P5020NXN1TNB - QorIQ P5 Dual-Core 2.0GHz e5500 SoC | NXP
Teilenummer: P5020NXN1TNB ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $521.05 | $521,05 |
| 10 | $489.79 | $4.897,90 |
| 100 | $458.92 | $45.892,00 |
| 500 | $421.78 | $210.890,00 |
| 1.000 | $389.4 | $389.400,00 |
P5020NXN1TNB Übersicht
A QorIQ communications processor is a multicore 64-bit system-on-chip (SoC) designed for embedded networking, industrial control, and storage applications. Within the broader taxonomy, the P5020 belongs to the QorIQ P5 family, which sits under the Power Architecture SoC lineage, which itself falls under microprocessors (MPU) and integrated circuits. The e5500 core inside the P5020 implements the Power Architecture Book E instruction set with 64-bit addressing and supports hardware virtualization, making the chip suitable for software-defined networking, control-plane aggregation, and intelligent edge devices.
Key features include dual e5500 cores at up to 2.0 GHz, dual DDR3/DDR3L controllers with ECC supporting up to 64-bit data width, four 10 Gigabit Ethernet options via XAUI/SerDes lanes, eight lanes of PCI Express Gen 2.0, three Serial RapidIO interfaces, integrated security accelerator (disabled in the NXN1 part-number suffix), and a Data Path Acceleration Architecture (DPAA) for hardware-accelerated packet handling. The 1295-FCPBGA package exposes extensive SerDes and address/data pins while delivering a thermal envelope appropriate for industrial-temperature environments.
The P5020NXN1TNB leverages a 45 nm process and an SoC architecture that combines high-performance SMP cores with on-chip networking and acceleration hardware. The DPAA engine offloads queue management, scheduling, and buffer allocation, freeing the cores for control-plane tasks. The SerDes complex supports multi-protocol configuration through protocol-aware lanes, simplifying board layout when designers must choose between Ethernet, PCIe, and SRIO topologies at different points on the same platform.
Typical applications include industrial routers and gateways, factory-floor control processors, LTE/WiMAX base-station control cards, military and aerospace networking, secure embedded appliances, and high-end printer controllers. The wide industrial temperature range and robust I/O make the P5020NXN1TNB a strong fit for harsh-environment deployments where general-purpose CPUs lack integrated networking.
When designing with this part, plan thermal management around the 1295-BGA package from the start: the BGA requires a substrate with controlled-impedance routing, buried vias, and a heatsink for continuous 2.0 GHz dual-core operation. Boot sequencing relies on the PORESET, HRESET, and RESET pins driven by the platform CPLD, and the DDR3 controller requires calibrated fly-by topology to meet timing at 1333 MT/s.
Drop-in-Alternativen für P5020NXN1TNB – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit P5020NXN1TNB (gleiche Bauform und Footprint) – abweichend in Package, Mounting Type, Core Architecture, PCI Express, Security Engine.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
P5020NXN7TNB
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
P5020NXE1TNB
✅ Drop-In✓ Auf Lager
$285 / Stück
Datenblatt ansehen →P5020NXE7TNB
✅ Drop-In✓ Auf Lager
$442.25 / Stück
Datenblatt ansehen →P5010NXN1TNB
✅ Drop-In✓ Auf Lager
$296.54 / Stück
Datenblatt ansehen →P5020NSN1TNB
✅ Drop-In✓ Auf Lager
$215 / Stück
Datenblatt ansehen →P5020NXN1TNB Grenzwerte & elektrische Eigenschaften
| Family | QorIQ P5 |
| Core Architecture | Power Architecture e5500 (Book E, 64-bit) |
| Number of Cores | 2 |
| Maximum Core Frequency | 2.0 GHz |
| Memory Controller | DDR3 / DDR3L with ECC |
| Memory Data Width | 64-bit (per controller) |
| PCI Express | PCIe Gen 2.0, up to 8 lanes |
| Serial RapidIO | 3 ports, Gen 1.3 / Gen 2.x |
| Gigabit Ethernet | Multiple SGMII / RGMII interfaces |
| Hardware Acceleration | Data Path Acceleration Architecture (DPAA) |
| Security Engine | Disabled (NXN1 part-number suffix) |
| Betriebstemperaturbereich | -40C to +105C (extended) |
| Gehäuse | 1295-FCPBGA (37.5 x 37.5 mm) |
| Montageart | Surface Mount (BGA) |
| RoHS-Status | Compliant |
| Encryption | No |
P5020NXN1TNB 1295-fcpbga (37.5 x 37.5 mm) Pinbelegungsleitfaden
Pinbelegung für P5020NXN1TNB (1295-fcpbga (37.5 x 37.5 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für P5020NXN1TNB.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
P5020NXN1TNB ist geeignet für 6 Anwendungs: Industrial Routers and Gateways, LTE and WiMAX Base Station Control Cards, Factory Floor Control Processors, Military and Aerospace Networking, Secure Embedded Appliances, High-End Printer and Imaging Controllers.
