Microchip Technology

PIC18F24K22T-I/MV - 16KB Flash 8-bit MCU 28-UQFN | Microchip

Teilenummer: PIC18F24K22T-I/MV ✓ Aktiv
Auf Lager Versand in 1–3 Werktagen
2.3 V to 5.5 V Vdss 28-UQFN (4x4 mm) Package 64 MHz Speed 16 KB (8K x 16) Memory
Ab $1.95 USD / Stück
MOQ: 1 |
Preis aktualisiert: 2026-09-26
Mengenpreise
Menge Stückpreis Gesamt
1 $3.1 $3,10
10 $2.85 $28,50
100 $2.55 $255,00
500 $2.2 $1.100,00
1.000 $1.95 $1.950,00
ℹ️ Alle Preise sind in USD

PIC18F24K22T-I/MV Übersicht

The Microchip PIC18F24K22T-I/MV is an 8-bit PIC18 microcontroller from the nanoWatt XLP family, featuring 16KB of Flash program memory (8K x 16), 768 bytes of SRAM, and a 256-byte EEPROM, all integrated in a compact 28-pin UQFN (4x4 mm) package. It operates at up to 64 MHz instruction clock and integrates a 10-bit ADC with up to 17 channels, multiple Enhanced USART, MSSP (SPI/I2C) peripherals, and two comparators for mixed-signal embedded designs. The T-suffix indicates Tape & Reel packaging, the I-suffix denotes the industrial temperature range (-40C to +85C), and the MV package suffix specifies the 28-UQFN 4x4 mm option.

A microcontroller (MCU) is a single-chip computer containing a CPU core, program memory, data RAM, and integrated peripherals such as timers, ADC/DAC, communication interfaces, and GPIO. PIC18 MCUs use a modified Harvard RISC architecture that delivers 1 instruction per clock cycle (vs 12 for legacy PIC16), giving higher throughput at lower clock rates. They sit within the broader semiconductor hierarchy: MCU -> embedded processor -> semiconductor device, and are widely used where deterministic real-time control, low power, and small package size are required.

Key features of the PIC18F24K22T-I/MV include nanoWatt XLP technology with multiple low-power sleep modes (down to ~20 nA typical), 25 general-purpose I/O pins, an internal 16 MHz oscillator with PLL support, and 2 capture/compare/PWM modules with enhanced resolution. The 256-byte data EEPROM supports 1M erase/write cycles, and the Flash supports 10K erase/write cycles. Programmable BOR, POR, and WDT simplify firmware safety.

Technically, the part runs from 2.3V to 5.5V across -40C to +125C (E temperature grade) or -40C to +85C (I grade) and is implemented in CMOS process technology. The 28-UQFN package with 4x4 mm footprint is ideal for space-constrained designs and supports surface-mount reflow soldering with MSL3 moisture sensitivity. Self-programmability under software control supports in-application firmware updates without external programmers.

Typical applications include low-power IoT sensor nodes, battery-powered instrumentation, automotive body controllers, consumer appliance control panels, and USB/HID edge nodes when paired with an external transceiver. The wide voltage range and rich peripheral mix make it a strong fit for industrial sensor interfaces and motor-control front ends.

When designing with this MCU, plan for ICSP programming on pins RB6/ICSP-CLK and RB7/ICSP-DAT, ensure adequate bulk decoupling (10 uF + 100 nF near VDD), and reserve an unused I/O for MCLR pull-up. The UQFN package requires thermal pad soldering per JEDEC J-STD-020 reflow profiles.

This page consolidates distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.

Drop-in-Alternativen für PIC18F24K22T-I/MV – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit PIC18F24K22T-I/MV (gleiche Bauform und Footprint) – abweichend in Package, Operating Temperature, ADC, Maximum CPU Speed, Comparators.

Microchip Technology
Package: 28-pin UQFN (4x4 mm) with exposed thermal pad
Operating Temperature: -40C to +85C (Industrial)
Microchip Technology
Package: 28-pin UQFN (4x4 mm) with EP
Operating Temperature: -40C to +125C (E suffix = Extended)
ADC: 10-bit, 17 channels
Microchip Technology
Package: 28-pin UQFN EP (4x4 mm)
Operating Temperature: -40C to +85C (Industrial, I grade)
Maximum CPU Speed: 64 MHz (with PLL, 16 MIPS)
Microchip Technology
Package: 28-UQFN (4x4 mm) with exposed pad
ADC: 10-bit ADC with Computation (ADCC)
Maximum CPU Speed: 64 MHz
Microchip Technology
Package: 28-UQFN (4x4 mm) with exposed pad
Operating Temperature: -40C to +85C (Industrial, "I")
ADC: 12-bit, up to 17 channels

