P1020NSE2FFB - QorIQ P1 Dual-Core 800MHz SoC | NXP Semiconductors
Teilenummer: P1020NSE2FFB ⚠ Letzte Bestellmöglichkeit| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $54.4439 | $54,44 |
| 10 | $52.8 | $528,00 |
| 100 | $49.2 | $4.920,00 |
| 500 | $44.6 | $22.300,00 |
| 1.000 | $39.95 | $39.950,00 |
P1020NSE2FFB Übersicht
A QorIQ communications processor is a multicore system-on-chip designed by NXP for routers, switches, WAN optimization, and industrial control. It typically integrates CPU cores, a high-bandwidth system bus, DDR memory controller, Ethernet MACs, PCIe, USB, security engines, and TDM interfaces, replacing multiple discrete components on legacy PowerQUICC designs. The QorIQ P1 sits within the broader Power Architecture / PowerQUICC family hierarchy (e500v2 core -> dual-core SoC -> QorIQ P1 platform -> Power Architecture networking SoC -> embedded processor).
Key features include dual e500v2 cores at 667/333/667 MHz core-to-platform ratios, DDR2/DDR3 memory controller with ECC, GbE interfaces, integrated SEC security engine, PCIe, USB 2.0, and TDM. Operating temperature spans 0C to 125C junction, making the part suitable for industrial and networking environments with elevated ambient temperatures.
The architecture combines high-throughput on-chip interconnect, dual-issue in-order execution cores, and a flexible peripheral set. The 45 nm process enables tighter power budgets versus prior PowerQUICC III devices. According to NXP product literature, P1020 series parts support hardware-accelerated encryption, QoS queues, and pattern matching for deep-packet inspection at line rate.
Typical applications include multiservice routers, industrial gateways, defense and aerospace controllers, factory automation nodes, secure VPN appliances, and LTE/WiMAX base-station control planes. The combination of two cores plus integrated GbE MACs makes it well-suited for fan-out on a backplane while the SEC engine handles IPsec without burdening the cores.
Design considerations include robust thermal dissipation due to the 31x31 mm BGA exposed pad, careful signal-integrity work for DDR3 at 667 MHz, and provision for boot ROM and NAND flash for secure boot chains. Power sequencing of the 1.0 V core and 1.5/1.8 V DDR rails must follow the reference manual to avoid I/O damage.
This page consolidates distributor pricing, drop-in alternatives from the same QorIQ P1 family, and practical design considerations not assembled in a single place on the manufacturer datasheet.
Drop-in-Alternativen für P1020NSE2FFB – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit P1020NSE2FFB (gleiche Bauform und Footprint) – abweichend in Operating Temperature, USB, RoHS Status, Ethernet, L2 Cache.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
P1020NXE2FFB
✅ Drop-In✓ Auf Lager
$54.95 / Stück
Datenblatt ansehen →P1020NSE2DFB
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
P1020NSN2HFB
✅ Drop-In✓ Auf Lager
$55.8 / Stück
Datenblatt ansehen →P1012NSN2DFB
✅ Drop-In✓ Auf Lager
$38.66 / Stück
Datenblatt ansehen →P1020NXE2HFB
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
P1020NSE2FFB Grenzwerte & elektrische Eigenschaften
| Processor Type | QorIQ P1 series, dual-core PowerPC e500v2 |
| Number of Cores | 2 |
| Core Frequency | 667 MHz (core), 333 MHz (platform), 667 MHz (core2) |
| Marketing / Maximum Frequency | 800 MHz |
| Process Technology | 45 nm |
| Datenbusbreite | 32-bit |
| Memory Controller | DDR2/DDR3 with ECC |
| Ethernet | Integrated GbE (3x MAC) |
| PCIe | PCIe Gen1 / Gen2 |
| USB | USB 2.0 |
| Security Engine | SEC (hardware-accelerated crypto) |
| TDM / Serial Interface | Yes (TDM) |
| Gehäuse | 689-TEPBGA II (31x31 mm) |
| Betriebstemperatur | 0C to 125C (Tj) |
| Package Type | 689-BBGA Exposed Pad (Tray) |
| Lead Free / RoHS | Lead Free, RoHS Compliant |
| Junction Temperature Max | 125 C |
P1020NSE2FFB 689-bbga exposed pad (tray) Pinbelegungsleitfaden
Pinbelegung für P1020NSE2FFB (689-bbga exposed pad (tray)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für P1020NSE2FFB.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
P1020NSE2FFB ist geeignet für 6 Anwendungs: Multiservice Routers and Gateways, Industrial Gateway and Edge Controller, Defensive and Aerospace Compute Platforms, Network Attached Storage Controllers, Small-Cell LTE/WiMAX Base-Station Control, Smart Grid and Substation Equipment.
