P5020NXE7TNB - QorIQ P5020 Dual-Core 2GHz SoC MPU | NXP
Teilenummer: P5020NXE7TNB ⚠ Letzte Bestellmöglichkeit| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $550.59 | $550,59 |
| 10 | $522.5 | $5.225,00 |
| 100 | $489.75 | $48.975,00 |
| 500 | $465 | $232.500,00 |
| 1.000 | $442.25 | $442.250,00 |
P5020NXE7TNB Übersicht
A microprocessor (MPU) is the central processing unit of an embedded system, executing operating-system and application code while integrating memory controllers, I/O peripherals and on-chip accelerators. QorIQ P5020 belongs to NXP's P5 communications-processor family, hypernymically classified as: e5500 core -> Power Architecture 64-bit MPU -> QorIQ P5 SoC -> communications processor -> embedded microprocessor -> semiconductor. The e5500 superscalar out-of-order core complex makes the part a dual-core CPU plus I/O subsystem in a single package, replacing traditional CPU-plus-chipset designs.
Key features of the P5020NXE7TNB include dual e5500 cores at up to 2.0 GHz, an integrated DDR3/3L memory controller with ECC, three PCI Express 2.0 controllers, multiple Gigabit Ethernet interfaces (up to 10 GbE aggregate via XAUI), two Serial RapidIO ports, on-chip hardware acceleration for pattern matching, queue management and cryptography, plus the SEC 4.0 security engine. The operating temperature range spans -40C to +105C (industrial/extended grade), enabling deployment in thermally constrained networking and industrial environments.
Architecturally, the device combines two e5500 cores with a coherent fabric, L2 cache, CoreNet coherency, and a high-bandwidth I/O subsystem. This configuration balances raw single-thread performance (key for control-plane workloads such as routing-table lookups) with parallel throughput for data-plane acceleration.
Typical applications include enterprise routers and switches, network-attached storage controllers, industrial control and factory automation gateways, military/aerospace networking subsystems, multi-function printers and embedded telecom equipment. Designers choose the P5020 because it consolidates CPU, memory controller, packet acceleration and security into one BGA package, simplifying board layout and BOM.
A key design consideration is that the P5020NXE7TNB is housed in a 1295-ball FCBGA; PCB layout requires high-density escape routing, controlled-impedance DDR3 traces, and a 6+ layer stack-up with a continuous ground plane. Thermal design must keep junction temperature below 105C at full load; a heatsink or top-side airflow is recommended.
This page synthesizes distributor pricing from authorized channels, drop-in alternatives from the NXP product family, and practical design notes that go beyond what appears in the manufacturer datasheet.
Drop-in-Alternativen für P5020NXE7TNB – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit P5020NXE7TNB (gleiche Bauform und Footprint) – abweichend in Hardware Acceleration, Package, Core Architecture, Number of Cores, Mounting Type.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
P5010NXE7TNB
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
P5020NSE7TNB
✅ Drop-In✓ Auf Lager
$199.5 / Stück
Datenblatt ansehen →P5020NXE7VNB
✅ Drop-In✓ Auf Lager
$361.12 / Stück
Datenblatt ansehen →P5040NXE7TNB
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
P2041NXE7NNC
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
P5020NXE7TNB Grenzwerte & elektrische Eigenschaften
| Core Architecture | Power Architecture e5500, 64-bit |
| Number of Cores | 2 |
| Maximum Core Frequency | 2.0 GHz |
| Memory Controller | DDR3 / DDR3L with ECC |
| PCI Express | PCIe 2.0 controllers (x4/x2/x1) |
| Gigabit Ethernet | Multiple GbE interfaces; up to 10 GbE via XAUI |
| Serial RapidIO | Yes (SRIO) |
| Hardware Acceleration | Pattern matching, queue management, cryptography |
| Security Engine | SEC 4.0 |
| Betriebstemperaturbereich | -40C to +105C |
| Gehäuse | 1295-ball FCBGA (FC-PBGA 37.5x37.5 mm) |
| Montageart | Surface Mount (BGA) |
P5020NXE7TNB 1295-ball fcbga (fc-pbga 37.5x37.5 mm) Pinbelegungsleitfaden
Pinbelegung für P5020NXE7TNB (1295-ball fcbga (fc-pbga 37.5x37.5 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für P5020NXE7TNB.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
P5020NXE7TNB ist geeignet für 6 Anwendungs: Enterprise Routers and Switches, Network-Attached Storage Controllers, Industrial Control and Factory Gateways, Telecom and Network Appliances, Military and Aerospace Networking, Multi-Function Printers and Imaging Servers.
