P1014NSN5DFA557 - QorIQ P1 800MHz PowerPC e500v2 MPU | NXP
Référence : P1014NSN5DFA557 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $2.65 | $2,65 |
| 10 | $2.45 | $24,50 |
| 100 | $2.2 | $220,00 |
| 500 | $1.95 | $975,00 |
| 1 000 | $1.75 | $1 750,00 |
P1014NSN5DFA557 Présentation
What is a QorIQ communications processor? QorIQ is a NXP semiconductor family that sits in the broader taxonomy of microprocessors (MPU) and embedded processors, which are higher-performance than microcontrollers (MCU) and are typically deployed as the central compute node in routers, switches, and access gateways. The P1 series is the lower-power tier of QorIQ, sharing software compatibility with the higher-end P2/P3/P4 families via the standard PowerPC e500v2 instruction set, Book-E programming model, and common peripherals. The P1014 specifically targets fanless and thermally constrained designs that still require multi-gigabit packet processing.
The P1014NSN5DFA557 supports a single 533/667/800 MHz core speed bin, dual 10/100/1000 Mbps Ethernet controllers (eTSEC), PCIe Gen1/Gen2, and up to 32-bit DDR3 with ECC at up to 800 MHz. A hardware encryption block accelerates AES, DES, 3DES, SHA-1/256, and public-key algorithms, with secure boot supported through the on-chip secure boot extension. Interface flexibility is provided through USB 2.0, SD/MMC, two I2C controllers, and four UARTs. Low-power standby modes reduce idle consumption to a fraction of the active budget.
Typical applications include SOHO/SMB routers, wireless LAN access points, smart grid gateways, factory-floor protocol bridges, and industrial IoT edge nodes. NXP also positions P1014 derivatives for networked printers, IP cameras, and HVAC controllers where deterministic real-time response is required.
When designing with the P1014, plan 4-layer PCB stack-up with controlled-impedance routing for DDR3; allocate 1.0 V core (min 0.95 V, max 1.05 V) and 1.5 V DDR3 supplies with bulk decoupling within 50 mm of the BGA. Total power at 800 MHz typically stays below 3.5 W, allowing passive heatsinking.
This page consolidates cross-brand positioning context, drop-in same-family replacement guidance, and design notes not found in the standalone datasheet PDF.
Alternatives de remplacement direct pour P1014NSN5DFA557 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec P1014NSN5DFA557 (même facteur de forme et même empreinte) — différant par Memory Controller, Core Architecture, Ethernet, PCIe, USB.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
P1014NSN5DFA
✅ Remplacement direct✓ En stock
$45.3 / unité
Voir la fiche technique →P1014NSN5HFA
✅ Remplacement direct✓ En stock
$25.1 / unité
Voir la fiche technique →P1014NSN5FFA
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
P1020NXE2LFB
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
P1014NSN5DFA557 Valeurs maximales et caractéristiques électriques
| Manufacturer | NXP Semiconductors |
| Part Family | QorIQ P1 series |
| Core Architecture | PowerPC e500v2 (32-bit) |
| Number of Cores | 1 |
| Core Frequency | 800 MHz |
| L1 Cache | 32 KB instruction + 32 KB data |
| L2 Cache | 256 KB with ECC |
| Memory Controller | 32-bit DDR3 with ECC, up to 800 MHz |
| Ethernet | 2x 10/100/1000 Mbps eTSEC |
| PCIe | PCIe Gen1/Gen2 controller |
| Security | HW encryption (AES, DES, 3DES, SHA-1/256, PK) + secure boot |
| Other I/O | USB 2.0, SD/MMC, 2x I2C, 4x UART |
| Core Voltage | 1.00 V (min 0.95 V, max 1.05 V) |
| Boîtier | 425-TEPBGA (19 x 19 mm, 0.80 mm pitch) |
| Statut RoHS | Compliant (per distributor listing) |
Guide de configuration des broches du P1014NSN5DFA557 425-tepbga (19 x 19 mm, 0.80 mm pitch)
Configuration des broches du P1014NSN5DFA557 (boîtier 425-tepbga (19 x 19 mm, 0.80 mm pitch)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour P1014NSN5DFA557.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
P1014NSN5DFA557 convient pour 6 applications: SOHO/SMB Routers and Gateways, Wireless LAN Access Points, Industrial IoT Edge Gateways, Smart Grid / Substation Gateways, Networked Printers / MFPs, Automotive / In-Vehicle Infotainment Gateways.
