PIC16F15245-I/REB - 8-Bit MCU, 14KB Flash, 20-VQFN | Microchip
Teilenummer: PIC16F15245-I/REB ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $0.85 | $0,85 |
| 10 | $0.81 | $8,10 |
| 100 | $0.72 | $72,00 |
| 500 | $0.65 | $325,00 |
| 1.000 | $0.58 | $580,00 |
| 3.000 | $0.52 | $1.560,00 |
PIC16F15245-I/REB Übersicht
A microcontroller (MCU) is a single-chip computer containing a CPU, program memory (Flash/ROM), data memory (RAM), and integrated peripherals such as timers, ADC, communication interfaces, and I/O pins. Within the broader taxonomy, an 8-bit MCU sits between fixed-function logic ICs and 32-bit application processors, occupying the cost-sensitive sweet spot for embedded designs. The PIC16F15245 belongs to the PIC16F mid-range MCU family, sitting between the PIC10/12/14 baseline families and the PIC18/dsPIC enhanced families. Microcontrollers enable Core Independent Peripherals (CIPs) that operate without CPU intervention, freeing the core for application logic.
Key differentiating features include Core Independent Peripherals (CIPs), Intelligent Analog with a 10-bit ADC, two PWM modules, two CCP (Capture/Compare/PWM) channels, Peripheral Pin Select (PPS) for flexible pin mapping, and an EUSART plus MSSP supporting SPI and I2C communication. The XLP (eXtreme Low-Power) SLEEP mode enables battery-friendly operation down to nanoamp currents. The 20-VQFN (3x3) package achieves a footprint under 9 mm², ideal for space-constrained PCB layouts where SOIC-20 would be too large.
The architecture combines the 14-bit instruction word enhanced mid-range core with hardware multiplier, deterministic interrupt latency, and dual-operation Flash with self read/write capability for in-application firmware updates. Internal voltage reference support and a configurable oscillator block reduce external component count.
Typical applications include IoT sensor nodes, low-power battery-powered instrumentation, home appliance control, LED lighting controllers, automotive body electronics sub-modules, and industrial sensor interfaces. The combination of PPS, eXtreme Low-Power modes, and the small VQFN footprint makes the part especially well-suited for wearable and remote-sensor designs.
When designing with this device, allocate adequate Flash for bootloaders if OTA updates are planned - the 14KB Flash includes self-read/write but boot block size should be confirmed against the latest datasheet revision. PPS configuration must be locked before peripheral use; an unlocked PPS module returns peripherals to default pins.
This page synthesizes Microchip distributor pricing, drop-in same-package alternatives drawn from the same PIC16F152xx family, and practical design notes not collated in the standalone datasheet, providing engineers a single comparison surface for sourcing decisions.
Drop-in-Alternativen für PIC16F15245-I/REB – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PIC16F15245-I/REB (gleiche Bauform und Footprint) – abweichend in Package, Core Architecture, Operating Temperature, ADC, Program Memory (Flash).
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
PIC16F15245T-I/REB
✅ Drop-In✓ Auf Lager
$1.05 / Stück
Datenblatt ansehen →PIC16F15244-I/REB
✅ Drop-In✓ Auf Lager
$0.71 / Stück
Datenblatt ansehen →PIC16F15243-I/REB
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$0.76 / Stück
Datenblatt ansehen →PIC16F15243-E/REB
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$0.65 / Stück
Datenblatt ansehen →PIC16F15244-I/SS
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$0.85 / Stück
Datenblatt ansehen →PIC16F15243-E/P
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$0.49 / Stück
Datenblatt ansehen →PIC16F15245-I/REB Grenzwerte & elektrische Eigenschaften
| Program Memory (Flash) | 14 KB (8K x 14) |
| Data Memory (RAM) | 1 KB |
| CPU Core | 8-bit Enhanced Mid-Range PIC16 |
| Instruction Set | 49 instructions, 14-bit word |
| Maximum CPU Frequency | 32 MHz |
| Performance | 8 MIPS (32 MHz / 4) |
| Stack Levels | 16 |
| ADC | 10-bit |
| PWM Modules | 2 |
| CCP Modules | 2 (Capture/Compare/PWM) |
| EUSART | 1 |
| MSSP (SPI/I2C) | 1 |
| Peripheral Pin Select (PPS) | Yes |
| eXtreme Low-Power (XLP) | Yes (SLEEP mode) |
| Watchdog Timer (WDT) | Yes |
| High/Low-Voltage Detect (HLT) | Yes |
| Gehäuse | 20-VQFN (3x3 mm) |
| Betriebstemperatur | -40C to +85C (Industrial) |
