P1020NSN2HFB - QorIQ P1 2-Core 800MHz SoC MPU | NXP
MPN: P1020NSN2HFB ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $72.1 | $721.00 |
| 100 | $65.4 | $6,540.00 |
| 250 | $60 | $15,000.00 |
| 500 | $55.8 | $27,900.00 |
P1020NSN2HFB Overview
A microprocessor (MPU) in the QorIQ family is a system-on-chip (SoC) processor integrating CPU cores, memory controllers, and high-speed serial I/O on one die. Within the broader taxonomy, the P1020NSN2HFB is a Power Architecture (PowerPC) embedded microprocessor - the direct successor to the PowerQUICC III communications processors - sitting in the hierarchy: microprocessor -> embedded processor -> networking/communications SoC -> QorIQ P1 platform. Unlike a microcontroller (MCU), an MPU like the P1020NSN2HFB is designed to run a full operating system (Linux, VxWorks) and external DRAM, not bare-metal firmware with on-chip flash.
Key features of the P1020NSN2HFB include dual e500v2 cores at 800 MHz with integrated L1/L2 caches, a 64-bit DDR2/DDR3 SDRAM controller supporting ECC for high-reliability memory subsystems, three PCI Express interfaces (one x4 + two x1), dual Gigabit Ethernet controllers with SGMII support, USB 2.0, TDM, SPI, I2C, and hardware encryption engines. The platform runs at 400 MHz while DDR can be clocked up to 667 MHz, providing balanced memory throughput for packet processing workloads.
Architecturally, the P1020NSN2HFB uses a coherent dual-core e500v2 implementation with a shared L2 cache and a high-bandwidth system bus. Built on a 45 nm process, it dissipates on the order of 5 W under typical networking loads, making it suitable for fanless industrial designs with proper thermal management. The integrated datapath acceleration engine (DPAA) offloads packet classification, queue management, and crypto from the cores, which is critical for line-rate gigabit routing and switching.
Typical applications include branch-office routers, industrial Ethernet gateways, factory automation controllers, defense radios, and avionics networking subsystems where deterministic dual-core performance, hardware offload, and extended temperature qualification (0 to 125C junction) matter. Pairing the SoC with DDR3 ECC memory and a managed PHY creates a compact, high-reliability networking platform.
When designing with this part, allocate a 31x31 mm PCB footprint with a via-in-pad thermal array to dissipate the ~5 W typical load, and follow NXP's reference design for DDR3-667 trace length matching. Per the manufacturer part page, the standard P1020NSN2HFB is being moved toward End of Life; verify last-time-buy windows or migrate to the P1020NSN2HFB-Q1 (AEC-Q100) variant for automotive-grade designs.
This page synthesizes distributor pricing, drop-in alternatives in the same 689-TEPBGA II package, parametric comparisons vs P1011 and P1022 variants, and practical hardware design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for P1020NSN2HFB — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with P1020NSN2HFB (same form factor and footprint) — differing in Operating Temperature, Memory Controller, Package, USB, Core Frequency.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
P1020NXE2HFB
✅ Drop-In📋 Reference alternative (not in catalog)
P1020NXE2FFB
✅ Drop-In✓ In Stock
$54.95 / Unit
View Datasheet →P1020PSE2FDB
✅ Drop-In📋 Reference alternative (not in catalog)
P1011NXN2HFB
✅ Drop-In📋 Reference alternative (not in catalog)
P1020NSN2HFB-Q1
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
P1020NSN2HFB Maximum Ratings & Electrical Characteristics
| Core Architecture | PowerPC e500v2 |
| Number of Cores | 2 |
| Data Bus Width | 32-bit |
| Maximum Core Frequency | 800 MHz |
| Platform Frequency | 400 MHz |
| DDR Memory Frequency | 667 MHz (DDR2/DDR3) |
| Silicon Revision | 1.1 |
| Product Identifier | 800/400/667 ST NE r1.1 |
| Package | 689-TEPBGA II (31x31 mm) |
| Mounting Type | Surface Mount |
| Operating Temperature | 0C to +125C |
| Memory Controller | DDR2/DDR3 with ECC |
| Ethernet | Dual Gigabit Ethernet (SGMII) |
| PCI Express | 1 x PCIe x4 + 2 x PCIe x1 |
| USB | USB 2.0 |
| Security / Acceleration | Integrated DPAA + crypto engines |
| Series | QorIQ P1 Platform |
| RoHS Status | Compliant |
P1020NSN2HFB 689-tepbga ii (31x31 mm) Pin Configuration Guide
Pin configuration for P1020NSN2HFB (689-tepbga ii (31x31 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for P1020NSN2HFB.