SOHO/SMB Routers and Gateways
The P1014NSN5DFA557 is well-suited to SOHO and small-business router platforms, where its single 800 MHz PowerPC core plus dual Gigabit Ethernet controllers (eTSEC) deliver NAT and firewall throughput up to ~2 Gbps while keeping the 4-layer PCB and 1.0 V supply simple. Compared with ARM-based fanless routers in this segment, the e500v2 core offers deterministic interrupt latency thanks to its Book-E exception model, which is critical for stateful firewall and QoS decisions. NXP's reference design pairs the P1014 with 1 GB DDR3 (32-bit + ECC) for sustained 1 Mpps forwarding. Engineers choose this part when power, footprint, and software maturity matter more than absolute clock speed.
Recommandé
Wireless LAN Access Points
WLAN access points (especially enterprise-class 802.11ac/ax) benefit from the P1014NSN5DFA557's integrated gigabit Ethernet, PCIe Gen1/Gen2, and 32-bit DDR3 with ECC. The PCIe link can host a Wi-Fi MAC/baseband chip, while the 256 KB L2 cache absorbs burst traffic during 802.11ax MU-MIMO scheduling without dropping frames. Hardware encryption accelerates WPA2/WPA3-Enterprise fast roaming and 802.1X authentication, offloading AES/SHA from the core. Typical reference designs use 256 MB DDR3 and run OpenWrt, NXP LSDK, or a commercial WLAN controller stack. The 425-TEPBGA package is small enough for fanless ceiling-mounted APs.
Recommandé
Industrial IoT Edge Gateways
In industrial IoT edge gateways (Protocol translators, Modbus/Profinet/Ethernet-IP bridging), the P1014NSN5DFA557 brings deterministic real-time response, ECC-protected 32-bit DDR3, and a hardware encryption engine for secure boot and TLS. Operating junction range typically covers -40C to +105C (depending on SKU), suiting factory cabinets and outdoor enclosures. The hardware crypto block accelerates TLS 1.2/1.3 handshakes for cloud uplinks while leaving the e500v2 core free to handle deterministic PROFIdrive traffic. Reference gateway designs usually include 128-512 MB DDR3, 4 MB NOR boot flash, and a TPM for secure key storage.
Recommandé
Smart Grid / Substation Gateways
Smart grid substations benefit from the P1014NSN5DFA557's combination of dual Gigabit Ethernet for IEC 61850 traffic, hardware encryption for IEEE 1613 / IEC 62443 security, and ECC DDR3 for unattended long-life operation. Its 800 MHz compute headroom handles IEC 61850 GOOSE message stamping and DNP3/IP encapsulation at sub-millisecond budgets. The 425-TEPBGA package survives thermal cycling typical of pole-mounted or cabinet-installed gateways. NXP's LSDK provides IEC 61850 sample stacks and time-sync (PTP/IEEE 1588) reference code for substation developers.
Recommandé
Networked Printers / MFPs
Office printers and multifunction devices rely on the P1014NSN5DFA557 for high-speed page rendering and scan-to-cloud pipelines. The 800 MHz e500v2 core plus DDR3 bandwidth matches 70+ ppm print engines, while the hardware encryption block accelerates IPsec for secure printing. USB 2.0, SD/MMC, and dual UARTs cover scanner, operator panel, and finisher interfaces, reducing external bridge ICs. The 425-TEPBGA package keeps the SoC footprint compact for 50%-smaller printer controllers. Reference designs typically run a Linux print stack or vendor-specific RTOS with PostScript/PDF ripper acceleration.