| Montageart | Surface Mount |
| RoHS-Status | Compliant |
PIC16F15245-I/REB Pin-Konfiguration
| Pin 1 | RA0 — I/O / analog / PPS-mappable |
| Pin 2 | RA1 — I/O / analog / PPS-mappable |
| Pin 3 | RA2 — I/O / analog / PPS-mappable |
| Pin 4 | RA3 — I/O / analog / PPS-mappable |
| Pin 5 | RA4 — I/O / analog / PPS-mappable |
| Pin 6 | RA5 — I/O / analog / PPS-mappable |
| Pin 7 | VSS — Ground |
| Pin 8 | RA6 — I/O / PPS-mappable |
| Pin 9 | RA7 — I/O / PPS-mappable |
| Pin 10 | RB0 — I/O / PPS-mappable |
| Pin 11 | RB1 — I/O / PPS-mappable |
| Pin 12 | RB2 — I/O / PPS-mappable |
| Pin 13 | RB3 — I/O / PPS-mappable |
| Pin 14 | RB4 — I/O / PPS-mappable |
| Pin 15 | RB5 — I/O / PPS-mappable |
| Pin 16 | RB6 — I/O / PPS-mappable / ICDCLK |
| Pin 17 | RB7 — I/O / PPS-mappable / ICDDAT |
| Pin 18 | VDD — Positive supply |
| Pin 19 | VSS — Ground (second pin on QFN exposed pad region) |
| Pin 20 | NC — Not connected (per datasheet) |
Typische Anwendungen
PIC16F15245-I/REB ist geeignet für 7 Anwendungs: Battery-Powered IoT Sensor Node, Home Appliance Control, LED Lighting Controller, Automotive Body Electronics Sub-Module, Industrial Sensor Interface Module, Wearable Fitness/Health Device, Smart Home Hub Peripheral Board.
Battery-Powered IoT Sensor Node
The PIC16F15245-I/REB's eXtreme Low-Power (XLP) SLEEP mode with nanoamp-level wake currents and 14KB self-read/write Flash make it ideal for battery-powered IoT sensor nodes that wake periodically to sample the 10-bit ADC and transmit over the EUSART. The 32 MHz CPU delivers 8 MIPS throughput when active, processing sensor data in microseconds before returning to SLEEP. PPS allows flexible pin mapping of the ADC, EUSART, and MSSP signals to optimize PCB layout. The 20-VQFN (3x3) footprint under 9 mm² supports coin-cell form-factor designs. Compared to a 32-bit MCU alternative, the 8-bit core draws an order of magnitude less idle current.
Empfohlen
Home Appliance Control
The PIC16F15245-I/REB's two PWM modules, two CCP channels, and 10-bit ADC are well-matched to home appliance control boards driving TRIAC-gated loads, brushed DC motors, or solenoid valves. The 32 MHz core and 49-instruction enhanced mid-range instruction set respond to interrupts in deterministic cycles, critical for zero-crossing detection. Peripheral Pin Select enables the PCB designer to remap the EUSART for an IR receiver and the MSSP for an I2C sensor bus without swapping ICs. Industrial -40C to +85C temperature grade supports kitchen and laundry environments.
Empfohlen
LED Lighting Controller
The PIC16F15245-I/REB drives multi-channel LED lighting controllers using its two hardware PWM modules for flicker-free dimming and its 10-bit ADC for ambient-light feedback. The EUSART plus MSSP (SPI/I2C) interface to addressable LED driver chips such as the TLC59401 family. The 14KB Flash stores lighting profiles and the self-read/write capability supports field OTA updates via a Bluetooth module. The 20-VQFN (3x3) footprint fits inside thin LED fixture housings, and XLP SLEEP mode enables always-on standby at minimal quiescent current.
Empfohlen
Automotive Body Electronics Sub-Module
The PIC16F15245-I/REB's industrial -40C to +85C grade, robust 10-bit ADC, and CIP-based PWM make it suitable for non-safety automotive body electronics such as interior lighting, seat controllers, and HVAC flap motors. The EUSART supports LIN bus communication with an external LIN transceiver. The 14KB Flash provides room for the LIN state machine plus diagnostics. PPS remaps the UART to the LIN transceiver and the PWM outputs to the motor driver H-bridge. For under-hood applications requiring -40C to +125C, the PIC16F15243-E/REB extended-grade variant is preferred.
Empfohlen
Industrial Sensor Interface Module
The PIC16F15245-I/REB operates as an industrial sensor interface module, digitizing analog sensors via the 10-bit ADC and reporting readings over RS-485 using the EUSART with an external transceiver. The MSSP (SPI/I2C) interfaces to digital sensors and EEPROM for calibration storage. The Watchdog Timer and High/Low-Voltage Detect (HLT) ensure deterministic recovery in noisy factory environments. PPS allows the designer to remap the UART to the RS-485 transceiver pins for optimized PCB routing. The 32 MHz core executes the communication stack with adequate headroom.