Refer to the datasheet for full pin configuration.
Typical Applications
P1020NSN2HFB is suitable for 6 applications: Branch-Office Router / WAN Edge, Industrial Ethernet Gateway / Protocol Converter, Defense / Aerospace Secure Communications, Telecom Edge / Access Equipment, Network-Attached Storage / SOHO NAS, Smart-Grid / Substation Controller.
Branch-Office Router / WAN Edge
The P1020NSN2HFB fits branch-office routers because its dual e500v2 cores at 800 MHz deliver ~3,500 MIPS of compute, while the integrated DPAA offloads packet classification, queue management, and IPsec at line rate. With dual Gigabit Ethernet (SGMII) plus 1 PCIe x4 and 2 PCIe x1, the SoC connects to a WAN PHY, a multi-port LAN switch, and an external crypto accelerator without glue logic. The DDR3-667 controller with ECC gives the routing table and connection-tracking entries reliable memory at gigabit speeds, and the 0-125C junction temperature rating covers unventilated wiring-closet installations. Compared with a host-CPU + NPU split, a P1020-based router BOM saves ~$8-15 in discrete components and 25% PCB area.
Recommended
Industrial Ethernet Gateway / Protocol Converter
In industrial Ethernet gateways, the P1020NSN2HFB runs a real-time protocol stack (EtherCAT, PROFINET, Modbus/TCP) on one core while the second core handles the fieldbus master/slave traffic or HTTP/SCADA web server. The dual Gigabit Ethernet ports connect to the plant network and a local HMI switch; the PCIe x4 lane can attach an industrial-grade isolated Ethernet MAC for EtherCAT or a wireless modem for cellular failover. The DDR3-667 with ECC is essential in factory environments where single-bit DRAM errors from EMI would otherwise corrupt log records. The 0-125C junction range and rugged TEPBGA II package support IP20 control cabinets and outdoor enclosures without active cooling, reducing MTBF.
Recommended
Defense / Aerospace Secure Communications
The P1020NSN2HFB is well-suited to defense radios and avionics networking subsystems because it is rated to 0-125C junction, supports ECC memory for SEU/SEL mitigation, and integrates hardware encryption engines (when ordered as the NXE2/FFE variants) for Type-1 or Suite-B cryptography. Two e500v2 cores run the secure and non-secure OS partitions separately (red-black separation) without requiring a separate secure processor, reducing SWaP-C (size, weight, power, cost). The PCIe and Serial RapidIO interfaces connect to FPGA-based RF front-ends and DSP co-processors, while the TDM interface drives legacy MIL-STD-188 or PCM telemetry buses. Hardware BOM shrinks 30-40% compared with discrete CPU + FPGA + security chip designs.
Recommended
Telecom Edge / Access Equipment
The P1020NSN2HFB supports telecom edge nodes and access equipment (DSLAM line cards, GPON ONT, small-cell baseband) where dual-core e500v2 performance, hardware QoS, and timing-sync peripherals are required. The integrated datapath acceleration engine handles 1 Gbps line-rate packet forwarding while one e500v2 core runs the control-plane stack (TR-069, NETCONF/YANG). The DDR3-667 controller with ECC serves a large connection-tracking table needed for stateful firewalls and NAT, and the TDM interface drives legacy E1/T1 backhaul. Compared with the older PowerQUICC III MPC8313, the P1020 cuts power per packet by ~40% and adds native IPv6 hardware offload.
Recommended
Network-Attached Storage / SOHO NAS
The P1020NSN2HFB's dual e500v2 cores, PCIe x4 for SATA/SAS RAID controllers, USB 2.0 for external backup, and dual Gigabit Ethernet (one for LAN, one for link aggregation) make it a fit for SOHO NAS appliances. One core can run the NAS management stack (SMB/NFS/iSCSI) while the other handles RAID rebuild, scrubbing, or virus-scan jobs. The DDR3-667 with ECC protects against bit-rot in long-term archival storage, and the 0-125C rating supports fanless chassis designs. The TEPBGA II thermal lid accepts a low-profile heatsink, enabling silent operation in home-office environments.
Recommended
Smart-Grid / Substation Controller
In IEC 61850-based substation controllers and smart-grid RTUs, the P1020NSN2HFB runs the GOOSE messaging stack and SCADA protocols on the e500v2 cores, while the PCIe attaches an IEC 61850-3 compliant Ethernet switch and the TDM/SPI interfaces connect to legacy teleprotection equipment. The hardware encryption engines authenticate and encrypt DNP3/IP and IEC 104 traffic. The DDR3-667 controller with ECC handles large disturbance-recording buffers, and the 0-125C junction rating survives the unventilated cabinet environment of medium-voltage substations. Hardware-assisted PRP/HSR redundancy protocols ensure zero-loss failover on substation LAN.
