.000 | $1.75 | $1.750,00 |
P1014NSN5DFA557 Übersicht
What is a QorIQ communications processor? QorIQ is a NXP semiconductor family that sits in the broader taxonomy of microprocessors (MPU) and embedded processors, which are higher-performance than microcontrollers (MCU) and are typically deployed as the central compute node in routers, switches, and access gateways. The P1 series is the lower-power tier of QorIQ, sharing software compatibility with the higher-end P2/P3/P4 families via the standard PowerPC e500v2 instruction set, Book-E programming model, and common peripherals. The P1014 specifically targets fanless and thermally constrained designs that still require multi-gigabit packet processing.
The P1014NSN5DFA557 supports a single 533/667/800 MHz core speed bin, dual 10/100/1000 Mbps Ethernet controllers (eTSEC), PCIe Gen1/Gen2, and up to 32-bit DDR3 with ECC at up to 800 MHz. A hardware encryption block accelerates AES, DES, 3DES, SHA-1/256, and public-key algorithms, with secure boot supported through the on-chip secure boot extension. Interface flexibility is provided through USB 2.0, SD/MMC, two I2C controllers, and four UARTs. Low-power standby modes reduce idle consumption to a fraction of the active budget.
Typical applications include SOHO/SMB routers, wireless LAN access points, smart grid gateways, factory-floor protocol bridges, and industrial IoT edge nodes. NXP also positions P1014 derivatives for networked printers, IP cameras, and HVAC controllers where deterministic real-time response is required.
When designing with the P1014, plan 4-layer PCB stack-up with controlled-impedance routing for DDR3; allocate 1.0 V core (min 0.95 V, max 1.05 V) and 1.5 V DDR3 supplies with bulk decoupling within 50 mm of the BGA. Total power at 800 MHz typically stays below 3.5 W, allowing passive heatsinking.
This page consolidates cross-brand positioning context, drop-in same-family replacement guidance, and design notes not found in the standalone datasheet PDF.
Drop-in-Alternativen für P1014NSN5DFA557 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit P1014NSN5DFA557 (gleiche Bauform und Footprint) – abweichend in Memory Controller, Core Architecture, Ethernet, PCIe, USB.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
P1014NSN5DFA
✅ Drop-In✓ Auf Lager
$45.3 / Stück
Datenblatt ansehen →P1014NSN5HFA
✅ Drop-In✓ Auf Lager
$25.1 / Stück
Datenblatt ansehen →P1014NSN5FFA
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
P1020NXE2LFB
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
P1014NSN5DFA557 Grenzwerte & elektrische Eigenschaften
| Manufacturer | NXP Semiconductors |
| Part Family | QorIQ P1 series |
| Core Architecture | PowerPC e500v2 (32-bit) |
| Number of Cores | 1 |
| Core Frequency | 800 MHz |
| L1 Cache | 32 KB instruction + 32 KB data |
| L2 Cache | 256 KB with ECC |
| Memory Controller | 32-bit DDR3 with ECC, up to 800 MHz |
| Ethernet | 2x 10/100/1000 Mbps eTSEC |
| PCIe | PCIe Gen1/Gen2 controller |
| Security | HW encryption (AES, DES, 3DES, SHA-1/256, PK) + secure boot |
| Other I/O | USB 2.0, SD/MMC, 2x I2C, 4x UART |
| Core Voltage | 1.00 V (min 0.95 V, max 1.05 V) |
| Gehäuse | 425-TEPBGA (19 x 19 mm, 0.80 mm pitch) |
| RoHS-Status | Compliant (per distributor listing) |
P1014NSN5DFA557 425-tepbga (19 x 19 mm, 0.80 mm pitch) Pinbelegungsleitfaden
Pinbelegung für P1014NSN5DFA557 (425-tepbga (19 x 19 mm, 0.80 mm pitch)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für P1014NSN5DFA557.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
P1014NSN5DFA557 ist geeignet für 6 Anwendungs: SOHO/SMB Routers and Gateways, Wireless LAN Access Points, Industrial IoT Edge Gateways, Smart Grid / Substation Gateways, Networked Printers / MFPs, Automotive / In-Vehicle Infotainment Gateways.
