P5020NSE7MMB557 - QorIQ P5 Dual-Core 1.2GHz SoC | NXP
Teilenummer: P5020NSE7MMB557 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $268.5 | $2.685,00 |
| 100 | $248 | $24.800,00 |
| 500 | $229.5 | $114.750,00 |
| 1.000 | $215 | $215.000,00 |
P5020NSE7MMB557 Übersicht
A microprocessor (MPU) is an integrated circuit that contains one or more processor cores, caches, memory controllers, and peripheral interfaces on a single die. The QorIQ family sits in NXP's high-performance embedded MPU portfolio, positioning the P5020 as a 64-bit multi-core solution for applications that demand more processing headroom than microcontrollers (MCUs) offer, but with tighter power and integration than discrete server CPUs. The P5 tier specifically targets intelligent networking, industrial control, and defense/aerospace workloads.
Key features include a 64-bit e5500 dual-core CPU at up to 2.0 GHz (this SKU ships at 1.2 GHz), an integrated DDR3 memory controller with ECC, hardware acceleration engines for pattern matching and cryptography, and a security engine (SEC). The device also integrates PCI Express Gen 2, Serial RapidIO (SRIO), Gigabit Ethernet MACs, and a high-speed SerDes fabric, enabling single-chip line-card and compute appliance designs.
Architecturally, the P5020 uses an SoC-licensed Power Architecture implementation with per-core L1 caches and a shared L2 cache. The hardware acceleration blocks offload cryptography and deep packet inspection from the cores, allowing sustained throughput for control-plane and data-plane workloads. Industrial temperature grade 0 to 105 C is supported for harsh-environment deployments.
Typical applications include industrial routers and switches, network-attached storage controllers, defense/aerospace embedded computing, factory automation controllers, and single-board compute modules. The integrated peripherals reduce external component count for compact fanless designs.
When designing with this part, allocate sufficient PCB layers (typically 8-10) for the FCPBGA breakout and provide robust power decoupling. Validate thermal envelopes with the manufacturer's reference design, and confirm software support through NXP's Linux BSP and CodeWarrior toolchain. The non-automotive temperature range limits deployment in under-hood automotive use.
This page synthesizes distributor pricing, datasheet specifications, drop-in QorIQ alternatives, and practical design notes not consolidated in any single manufacturer document.
Drop-in-Alternativen für P5020NSE7MMB557 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit P5020NSE7MMB557 (gleiche Bauform und Footprint) – abweichend in Core Architecture, Hardware Acceleration, Operating Temperature, Package.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
P5020NSE7MMB
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
P5010NSE7MMB
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$218 / Stück
Datenblatt ansehen →P5020NSE7VMM
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
P5020NSN7MMB
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
P5040NSE7MMB
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
P5020NSE7MMB557 Grenzwerte & elektrische Eigenschaften
| Manufacturer | NXP Semiconductors |
| Series | QorIQ P5 |
| Core Architecture | Power Architecture e5500, 64-bit |
| Number of Cores | 2 |
| Core Frequency | 1.2 GHz |
| Memory Controller | DDR3 with ECC |
| Hardware Acceleration | Yes (pattern matching, security offload) |
| Security Engine | SEC (cryptographic accelerator) |
| PCI Express | PCIe Gen 2 |
| Serial RapidIO | Yes (SRIO) |
| Gigabit Ethernet | Integrated GbE MACs |
| Gehäuse | 1295-FCPBGA (37.5 x 37.5 mm) |
| Betriebstemperatur | 0 C to 105 C |
| Montageart | Surface Mount (BGA) |
P5020NSE7MMB557 1295-fcpbga (37.5 x 37.5 mm) Pinbelegungsleitfaden
Pinbelegung für P5020NSE7MMB557 (1295-fcpbga (37.5 x 37.5 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für P5020NSE7MMB557.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
P5020NSE7MMB557 ist geeignet für 6 Anwendungs: Industrial Router / Gateway, Network-Attached Storage (NAS) Controller, Defense / Aerospace Embedded Compute, Single-Board Computer (SBC) / COM Module, Factory Automation Controller, Wireless Base Station Baseband.
Industrial Router / Gateway
The P5020NSE7MMB557 is well-suited for industrial router and secure gateway designs. Its dual 64-bit e5500 cores at 1.2 GHz deliver sufficient throughput for control-plane routing protocols (OSPF, BGP), while the integrated SEC engine accelerates IPsec/TLS at multi-gigabit line rates. Multiple integrated GbE MACs allow direct PHY connection without an external switch ASIC, reducing board area and BOM. Hardware pattern matching offloads ACL/flow classification from the cores, and the 0-105 C junction range supports outdoor enclosure deployment in factory or substation installations.
Empfohlen
Network-Attached Storage (NAS) Controller
The P5020NSE7MMB557 can serve as the main storage controller in mid-range NAS appliances. The 64-bit e5500 cores handle file-system metadata and RAID parity calculations efficiently, while the integrated DDR3 controller with ECC protects data integrity critical to storage workloads. PCIe Gen 2 lanes host SAS/SATA controller chips or NVMe bridges, and the GbE MACs enable multi-port 1G aggregation or a single 10G uplink via XAUI. SEC acceleration speeds SMB/Kerberos authentication on every I/O request.
Empfohlen
Defense / Aerospace Embedded Compute
Within the 0 to 105 C temperature envelope, the P5020NSE7MMB557 fits mission-compute modules for defense and aerospace platforms that demand deterministic 64-bit processing without the moving parts of a server CPU. The Power Architecture e5500 cores support rad-hard firmware flows and legacy avionics software ports, while the integrated peripherals remove the need for companion FPGAs on simple boards. Hardware SEC accelerates classified-communication ciphers, and Serial RapidIO provides deterministic backplane interconnect to neighboring compute or sensor modules.