Empfohlen
Wearable Fitness/Health Device
The PIC16F15245-I/REB's 20-VQFN (3x3) package at under 9 mm² fits inside wearable fitness bands where PCB area is the primary constraint. The XLP SLEEP mode combined with the 10-bit ADC and EUSART supports heart-rate, SpO2, and accelerometer sampling at sub-milliwatt average power. The 14KB Flash accommodates the sensor-fusion state machine plus BLE command parsing over a UART-connected Bluetooth module. PPS routes the I2C bus (MSSP) to the accelerometer and the EUSART to the BLE module, freeing the small QFN pinout for the sensor chain.
Empfohlen
Smart Home Hub Peripheral Board
The PIC16F15245-I/REB acts as a peripheral slave on a smart home hub motherboard, communicating via I2C (MSSP) with the host processor. Its two PWM channels drive indicator LEDs, the 10-bit ADC monitors battery or supply rail health, and the EUSART supports a backup Zigbee or sub-GHz radio path. The 14KB self-read/write Flash enables field firmware updates from the hub. PPS remaps the I2C, PWM, and UART signals to non-adjacent pins for cleaner PCB routing on the cramped peripheral board. Industrial temperature grade covers indoor environmental extremes.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PIC16F15245-I/REB – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | PIC16F15245T-I/REB | PIC16F15244-I/REB | PIC16F15243-I/REB | PIC16F15243-E/REB |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 20-VQFN (3x3 mm) | 20-VQFN (3x3 mm) - same | 20-VQFN (3x3 mm) - same | 20-VQFN (3x3 mm) - same | 20-VQFN (3x3 mm) - same |
| Flash Memory | 14 KB | 14 KB | 7 KB (reduced) | 3.5 KB (reduced) | 3.5 KB (reduced) |
| RAM | 1 KB | 1 KB | 512 B (reduced) | 256 B (reduced) | 256 B (reduced) |
| Core Frequency | 32 MHz / 8 MIPS | 32 MHz / 8 MIPS | 32 MHz / 8 MIPS | 32 MHz / 8 MIPS | 32 MHz / 8 MIPS |
| ADC | 10-bit | 10-bit | 10-bit | 10-bit | 10-bit |
| PWM / CCP | 2 PWM / 2 CCP | 2 PWM / 2 CCP | 2 PWM / 2 CCP | 2 PWM / 2 CCP | 2 PWM / 2 CCP |
| Temperature Grade | Industrial -40C to +85C | Industrial -40C to +85C | Industrial -40C to +85C | Industrial -40C to +85C | Extended -40C to +125C |
| Price (qty 1, USD) | 0.85 | 0.85 | 0.78 | 0.70 | 0.95 |
Wichtigste Unterscheidungsmerkmale
- Highest Flash density in 20-VQFN PIC16F152xx family (vs. PIC16F15244-I/REB)
- Industrial temperature grade (-40C to +85C) for mainstream use (vs. PIC16F15243-E/REB)
- Compact 20-VQFN (3x3 mm) footprint for space-constrained designs (vs. PIC16F15244-I/SS)
Designhinweise
Estimated: PIC16F15245-I/REB has only 14KB Flash, which is consumed by application code plus the bootloader region if OTA updates are planned. A typical Microchip bootloader occupies 2-4KB; verify the application + bootloader + EEPROM emulation fits within 14KB before committing to this part. Bootloader-aware configuration bits must be set during programming or the device will not start the application after reset.
Estimated: The 20-VQFN (3x3 mm) package has an exposed thermal pad that MUST be soldered to the PCB ground plane for both thermal dissipation and electrical reference. Failure to solder the e-pad can cause erratic ADC readings and reduced thermal performance. Place a 4-via thermal array (0.3 mm drill, 0.6 mm pitch) under the e-pad tied to the inner ground plane.
Decouple the VDD pin with a 100 nF ceramic capacitor placed within 3 mm of the supply pin and a 10 uF bulk capacitor on the same node. For designs using the ADC, add a ferrite bead between the analog and digital supply rails. Estimated: VDD pin current at 32 MHz active is approximately 5-7 mA, dropping to <1 uA in XLP SLEEP, so the bulk cap only needs to support transient load steps.
Compliance-Informationen
RoHS compliant per Microchip product page. Industrial temperature grade -40C to +85C; AEC-Q100 automotive qualification status not specified in the verified search results and may differ by specific part variant.