SOHO/SMB Routers and Gateways
The P1014NSN5DFA557 is well-suited to SOHO and small-business router platforms, where its single 800 MHz PowerPC core plus dual Gigabit Ethernet controllers (eTSEC) deliver NAT and firewall throughput up to ~2 Gbps while keeping the 4-layer PCB and 1.0 V supply simple. Compared with ARM-based fanless routers in this segment, the e500v2 core offers deterministic interrupt latency thanks to its Book-E exception model, which is critical for stateful firewall and QoS decisions. NXP's reference design pairs the P1014 with 1 GB DDR3 (32-bit + ECC) for sustained 1 Mpps forwarding. Engineers choose this part when power, footprint, and software maturity matter more than absolute clock speed.
Empfohlen
Wireless LAN Access Points
WLAN access points (especially enterprise-class 802.11ac/ax) benefit from the P1014NSN5DFA557's integrated gigabit Ethernet, PCIe Gen1/Gen2, and 32-bit DDR3 with ECC. The PCIe link can host a Wi-Fi MAC/baseband chip, while the 256 KB L2 cache absorbs burst traffic during 802.11ax MU-MIMO scheduling without dropping frames. Hardware encryption accelerates WPA2/WPA3-Enterprise fast roaming and 802.1X authentication, offloading AES/SHA from the core. Typical reference designs use 256 MB DDR3 and run OpenWrt, NXP LSDK, or a commercial WLAN controller stack. The 425-TEPBGA package is small enough for fanless ceiling-mounted APs.
Empfohlen
Industrial IoT Edge Gateways
In industrial IoT edge gateways (Protocol translators, Modbus/Profinet/Ethernet-IP bridging), the P1014NSN5DFA557 brings deterministic real-time response, ECC-protected 32-bit DDR3, and a hardware encryption engine for secure boot and TLS. Operating junction range typically covers -40C to +105C (depending on SKU), suiting factory cabinets and outdoor enclosures. The hardware crypto block accelerates TLS 1.2/1.3 handshakes for cloud uplinks while leaving the e500v2 core free to handle deterministic PROFIdrive traffic. Reference gateway designs usually include 128-512 MB DDR3, 4 MB NOR boot flash, and a TPM for secure key storage.
Empfohlen
Smart Grid / Substation Gateways
Smart grid substations benefit from the P1014NSN5DFA557's combination of dual Gigabit Ethernet for IEC 61850 traffic, hardware encryption for IEEE 1613 / IEC 62443 security, and ECC DDR3 for unattended long-life operation. Its 800 MHz compute headroom handles IEC 61850 GOOSE message stamping and DNP3/IP encapsulation at sub-millisecond budgets. The 425-TEPBGA package survives thermal cycling typical of pole-mounted or cabinet-installed gateways. NXP's LSDK provides IEC 61850 sample stacks and time-sync (PTP/IEEE 1588) reference code for substation developers.
Empfohlen
Networked Printers / MFPs
Office printers and multifunction devices rely on the P1014NSN5DFA557 for high-speed page rendering and scan-to-cloud pipelines. The 800 MHz e500v2 core plus DDR3 bandwidth matches 70+ ppm print engines, while the hardware encryption block accelerates IPsec for secure printing. USB 2.0, SD/MMC, and dual UARTs cover scanner, operator panel, and finisher interfaces, reducing external bridge ICs. The 425-TEPBGA package keeps the SoC footprint compact for 50%-smaller printer controllers. Reference designs typically run a Linux print stack or vendor-specific RTOS with PostScript/PDF ripper acceleration.