Enterprise Routers and Switches
The NXP P5020NXE7TNB is well-suited to enterprise routing and switching control planes because its dual e5500 cores at 2.0 GHz deliver high single-thread performance for routing-table lookups, ACL processing and management-plane software such as Linux or VxWorks. The integrated hardware acceleration offloads pattern matching and queue management, freeing CPU cycles for control tasks. DDR3 with ECC protects the routing database against bit flips; 10 GbE aggregate via XAUI uplinks connect to switch fabrics. The 1295-ball FCBGA integrates CPU plus peripherals, reducing board area versus a CPU-plus-chipset design.
Empfohlen
Network-Attached Storage Controllers
The P5020NXE7TNB's dual cores, hardware cryptography (SEC 4.0) and RapidIO interconnect make it a strong fit for NAS controllers. Each core can run RAID engine and file-system tasks in parallel; SEC 4.0 accelerates AES, 3DES and RSA used in encryption-at-rest; SRIO links to companion FPGAs for hardware offload. DDR3 with ECC protects against data corruption, and the -40C to +105C temperature range supports industrial NAS and surveillance storage deployments. Compared to a discrete CPU-plus-storage-controller solution, the P5020 reduces BOM and PCB complexity.
Empfohlen
Industrial Control and Factory Gateways
Industrial gateways and PLC peripherals use the P5020NXE7TNB for its deterministic single-thread performance, multiple GbE interfaces and RapidIO ports that connect to deterministic fieldbus or motion-control networks. The extended -40C to +105C temperature range supports cabinet and factory-floor deployment without special cooling. Hardware encryption secures protocols like OPC-UA and Modbus-TCP. Dual cores allow partitioning between real-time control and HMI/web-server workloads on the same chip, simplifying gateway designs.
Empfohlen
Telecom and Network Appliances
The P5020NXE7TNB fits telecom appliance designs - firewall, IPS/IDS, WAN optimization and LTE/EPC - because the SEC 4.0 engine accelerates IPsec and SSL/TLS, while the pattern-matching accelerator speeds deep-packet inspection. PCIe 2.0 links to crypto-accelerator cards or NPUs; XAUI provides 10 GbE uplink. Dual cores support virtualization (hypervisor + guest VMs) for multi-tenant appliances. The 1295-ball FCBGA and high efficiency reduce board area and power, both critical for 1U rack appliances.
Empfohlen
Military and Aerospace Networking
Defense and aerospace network subsystems leverage the P5020NXE7TNB's deterministic Power Architecture cores, hardware crypto, and extended -40C to +105C temperature range for harsh-environment switching and routing. The QorIQ P5020 platform has a long lifecycle and is widely supported in mission-critical DO-178 / MIL-STD-810 program designs. SEC 4.0 is FIPS-140 compliant with proper firmware, supporting red/black separation and Type-1 cryptography when certified. SRIO and GbE provide deterministic fabric and avionics databus connectivity.
Empfohlen
Multi-Function Printers and Imaging Servers
Multi-function printers, production printers and image-processing servers benefit from the P5020NXE7TNB's dual-core throughput for image pipelines (JPEG2000, PDF rasterization) and its GbE/PCIe interfaces for scanner engines and ASIC coprocessors. DDR3 with ECC avoids print-job data corruption during long queue builds, and the SEC engine accelerates encrypted-job workflows. The integrated peripherals replace discrete image-controller ASICs in mid-high-volume printers, reducing board cost and firmware complexity.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für P5020NXE7TNB – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | P5010NXE7TNB | P5020NSE7TNB | P5020NXE7VNB | P5040NXE7TNB | P2041NXE7NNC |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 1295-ball FCBGA (37.5x37.5 mm) | 1295-ball FCBGA - same | 1295-ball FCBGA - same | 1295-ball FCBGA - same | 1295-ball FCBGA (same family) | BGA (QorIQ P-series, same platform) |
| Core Count | 2 | 1 (-50%) | 2 (same) | 2 (same) | 4 (+100%) | 4 (e500mc, +100%) |
| Max Core Frequency | 2.0 GHz | 2.0 GHz (same) | 2.0 GHz (same) | 2.0 GHz (same) | 2.4 GHz (+20%) | 1.5 GHz (-25%) |
