P5020NXE7QMB557 - QorIQ P5 Dual-Core 2.0GHz SoC | NXP
Teilenummer: P5020NXE7QMB557 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $264.73 | $264,73 |
| 10 | $230.5 | $2.305,00 |
| 100 | $195.2 | $19.520,00 |
| 500 | $168.4 | $84.200,00 |
| 1.000 | $145.8 | $145.800,00 |
P5020NXE7QMB557 Übersicht
Background: A QorIQ communications processor is a high-performance multicore SoC designed by NXP (originally Freescale) for embedded networking and signal-processing workloads. The P5 tier sits within the broader QorIQ P-series hierarchy: P1 (single-core) -> P2 (dual-core) -> P3/P4/P5 (multi-core, hardware acceleration). At the top of the taxonomy these devices are microprocessors / MPUs / SOCs within the embedded semiconductor category. The P5020 specifically adds dedicated datapath acceleration and pattern-matching engines that offload packet processing from the CPU cores.
Key features include two 64-bit e5500 cores with hardware hypervisor and virtualization support, a 64-bit DDR3/3L controller with ECC, three PCI Express Gen 2 controllers (x4/x4/x4 or x8+x4+x4 configurations), five Gigabit Ethernet interfaces (4x SGMII + 1x RGMII), two Serial RapidIO 2.0 ports, a datapath acceleration architecture (DPAA) for queue management and cryptography, and SEC 5.0 security engine. The 1295-FCPBGA package provides ample signal integrity for multi-gigabit SerDes channels at the cost of larger PCB real estate.
Typical applications include multi-service routers, LTE/eNodeB baseband processing, network attached storage controllers, industrial PLC gateways, and military/aerospace secure communications. The dual-core 2.0 GHz configuration delivers roughly 6.4 GHz aggregate core throughput under optimized code, while hardware accelerators handle encryption and deep-packet inspection at line rate.
When designing with the P5020NXE7QMB557, pay particular attention to SerDes reference clock jitter (must meet IEEE 802.3 specifications), DDR3 fly-by topology for signal integrity, and thermal management at 2.0 GHz under industrial temperature conditions. The SoC consumes up to 20-25 W at full load and requires a multi-layer PCB with at least 8 layers for proper decoupling and routing.
Drop-in-Alternativen für P5020NXE7QMB557 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
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P5020NXE7QMB557 Grenzwerte & elektrische Eigenschaften
| Part Number | P5020NXE7QMB557 |
| Series | QorIQ P5 |
| Architecture | 64-bit Power Architecture e5500 |
| Number of Cores | 2 |
| Core Frequency (max) | 2.0 GHz |
| Memory Controller | DDR3 / DDR3L with ECC, 64-bit |
| PCI Express | 3x PCIe Gen 2 controllers |
| Ethernet Interfaces | 4x SGMII + 1x RGMII (Gigabit) |
| Serial RapidIO | 2x SRIO 2.0 ports |
| Security Engine | SEC 5.0 |
| Hardware Acceleration | DPAA (Datapath Acceleration Architecture) |
| Gehäuse | 1295-FCPBGA (37.5 x 37.5 mm) |
| Betriebstemperatur | -40C to +105C |
| Montageart | Surface Mount (BGA) |
| RoHS-Status | Compliant |
P5020NXE7QMB557 1295-fcpbga (37.5 x 37.5 mm) Pinbelegungsleitfaden
Pinbelegung für P5020NXE7QMB557 (1295-fcpbga (37.5 x 37.5 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für P5020NXE7QMB557.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
P5020NXE7QMB557 ist geeignet für 6 Anwendungs: Multi-Service Router / Edge Gateway, LTE/eNodeB Baseband Processing, Network Attached Storage Controller, Industrial PLC Gateway, Secure Military Communications, Software-Defined Radio / DSP Co-Processor.
Multi-Service Router / Edge Gateway
The P5020NXE7QMB557's dual 2.0 GHz e5500 cores combined with hardware DPAA acceleration make it ideal for multi-service edge routers and gateways handling routing, NAT, firewall, and VPN functions at gigabit line rate. The 5x Gigabit Ethernet interfaces (4x SGMII + 1x RGMII) provide flexible WAN/LAN connectivity while SEC 5.0 offloads IPsec/SSL encryption at full wire speed without CPU intervention. The -40C to +105C industrial temperature range supports deployment in outdoor cabinets and uncontrolled environments. Power consumption typically scales from 8-12W at light load to 20-25W at full utilization, requiring a well-designed thermal solution with 4-layer minimum PCB stack-up.
Empfohlen
LTE/eNodeB Baseband Processing
The P5020NXE7QMB557 is well-suited to small-cell and eNodeB baseband processing where dual 2.0 GHz cores execute Layer 1/Layer 2 PHY stack while DPAA handles HARQ, CRC, and encryption in hardware. SRIO interfaces provide backhaul connectivity to baseband cards while PCI Express Gen 2 supports RF front-end and FPGA co-processors. SEC 5.0 is critical for securing backhaul traffic. The hardware hypervisor enables running real-time DSP on dedicated cores alongside management-plane Linux. Industrial temperature rating and ECC memory support are essential for outdoor small-cell deployments.
Empfohlen
Network Attached Storage Controller
The P5020NXE7QMB557's DDR3 controller with ECC and 5x Gigabit Ethernet ports provide sufficient throughput for small-to-mid range NAS systems serving up to several hundred simultaneous users. The dual e5500 cores handle file system operations (ext4, ZFS, Btrfs) while DPAA accelerates RAID parity computation and TCP/IP offload. PCI Express supports SAS/SATA controller chips for high-capacity disk arrays. Hardware encryption enables AES-NI-equivalent throughput for encrypted volumes without CPU penalty. The BGA package requires careful thermal design as sustained I/O workloads push junction temperatures toward limits.