Multiservice Routers and Gateways
The P1020NSE2FFB integrates dual e500v2 cores, three GbE MACs, and a hardware SEC engine on a single 31x31 mm die - exactly the combination required for multiservice router designs combining packet forwarding, IPsec termination, and QoS policing on the same SoC. The DDR2/DDR3 ECC controller supports line-rate lookup tables for routing/ACL while the integrated SEC hardware accelerates AES, 3DES, and SHA at multi-gigabit rates. At dual 667 MHz core clock with 333 MHz platform fabric, the part delivers approximately 1.5 Gbps of encrypted packet throughput per core. Place external DDR3 DRAM within 50 mm of the BGA to maintain signal integrity; layer 2/3 packet processing is offloaded by the SEC engine, freeing cores for control-plane BGP/OSPF tasks without CPU saturation. Estimated power at full dual-core forwarding load with one GbE active is 6-7 W.
Empfohlen
Industrial Gateway and Edge Controller
The P1020NSE2FFB's PCIe and USB 2.0 connectivity enables it to act as the system-on-chip in industrial gateways that aggregate CAN, Modbus, and Ethernet/IP traffic from field devices. The dual-core configuration allows one core to handle deterministic real-time protocol stacks while the second runs Linux for management and analytics. Hardware QC patterns in the Freescale PME engine accelerate firewall filtering at line rate. Operating temperature of 0C to 125C junction handles factory environments without additional thermal headsink hardware beyond a 4-layer copper PCB. The integrated SEC engine secures remote firmware updates for unattended industrial cabinets. Estimated core power at 800 MHz with both cores active and PCIe enabled is approximately 5 W.
Empfohlen
Defensive and Aerospace Compute Platforms
The P1020NSE2FFB is approved for use in defense and aerospace embedded subsystems where software compatibility and long-life cycle outweigh bleeding-edge performance. The Power Architecture e500v2 instruction set preserves years of validated mission software, while the QorIQ platform delivers Triple-speed GbE, TDM, and PCIe for avionics bus bridging. Hardware SEC provides FIPS-grade cryptographic acceleration for black-side datalinks. The 689-TEPBGA II exposed pad enables conduction-cooled module integration with a cold plate. Junction-temperature qualified to 125C supports unpressurized or high-altitude applications. SEC engine performance scales to roughly 1 Gbps of AES-256 bulk encryption at 800 MHz core clock.
Empfohlen
Network Attached Storage Controllers
The P1020NSE2FFB can serve as the system controller for mid-range network attached storage (NAS) appliances thanks to its high-throughput DDR3 controller and integrated GbE MACs. The dual cores can split storage-stack processing between data plane (RAID engine, iSCSI offload) and control plane (file system, authentication). PCIe Gen1/Gen2 lanes accommodate an external SAS/SATA controller for 8-24 drive bays. Hardware SEC accelerates SMB3 encryption at line rate. At full dual-core load with one GbE active, power dissipation is estimated at 6 W. The exposed thermal pad allows direct bonding to a chassis-integrated heatsink.
Empfohlen
Small-Cell LTE/WiMAX Base-Station Control
In LTE small-cell base-station equipment, the P1020NSE2FFB provides the Layer-2 control-plane compute alongside baseband DSP. Dual cores share PHY-MAC scheduling and backhaul encryption, with the integrated SEC engine accelerating IPsec for S1-U traffic. DDR3 ECC memory maintains long uptime integrity at elevated ambient temperatures. The 0C to 125C operating envelope is compatible with outdoor fanless chassis. Hardware PME pattern matching enables fast DPI for lawful intercept and QoS marking. Estimated case temperature at full dual-core LTE MAC load is 95-105C - well within the 125C junction limit.