| Core Architecture | e5500 (Power Architecture, 64-bit) | e5500 (same) | e5500 (same) | e5500 (same) | e5500 (same) | e500mc (different - lower per-core perf) |
| Operating Temperature | -40C to +105C | -40C to +105C (same) | 0C to +105C (commercial) | -40C to +105C (same) | -40C to +105C (same) | -40C to +105C (same) |
| Memory Controller | DDR3 / DDR3L with ECC | DDR3 / DDR3L with ECC (same) | DDR3 / DDR3L with ECC (same) | DDR3 / DDR3L with ECC (same) | DDR3 / DDR3L with ECC (same) | DDR3 / DDR3L with ECC (same) |
| Integrated Peripherals | PCIe, GbE, SRIO, SEC, HW Accel | PCIe, GbE, SRIO, SEC, HW Accel (same) | PCIe, GbE, SRIO, SEC, HW Accel (same) | PCIe, GbE, SRIO, SEC, HW Accel (same) | PCIe, GbE, SRIO, SEC, HW Accel (same) | PCIe, GbE, SRIO, SEC, HW Accel (same) |
| Unit Price (qty 1, USD, as of 2026-10-17) | 550.59 | lower (P5010 family) | similar (same die) | similar (same die) | higher (more cores) | lower (lower-tier e500mc) |
Wichtigste Unterscheidungsmerkmale
- Dual-core e5500 at 2.0 GHz with hardware acceleration (vs. P5010NXE7TNB)
- Extended -40C to +105C temperature range (vs. P5020NSE7TNB)
- Higher per-core frequency than P2041 (vs. P2041NXE7NNC)
Designhinweise
The P5020NXE7TNB at full 2.0 GHz dual-core load draws significant power in a 37.5x37.5 mm FCBGA; the package's thermal resistance (theta JA) from the datasheet must be used to compute junction temperature rise. Estimated: with theta JA around 11-15 C/W (typical for large FCBGA with thermal lid, datasheet value needed) and 15 W dissipation, junction-temperature rise is roughly 165-225 C above ambient - clearly above the 105C max. A heatsink with thermal interface material and forced airflow is mandatory; conformal-coated chassis with conduction cooling may also be needed for ruggedized designs.
PCB layout for a 1295-ball FCBGA at 1.0 mm pitch requires HDI microvia stack-ups (typically 8-12 layers), 50-ohm controlled-impedance traces for PCIe and SRIO SerDes, and 100-ohm differential pairs for DDR3. Use the manufacturer's reference designators from the NXP QorIQ P5020 design kit; place 0.1 uF + bulk decoupling capacitors within 50 mils of every power pin. Use length-matched DDR3 address/command/control traces within +/- 25 mil; data lanes matched within +/- 10 mil. Continuous ground plane under the BGA and signal layers is mandatory for return-current continuity.
Common pitfalls: (1) ignoring boot-mode strapping pins - configure RCW source (I2C EEPROM, flash, hard-coded) before POR. (2) Failing to validate SerDes reference clock jitter - PCIe and SRIO require clean 100/125 MHz clocks with sub-ps RMS jitter. (3) Omitting DDR3 write-levelling calibration and read-DQ calibration in the SPD/RCW. (4) Insufficient bulk decoupling on the core rail during load transients; the e5500 cores cause di/dt events during frequency scaling. (5) Neglecting thermal relief - the package lid needs an exact-footprint heatsink with thermal paste. (6) Assuming pinout compatibility with non-NXP P-series parts - the P5020 ball map is similar to P5040/P5010 but NOT to P2041/e500mc. (7) Forgetting last-time-buy PCN - place final orders with NXP before the last-order date to receive PCN-notified inventory.
Power-rail sequencing for the P5020NXE7TNB follows QorIQ P5 requirements: core voltage (typically 1.0-1.1 V) must ramp before peripheral supply; some SerDes rails tolerate simultaneous ramp. Use a multi-rail PMIC (e.g. NXP PF0100/PF3000) for tight sequencing. DDR3 termination voltage VTT must track the DRAM rail. Estimated: at full dual-core load, the device draws 12-18 W; budget the VRM for at least 1.5x the steady-state current to avoid droop during burst workloads. Place input bulk caps within 1 inch of the BGA.
Compliance-Informationen
QorIQ P5020 family is generally RoHS/REACH compliant when ordered with the standard NXP ordering suffix; specific MPN environmental data should be confirmed from the NXP product page. AEC-Q100 not applicable (industrial/networking MPU). Conflict-minerals status inherited from NXP corporate compliance disclosures.