Recommended
Recommended Products Summary
Engineering reference data for P1020NSN2HFB — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | P1020NXE2HFB | P1020NXE2FFB | P1020PSE2FDB | P1011NXN2HFB | P1020NSN2HFB-Q1 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 689-TEPBGA II (31x31 mm) | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same |
| Number of Cores | 2 | 2 | 2 | 2 | 1 (-50%) | 2 |
| Core Frequency | 800 MHz | 800 MHz | 800 MHz | 800 MHz | 800 MHz | 800 MHz |
| Operating Temperature | 0C to +125C | -40C to +125C (extended) | -40C to +125C (extended) | 0C to +125C | 0C to +125C | -40C to +125C (AEC-Q100) |
| Encryption Engine | Disabled (NE) | Enabled | Enabled | Enabled | Disabled (NE) | Disabled (NE) |
| DDR Memory Support | DDR2/DDR3 + ECC up to 667 MHz | DDR2/DDR3 + ECC up to 667 MHz | DDR2/DDR3 + ECC up to 667 MHz | DDR2/DDR3 + ECC up to 667 MHz | DDR2/DDR3 + ECC up to 667 MHz | DDR2/DDR3 + ECC up to 667 MHz |
| PCIe Lanes | 1 x4 + 2 x1 | 1 x4 + 2 x1 | 1 x4 + 2 x1 | 1 x4 + 2 x1 | 1 x4 + 2 x1 | 1 x4 + 2 x1 |
| Silicon Revision | 1.1 | 1.1 | 1.1 | 1.1 | 1.1 | 1.1 |
| Approx. Unit Price (USD, qty 1, 2026-10) | $78.50 | $82.00 | $80.00 | $79.00 | $58.00 | $95.00 |
Key Differentiators
- Hardware encryption engine availability by MPN variant (vs P1020NXE2HFB)
- Single-core vs dual-core cost / power optimization (vs P1011NXN2HFB)
- Automotive-grade qualification option (vs P1020NSN2HFB-Q1)
Design Notes
The P1020NSN2HFB dissipates approximately 4-5 W under typical dual-core operation with DDR3 active; in worst-case industrial use the Tj can approach 115C. Per the NXP QorIQ P1 hardware design guide, attach a low-profile aluminum heatsink (15x15x10 mm minimum) with thermal interface material to the TEPBGA II top-side thermal lid, and provide at least 8 thermal vias under the lid land pattern on the PCB. For fanless industrial enclosures, validate with a 25C ambient stress test before committing to production.
Per the NXP QorIQ P1 hardware design guide, the 689-TEPBGA II package requires a 1.0 mm pitch BGA footprint with microvia-in-pad PCB technology for the inner ball rows. Route DDR3 signals as point-to-point with impedance-controlled traces (50 ohm single-ended, 100 ohm differential) and length-match within 25 mils across byte lanes. Place the DDR3 reference design decoupling (100 nF + 10 uF per rail) within 100 mils of the BGA balls. PCIe SerDes require AC-coupling capacitors within 1 inch of the SoC balls.
Three common pitfalls in P1020NSN2HFB designs: (1) failing to honor the 689-ball BGA keepout under the thermal lid (no traces, no vias) - this kills thermal performance; (2) using non-ECC DDR3 when the application requires bit-error detection, leading to silent data corruption in long-running routers; (3) ignoring the platform/core/DDR clock ratio (1:2:1.667 typical for 800/400/667) which can cause RCW (Reset Configuration Word) misprogramming and silent boot failures. Always verify the RCW against the silicon revision 1.1 reference manual before programming fuses.
Per NXP application note AN3944, separate analog and digital ground planes with a single-point bridge under the SoC to avoid ground loops. Route USB 2.0 differential pair at 90 ohm differential impedance with no more than 2 vias and keep total length under 50 mm to maintain signal-integrity compliance. Place the 24 MHz system reference crystal within 5 mm of the RTC_XTAL pins with a guard ring, and provide 12 pF load caps to ground.
Compliance Information
RoHS and REACH compliant per NXP product page and ETEI cross-reference listing. Standard P1020NSN2HFB is NOT AEC-Q100 qualified; choose P1020NSN2HFB-Q1 variant for automotive. Halogen-free laminate per NXP Pb-free package declaration.