Industrial Routers and Gateways
The P5020NXN1TNB fits industrial routers and gateways because its dual 2.0 GHz e5500 cores plus Data Path Acceleration Architecture (DPAA) deliver the throughput required for control-plane aggregation across VLANs and IPsec tunnels. The chip's multiple Gigabit Ethernet interfaces (SGMII/RGMII) and PCIe Gen 2.0 lanes provide flexible WAN/LAN connectivity options. The industrial extended temperature range (-40C to +105C) ensures operation in factory cabinets and roadside enclosures without active cooling. The DPAA offloads queue and buffer allocation so the SMP cores stay free for routing protocols such as OSPFv3, BGP, and MPLS.
Empfohlen
LTE and WiMAX Base Station Control Cards
The P5020NXN1TNB suits LTE and WiMAX base-station control cards because its dual e5500 cores at 2.0 GHz execute Layer 2/3 protocols and the DPAA engine accelerates GTP-U and PDCP packet flows. The Serial RapidIO (SRIO) ports provide deterministic low-latency links to baseband DSP and FPGA companion chips on the same baseband card. PCIe Gen 2.0 lanes connect to timing and synchronization ASICs. The industrial temperature rating and 45 nm SoC integration reduce board area and BOM cost compared to discrete CPU plus network-processor designs.
Empfohlen
Factory Floor Control Processors
The P5020NXN1TNB is appropriate for factory-floor control because its extended-temperature SoC tolerates cabinet temperatures, while the dual 64-bit cores run real-time control software (VxWorks, Linux with PREEMPT_RT) alongside industrial Ethernet stacks such as EtherCAT, PROFINET, and TSN. The integrated DDR3 controllers with ECC provide deterministic memory behavior for safety-critical control loops. Multiple SGMII/RGMII ports attach to industrial Ethernet PHYs, while GPIO and SerDes handle legacy fieldbus interfaces.
Empfohlen
Military and Aerospace Networking
The P5020NXN1TNB is suitable for ruggedized military and aerospace networking because the industrial extended temperature rating and BGA construction suit conduction-cooled chassis. The dual e5500 cores run secure Linux or VxWorks MILS profiles, while the DPAA accelerates tactical-radio gateway routing. SRIO links connect to FPGA-based crypto and signal-processing modules, and PCIe lanes attach to secure-storage controllers. Software compatibility with the QorIQ SDK enables reuse of networking stacks across platforms.
Empfohlen
Secure Embedded Appliances
The P5020NXN1TNB (encryption-disabled variant) works in secure embedded appliances where the system designer prefers host-software crypto or external TPM/HSM. The two e5500 cores run application and management planes simultaneously, while DPAA accelerates packet flows at line rate on the multiple Gigabit Ethernet ports. PCIe and SRIO expose expansion slots for crypto accelerators, secure storage, or RF front-ends. The 1295-FCPBGA package and SoC integration keep BOM and board area low.