Empfohlen
Smart Grid and Substation Equipment
The P1020NSE2FFB is suited for IEC 61850 substation controllers and smart-grid gateways because of its ruggedized operating range, hardware encryption, and deterministic GbE. Dual cores handle IEC 61850 GOOSE/Sampled-Values pre-processing on one side and SCADA gateway duty on the other. The Freescale SEC engine accelerates MAC authentication for critical infrastructure. Ruggedized 125C Tj with the 689-TEPBGA II exposed pad allows convection cooling in NEMA-4 enclosures without forced airflow. The PCI Express lanes accept standard PTP/IEEE 1588 timing cards. Estimated power at idle control-loop duty is 2-3 W.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für P1020NSE2FFB – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | P1020NXE2FFB | P1020NSE2DFB | P1020NSN2HFB | P1012NSN2DFB | P1020NXE2HFB |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 689-TEPBGA II (31x31 mm) | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same |
| Series | QorIQ P1 | QorIQ P1 | QorIQ P1 | QorIQ P1 | QorIQ P1 | QorIQ P1 |
| Number of Cores | 2 | 2 | 2 | 2 | 1 (single-core) | 2 |
| Core Frequency | 800 MHz | 800 MHz | 800 MHz | 800 MHz | 800 MHz | 800 MHz |
| Memory Controller | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC |
| Operating Temperature | 0C to 125C Tj | 0C to 125C Tj | 0C to 125C Tj | 0C to 125C Tj | 0C to 125C Tj | 0C to 125C Tj |
| RoHS / Lead Free | Yes / Yes | Yes / Yes | Yes / Yes | Yes / Yes | Yes / Yes | Yes / Yes |
Wichtigste Unterscheidungsmerkmale
- Dual e500v2 cores at 800 MHz on a 31x31 mm BGA (vs. P1012NSN2DFB)
- Integrated hardware SEC crypto engine (vs. P1020NSN2HFB)
- DDR2/DDR3 ECC support for telecom-grade reliability (vs. P1020NXE2FFB)
Designhinweise
Estimated: The 689-TEPBGA II package is rated for a multi-layer PCB with the exposed pad soldered to a copper thermal pad on at least 4 layers of 1 oz copper. With a typical SoC theta-JB around 0.5 C/W and ambient of 70C, dual-core full-load power of 7 W yields approximately 4C junction rise above the board, leaving headroom to the 125C Tj limit. Forced airflow is recommended above 5 W or in sealed enclosures.
DDR3 routes must be length-matched with 5 mil tolerance on the byte group to 50 ohm single-ended impedance. Use 8 mil microstrip on inner layers for the e500v2 platform bus. Place termination resistors within 200 mils of the BGA balls. Decouple each VDD ball with one 0.1 uF X7R plus one 10 nF X7R capacitor within the same BGA land perimeter. Reference the manufacturer hardware development kit design checklist for the full BGA escape pattern.
Run power-rail sequencing so that 1.0 V Vcore rises before 1.5/1.8 V DDR power, and 3.3 V I/O follows DDR. Violating sequencing can latch-up the e500v2 SOC. Place a Schottky diode on the 1.0 V rail to absorb reverse current during DDR power collapse. Reference the NXP P1020 reference manual section 4.2 for the exact sequence and timing windows.
Avoid using non-ECC DDR3 modules on telecom or defense builds - the controller's ECC pins must be populated correctly or the boot sequence will abort silently. Ensure the reset pulse from the supervisory device is at least 100 us wide and held after Vcore stabilizes. Boot ROM straps (cfg_rom_loc signals) MUST be set before release from POR to avoid accidental PLL over-clocking. Reference the QorIQ P1020 reference manual bootstrap chapter for strap assignments.
Estimated: at full dual-core 800 MHz load with GbE and PCIe active, the part draws approximately 7 W typical and up to 9 W under crypto peaks. Use a switching regulator with 2% load regulation on the 1.0 V Vcore, sized at 1.3x peak current. A multiphase buck with adaptive voltage scaling (AVS) can drop idle power by approximately 30%, per QorIQ P1 design guidelines.
Compliance-Informationen
RoHS and lead-free compliance confirmed by DigiKey, Mouser, and NXP product page. Halogen-free status per GlobalSpec datasheet record. Not AEC-Q100 qualified - P1020 family targets industrial/networking/aerospace/defense, not automotive. Conflict-minerals compliance per Freescale/NXP program participation.