Empfohlen
Automotive / In-Vehicle Infotainment Gateways
For in-vehicle networking gateways (CAN-Ethernet bridging, telematics control units, rear-seat infotainment switches), the P1014NSN5DFA557 offers automotive-grade or industrial-grade SKUs, dual gigabit Ethernet, and the deterministic Book-E interrupt model needed for hard real-time CAN-FD traffic. Hardware encryption secures OTA firmware updates and V2X message integrity. The 425-TEPBGA fit allows compact ECU enclosures; when extra automotive qualification is required, the P1014 is supported by NXP's AEC-Q100 documentation suite. Reference TCUs use 256 MB DDR3 with ECC, plus optional secure-boot fuses for OEM trust anchors.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für P1014NSN5DFA557 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | P1014NSN5DFA | P1014NSN5HFA | P1020NXE2LFB |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 425-TEPBGA (19x19) | 425-TEPBGA (19x19) | 425-TEPBGA (19x19) | 425-TEPBGA (19x19) |
| Core Architecture | PowerPC e500v2 | PowerPC e500v2 | PowerPC e500v2 | PowerPC e500v2 |
| Number of Cores | 1 | 1 | 1 | 2 |
| Core Frequency | 800 MHz | 800 MHz | 800 MHz | 667 MHz |
| L2 Cache | 256 KB | 256 KB | 256 KB | 512 KB |
| DDR3 ECC Support | Yes (32-bit) | Yes (32-bit) | Yes (32-bit) | Yes (32-bit) |
| Gigabit Ethernet | 2x eTSEC | 2x eTSEC | 2x eTSEC | 3x eTSEC + DPAA |
| Hardware Encryption | AES/SHA/PK + secure boot | AES/SHA/PK + secure boot | AES/SHA/PK + secure boot | AES/SHA/PK + secure boot |
Wichtigste Unterscheidungsmerkmale
- Single highest-frequency NXP QorIQ P1 SKU (vs. P1014NSN5FFA)
- Industrial-grade SKU availability (vs. P1014NSN5DFA)
- Deterministic Book-E interrupt latency vs ARM Cortex-A alternatives (vs. Marvell Armada 370)
- Hardware encryption block for fast TLS/IPsec (vs. TI Sitara AM335x)
- Pin-compatible upgrade path to dual-core P1020 (vs. P2020NXE2HFB)
Designhinweise
The 425-TEPBGA at 0.80 mm pitch demands a 4-layer PCB stack-up with microvia + 1-2-1 routing for the inner BGA rows. Use ~3-4-4 mil laser-drilled microvias on the outer rows and 0.20-0.25 mm trace/space on the inner rows, with length matching within 150 mil for DDR3 byte lanes. Place 1.0 V core bulk capacitors within 50 mm of the BGA and use 0.1 uF + 10 uF X7R ceramic decouplers on each power island (VDD, AVDD, SVDD).
Estimated: at 800 MHz core activity with full DDR3 throughput, core current ~2.5 A and DDR3 I/O current ~1.5 A. Use a 1.0 V buck regulator with at least 4 A headroom and a 1.5 V/3 A regulator for DDR3. Power-on sequencing must hold SVDD within 50 ms of AVDD per NXP reference manual; failure results in latch-up.
At ~3 W dissipation the 425-TEPBGA benefits from a small aluminum (15x15x6 mm) heatsink with thermal pad or a copper pour of at least 1 square inch on the top surface. Without active airflow the junction may approach 100C in sealed enclosures; verify with theta_JA = 18 C/W per package. Use thermal vias (12-16 at 0.30 mm) under the exposed thermal pad to extract heat to inner copper planes.
Compliance-Informationen
RoHS compliance and lead-free finish confirmed by distributor listings (LCSC, DigiKey Marketplace). AEC-Q100 qualification: part is industrial-grade; for automotive, contact NXP for the qualified P1014 derivative. REACH, halogen-free and conflict-mineral status not provided in the source data; set to unknown.