Empfohlen
High-End Printer and Imaging Controllers
The P5020NXN1TNB fits high-end production-printer controllers because the dual 2.0 GHz e5500 cores drive the print pipeline (RIP, halftoning, image processing) in real time. The PCIe Gen 2.0 lanes attach to high-speed scanner and finisher ASICs, while multiple Gigabit Ethernet ports handle concurrent print-job ingest and admin access. DDR3 bandwidth supports large image-buffer manipulation. Industrial temperature operation tolerates the warm interior of large printer enclosures.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für P5020NXN1TNB – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | P5020NXN7TNB | P5020NXE1TNB | P5020NXE7TNB | P5010NXN1TNB |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 1295-FCPBGA (37.5x37.5) | 1295-FCPBGA (37.5x37.5) | 1295-FCPBGA (37.5x37.5) | 1295-FCPBGA (37.5x37.5) | 1295-FCPBGA (37.5x37.5) |
| Number of Cores | 2 | 2 | 2 | 2 | 1 |
| Maximum Core Frequency | 2.0 GHz | 1.8 GHz | 2.0 GHz | 1.8 GHz | 2.0 GHz |
| Memory Controller | DDR3/DDR3L with ECC | DDR3/DDR3L with ECC | DDR3/DDR3L with ECC | DDR3/DDR3L with ECC | DDR3/DDR3L with ECC |
| Encryption Engine | Disabled | Disabled | Enabled | Enabled | Disabled |
| PCIe Lanes | Up to 8 (Gen 2.0) | Up to 8 (Gen 2.0) | Up to 8 (Gen 2.0) | Up to 8 (Gen 2.0) | Up to 8 (Gen 2.0) |
| Operating Temperature Range | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C |
| Lifecycle Status | Active (NXP QorIQ P5) | Active | Active | Active | Active |
Wichtigste Unterscheidungsmerkmale
- Encryption engine disabled for cost-optimized designs (vs. P5020NXE1TNB)
- Higher speed grade than P5020NXN7TNB (vs. P5020NXN7TNB)
- Dual-core design provides headroom over P5010 single-core (vs. P5010NXN1TNB)
Designhinweise
The 1295-FCPBGA package dissipates significant heat at 2.0 GHz dual-core load. Designers must attach a heatsink with thermal interface material and ensure the PCB has adequate copper pours and thermal vias beneath the BGA. Use the NXP thermal model from the hardware specification to compute junction temperature and size the heatsink for the worst-case industrial -40C to +105C ambient. Estimated: at 2.0 GHz dual-core, plan for a sustained 8-12 W TDP thermal budget; heatsink selection must account for sealed-cabinet convection limits in industrial deployments.
The 1295-FCPBGA requires a high-layer-count PCB (typically 12+ layers) with via-in-pad or microvia construction for the fine-pitch BGA balls. SerDes lanes must use controlled-impedance routing with reference planes and matched lengths per the NXP SerDes reference design. DDR3 fly-by topology with calibrated termination is mandatory to meet 1333 MT/s timing across industrial temperature. Keep high-speed digital return paths continuous and avoid splits in the ground plane beneath the BGA.
Common pitfalls include: (1) forgetting the on-chip encryption is disabled in the NXN1 suffix and selecting it for IPsec applications that need SEC offload - choose NXE1 instead; (2) missing the platform CPLD for PORESET/HRESET sequencing per the QorIQ boot guidelines; (3) using commercial-temperature DDR3 instead of industrial-grade for -40C operation; (4) not validating SerDes lane configuration (PCIe vs SRIO vs Ethernet) before PCB fab - protocol assignments must be set in the RCW at boot time. Always validate the design against the latest NXP hardware specification errata document.
Compliance-Informationen
RoHS compliance confirmed in the verified web data via NXP product listings. REACH, halogen-free, and conflict-minerals status were not confirmed in the verified data and are marked unknown.