Empfohlen
Single-Board Computer (SBC) / COM Module
The P5020NSE7MMB557 powers high-performance COM (Computer-on-Module) and SBC designs that target industrial vision, machine learning inference, and edge analytics. The 1.2 GHz dual-core performance, integrated GbE, PCIe, and DDR3 controller enable a compact SoM with minimal external logic. Hardware acceleration and SEC make the platform suitable for AI-at-the-edge inferencing with encrypted model updates. The FCPBGA 37.5 x 37.5 mm package is large enough to dominate a small SoM but small enough for 4-layer carrier PCBs at modest densities.
Empfohlen
Factory Automation Controller
For PLC and CNC controllers, the P5020NSE7MMB557 combines the determinism of Power Architecture with industrial-grade I/O integration. The dual cores can run a real-time motion-control task on one core and a Linux HMI on the other, isolated by hardware virtualization. PCIe supports connection to high-speed motion cards and EtherCAT bridges, while GbE MACs drive PROFINET or EtherNet/IP uplinks. The 0 to 105 C range survives cabinet temperatures near servo amplifiers without active cooling in moderate-density layouts.
Empfohlen
Wireless Base Station Baseband
The P5020NSE7MMB557's combination of SRIO, PCIe, GbE, and SEC makes it a candidate for small-cell LTE/5G baseband processing. The dual e5500 cores execute PHY layer DSP, MAC scheduling, and backhaul encryption in parallel. SRIO connects to the radio front-end (a CPRI or OBSAI bridge), PCIe hosts a baseband accelerator card, and GbE terminates the S1 backhaul. Hardware crypto acceleration protects control-plane signalling at line rate without CPU bottlenecks.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für P5020NSE7MMB557 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | P5020NSE7MMB | P5010NSE7MMB | P5020NSE7VMM | P5020NSN7MMB | P5040NSE7MMB |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 1295-FCPBGA (37.5x37.5) | 1295-FCPBGA (37.5x37.5) - same | 1295-FCPBGA (37.5x37.5) - same | 1295-FCPBGA (37.5x37.5) - same | 1295-FCPBGA (37.5x37.5) - same | 1295-FCPBGA (37.5x37.5) - same |
| Core Frequency | 1.2 GHz | 2.0 GHz | 2.0 GHz (single-core) | 1.2 GHz | 1.2 GHz | 1.8 GHz (quad-core) |
| Number of Cores | 2 (dual) | 2 (dual) | 1 (single) | 2 (dual) | 2 (dual) | 4 (quad) |
| Architecture | e5500 64-bit Power | e5500 64-bit Power | e5500 64-bit Power | e5500 64-bit Power | e5500 64-bit Power | e5500 64-bit Power |
| Memory Controller | DDR3 with ECC | DDR3 with ECC | DDR3 with ECC | DDR3 with ECC | DDR3 with ECC | DDR3 with ECC |
| Security Engine (SEC) | Yes | Yes | Yes | Yes | No | Yes |
| Operating Temperature | 0 C to 105 C | 0 C to 105 C | 0 C to 105 C | -40 C to 105 C (extended) | 0 C to 105 C | 0 C to 105 C |
| Param Match (%) | 100 | 90 | 80 | 95 | 80 | 80 |
Wichtigste Unterscheidungsmerkmale
- Lower core frequency reduces thermal envelope (vs. P5020NSE7MMB)
- SEC engine retained for full cryptographic offload (vs. P5020NSN7MMB)
- Dual-core at lower clock beats single-core at higher clock for parallel workloads (vs. P5010NSE7MMB)
Designhinweise
Estimated: at 1.2 GHz dual-core full load the P5020NSE7MMB557 dissipates roughly 12-18 W. The 37.5 x 37.5 mm FCPBGA exposes a large thermal pad that must be soldered to a multilayer copper spreader on the PCB top side. Use a minimum 1 oz copper plane over 4-6 layers under the BGA and add thermal vias (0.3 mm pitch, filled) to inner copper layers. Active airflow or a heatsink is typically required for sustained full-load operation; derate by 15-20% for sealed enclosures.
Route the 1295-ball FCPBGA on a stack-up of 8-10 layers with 0.4 mm-pitch microvia or laser-drilled vias. Maintain 50 ohm single-ended impedance for SERDES lanes (PCIe, SRIO, GbE) and 100 ohm differential for the same signals. Place decoupling capacitors as close to BGA balls as possible: bulk 22 uF polymer + 100 nF X7R per power pin cluster. Length-match the DDR3 interface within 50 mils across byte lanes.
Keep SERDES traces on the top two layers only, with reference ground planes unbroken beneath. Avoid routing SERDES over power-plane splits - this creates return-path discontinuities that fail PCIe Gen 2 compliance. For the DDR3 controller, isolate the address/command bus from the data bus on different routing layers to minimize crosstalk. Place the reference clock for GbE within 100 mils of the MAC pins.
Do not skip the SEC engine initialization in U-Boot if using secure boot - the ROM validates the next-stage image and a missing SEC init causes silent boot loops. Do not apply 1.2 GHz core frequency to a PCB designed for the 1.0 GHz P5020 SKU without re-validating power integrity. When migrating from the single-core P5010, note that the dual-core P5020 draws noticeably higher in-rush current; oversize the core regulator accordingly.
Compliance-Informationen
Compliance status not available in the verified web data; refer to NXP's product compliance declarations for confirmation. AEC-Q100 is not applicable - this is an industrial/embedded MPU, not an automotive grade MCU.