Recommandé
Automotive / In-Vehicle Infotainment Gateways
For in-vehicle networking gateways (CAN-Ethernet bridging, telematics control units, rear-seat infotainment switches), the P1014NSN5DFA557 offers automotive-grade or industrial-grade SKUs, dual gigabit Ethernet, and the deterministic Book-E interrupt model needed for hard real-time CAN-FD traffic. Hardware encryption secures OTA firmware updates and V2X message integrity. The 425-TEPBGA fit allows compact ECU enclosures; when extra automotive qualification is required, the P1014 is supported by NXP's AEC-Q100 documentation suite. Reference TCUs use 256 MB DDR3 with ECC, plus optional secure-boot fuses for OEM trust anchors.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour P1014NSN5DFA557 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | P1014NSN5DFA | P1014NSN5HFA | P1020NXE2LFB |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 425-TEPBGA (19x19) | 425-TEPBGA (19x19) | 425-TEPBGA (19x19) | 425-TEPBGA (19x19) |
| Core Architecture | PowerPC e500v2 | PowerPC e500v2 | PowerPC e500v2 | PowerPC e500v2 |
| Number of Cores | 1 | 1 | 1 | 2 |
| Core Frequency | 800 MHz | 800 MHz | 800 MHz | 667 MHz |
| L2 Cache | 256 KB | 256 KB | 256 KB | 512 KB |
| DDR3 ECC Support | Yes (32-bit) | Yes (32-bit) | Yes (32-bit) | Yes (32-bit) |
| Gigabit Ethernet | 2x eTSEC | 2x eTSEC | 2x eTSEC | 3x eTSEC + DPAA |
| Hardware Encryption | AES/SHA/PK + secure boot | AES/SHA/PK + secure boot | AES/SHA/PK + secure boot | AES/SHA/PK + secure boot |
Principaux différenciateurs
- Single highest-frequency NXP QorIQ P1 SKU (vs P1014NSN5FFA)
- Industrial-grade SKU availability (vs P1014NSN5DFA)
- Deterministic Book-E interrupt latency vs ARM Cortex-A alternatives (vs Marvell Armada 370)
- Hardware encryption block for fast TLS/IPsec (vs TI Sitara AM335x)
- Pin-compatible upgrade path to dual-core P1020 (vs P2020NXE2HFB)
Notes de conception
The 425-TEPBGA at 0.80 mm pitch demands a 4-layer PCB stack-up with microvia + 1-2-1 routing for the inner BGA rows. Use ~3-4-4 mil laser-drilled microvias on the outer rows and 0.20-0.25 mm trace/space on the inner rows, with length matching within 150 mil for DDR3 byte lanes. Place 1.0 V core bulk capacitors within 50 mm of the BGA and use 0.1 uF + 10 uF X7R ceramic decouplers on each power island (VDD, AVDD, SVDD).
Estimated: at 800 MHz core activity with full DDR3 throughput, core current ~2.5 A and DDR3 I/O current ~1.5 A. Use a 1.0 V buck regulator with at least 4 A headroom and a 1.5 V/3 A regulator for DDR3. Power-on sequencing must hold SVDD within 50 ms of AVDD per NXP reference manual; failure results in latch-up.
At ~3 W dissipation the 425-TEPBGA benefits from a small aluminum (15x15x6 mm) heatsink with thermal pad or a copper pour of at least 1 square inch on the top surface. Without active airflow the junction may approach 100C in sealed enclosures; verify with theta_JA = 18 C/W per package. Use thermal vias (12-16 at 0.30 mm) under the exposed thermal pad to extract heat to inner copper planes.
Informations de conformité
RoHS compliance and lead-free finish confirmed by distributor listings (LCSC, DigiKey Marketplace). AEC-Q100 qualification: part is industrial-grade; for automotive, contact NXP for the qualified P1014 derivative. REACH, halogen-free and conflict-mineral status not provided in the source data; set to unknown.