Empfohlen
Industrial PLC Gateway
The P5020NXE7QMB557 operates over -40C to +105C making it ideal for industrial PLC gateways bridging Modbus/Profibus/EtherCAT field networks to Ethernet/IP and cloud backhaul. The e5500 cores run deterministic real-time workloads (RTOS) alongside Linux management software via hardware hypervisor. SEC 5.0 secures OPC-UA communications critical for Industry 4.0 deployments. Five Gigabit Ethernet ports can serve as both fieldbus interfaces and uplinks. Wide operating temperature and ECC memory ensure reliability in factory environments with electrical noise and temperature extremes.
Empfohlen
Secure Military Communications
The P5020NXE7QMB557's hardware-accelerated SEC 5.0 engine performs classified-grade encryption (Suite B, AES-256, SHA-512) at line speed, making it well-suited to secure military and government communications systems. Dual e5500 cores separate red/black processing with hardware-enforced isolation. Wide operating temperature and ECC memory support deployment in tactical vehicles and field installations. The BGA package provides resistance to vibration and shock compared to leaded alternatives. NXP's long-life product program supports defense programs requiring 10+ year lifecycle commitments.
Empfohlen
Software-Defined Radio / DSP Co-Processor
The P5020NXE7QMB557 functions effectively as a co-processor in software-defined radio systems where dual 2.0 GHz cores handle waveform processing while Serial RapidIO links to DSP/FPGA signal processing engines. PCI Express provides additional connectivity to RF ADCs/DACs. DPAA offloads packet framing and timing-critical operations, allowing the CPU cores to focus on protocol stack execution. The industrial temperature grade supports outdoor SDR deployments in electronic warfare and signal intelligence applications. High-bandwidth DDR3 with ECC handles large sample buffers for wideband signal capture.
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Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für P5020NXE7QMB557 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | P5020NXE7QMB | P5040NXE7QMB | P5020NXN7QMB | P5020NSE7QMB | P5020NXE7TMB |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 1295-FCPBGA (37.5x37.5) | 1295-FCPBGA (37.5x37.5) - same | 1295-FCPBGA (37.5x37.5) - same | 1295-FCPBGA (37.5x37.5) - same | 1295-FCPBGA (37.5x37.5) - same | 1295-FCPBGA (37.5x37.5) - same |
| Number of Cores | 2 | 2 | 4 | 2 | 2 | 2 |
| Operating Temperature | -40C to +105C | -40C to +105C | -40C to +105C | 0C to +105C | -40C to +105C | -40C to +105C |
| Memory Controller | DDR3/DDR3L 64-bit ECC | DDR3/DDR3L 64-bit ECC | DDR3/DDR3L 64-bit ECC | DDR3/DDR3L 64-bit ECC | DDR3/DDR3L 64-bit ECC | DDR3/DDR3L 64-bit ECC |
| PCIe Controllers | 3x PCIe Gen 2 | 3x PCIe Gen 2 | 3x PCIe Gen 2 | 3x PCIe Gen 2 | 3x PCIe Gen 2 | 3x PCIe Gen 2 |
| Gigabit Ethernet | 4x SGMII + 1x RGMII | 4x SGMII + 1x RGMII | 4x SGMII + 1x RGMII | 4x SGMII + 1x RGMII | 4x SGMII + 1x RGMII | 4x SGMII + 1x RGMII |
Wichtigste Unterscheidungsmerkmale
- Dual-core 2.0 GHz with hardware datapath acceleration (vs. P5040NXE7QMB)
- Industrial -40C to +105C temperature grade (vs. P5020NXN7QMB)
- Integrated SEC 5.0 hardware encryption (vs. P5020NXE7QMB)
Designhinweise
The P5020NXE7QMB557 uses a 1295-ball FCPBGA at 37.5x37.5 mm. Design the PCB with at least 8 layers to provide power planes, ground planes, and signal routing for the high-speed SerDes (PCIe Gen 2, SGMII, SRIO). Use a 1.0 mm ball pitch escape with microvia-in-pad technology for the inner rows. DDR3 must use fly-by topology with proper termination; the address/command signals require Series Stub Termination. Maintain 100-ohm differential impedance for SerDes pairs. Reference NXP's hardware design guide (AN4321 family) for the recommended stack-up and routing rules.
Estimated: at full 2.0 GHz dual-core load with all interfaces active, the P5020NXE7QMB557 dissipates 20-25 W. The FCPBGA package has a junction-to-ambient thermal resistance that requires a heatsink or substantial copper thermal relief to maintain junction temperature below 100C at 105C ambient. Use a heat spreader or top-side heatsink with thermal interface material rated for the application. Forced-air cooling is recommended for enclosed chassis. Validate thermal performance with actual workload characterization, as junction temperature varies significantly between compute-bound and I/O-bound workloads.
The P5020NXE7QMB557 requires multiple voltage rails (core, I/O, DDR3, SerDes, PLL) with strict sequencing and ramp requirements. Use a multi-phase buck controller capable of 30A+ on the core rail with 1% accuracy. Decoupling requires 0.1uF and 10uF capacitors placed within 100 mils of each ball pair. The SERDES rails demand low-noise LDOs. Power sequencing must follow the sequence specified in the datasheet to prevent latch-up. Implement voltage monitoring with reset generation if any rail falls out of specification. Reference NXP's reference designs for validated power circuits.
Compliance-Informationen
RoHS compliant per NXP product documentation. Not AEC-Q100 qualified - the P5020 is targeted at industrial networking, not automotive. Lead-free reflow profile per JEDEC J-STD-020.