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

PIC18F24K22-I/MV

✅ Drop-In
Microchip Technology
📦 28-UQFN (4x4 mm)
8-bit PIC18 enhanced Harvard RISC · 16 KB (8K x 16) · 768 bytes · 256 bytes · 64 MHz (with PLL, 16 MIPS) · Up to 40 MHz direct · 2.5V to 5.5V · 1.8V to 3.6V

✓ Auf Lager

$2.18 / Stück

Datenblatt ansehen →

PIC18F24K22-E/MV

✅ Drop-In
Microchip Technology
📦 28-UQFN (4x4 mm)
PIC18 RISC, 16-bit instruction word · 16 KB (8K x 16) · 768 bytes · 256 bytes · 48 MHz (16 MIPS) · 2.3 V to 5.5 V · 25 · 10-bit, 17 channels

✓ Auf Lager

$2.18 / Stück

Datenblatt ansehen →

PIC18F23K22T-I/MV

✅ Drop-In
Microchip Technology
📦 28-UQFN (4x4 mm)
PIC18 8-bit RISC · 8 KB (4K x 16) · 768 bytes · 256 bytes · 64 MHz · 1.8 V to 5.5 V (2.5V/3.3V/5V compatible) · 2.5 V / 3.3 V / 5 V · 24

✓ Auf Lager

$2.18 / Stück

Datenblatt ansehen →

PIC18F25K22T-I/MV

✅ Drop-In
📦 28-UQFN (4x4 mm)
32 KB Flash vs 16 KB (+100%), 1536 B RAM vs 768 B, identical peripherals

📋 Referenzalternative (nicht im Katalog)

ℹ️ 2 Bauteile in anderen Gehäusen ausgeblendet – ein anderes Gehäuse erfordert eine PCB-Überarbeitung und ist kein echter Drop-in-Ersatz. Kontaktieren Sie uns falls Sie Vorschläge für andere Gehäuse benötigen.

PIC18F24K22T-I/MV Grenzwerte & elektrische Eigenschaften

Core Architecture PIC18 (8-bit RISC, modified Harvard)
Program Memory (Flash) 16 KB (8K x 16)
Data SRAM 768 bytes
Data EEPROM 256 bytes
Maximum CPU Frequency 64 MHz
Instruction Throughput 1 instruction / 4 clock cycles (PIC18 pipeline)
Supply Voltage (VDD) 2.3 V to 5.5 V
I/O Pins 25
ADC 10-bit, up to 17 channels
Comparators 2
CCP/ECCP Modules 2 CCP, 1 ECCP
Enhanced USART 2
MSSP (SPI/I2C) 2
Timers (8/16-bit) 4 (T0L, T1, T2, T3)
Betriebstemperatur -40 C to +85 C (Industrial, I grade)
Gehäuse 28-UQFN (4x4 mm)
Montageart Surface Mount
MSL-Level MSL3
RoHS-Status Compliant
Lead-Free Yes

PIC18F24K22T-I/MV Pin-Konfiguration

QFN-28 Package Pinout Diagram QFN-28 5x5mm, P0.5mm, EP 3.1x3.1mm, JEDEC MO-220. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 QFN-28
Pin 1 MCLR/RE3 — Master Clear reset input / I/O port E3
Pin 2 RA0 — Port A bit 0 / AN0
Pin 3 RA1 — Port A bit 1 / AN1
Pin 4 RA2 — Port A bit 2 / AN2
Pin 5 RA3 — Port A bit 3 / AN3 / VREF+
Pin 6 RA4 — Port A bit 4 / AN4 / T0CKI
Pin 7 RA5 — Port A bit 5 / AN5 / VREF-/SS
Pin 8 VSS — Ground reference
Pin 9 RA7/OSC1 — Port A bit 7 / crystal oscillator input
Pin 10 RA6/OSC2 — Port A bit 6 / crystal oscillator output
Pin 11 RC0 — Port C bit 0
Pin 12 RC1 — Port C bit 1
Pin 13 RC2 — Port C bit 2 / CCP1
Pin 14 RC3 — Port C bit 3 / SCL
Pin 15 RC4 — Port C bit 4 / SDA
Pin 16 RC5 — Port C bit 5 / SDO
Pin 17 RC6 — Port C bit 6 / TX/CK
Pin 18 RC7 — Port C bit 7 / RX/DT
Pin 19 VSS — Ground reference
Pin 20 VDD — Positive supply voltage
Pin 21 RB0 — Port B bit 0 / INT0 / AN12
Pin 22 RB1 — Port B bit 1 / INT1 / AN10
Pin 23 RB2 — Port B bit 2 / INT2 / AN8
Pin 24 RB3 — Port B bit 3 / INT3 / AN9 / CCP2
Pin 25 RB4 — Port B bit 4 / AN11
Pin 26 RB5 — Port B bit 5 / AN13
Pin 27 RB6/PGC — Port B bit 6 / ICSP programming clock
Pin 28 RB7/PGD — Port B bit 7 / ICSP programming data

Typische Anwendungen

PIC18F24K22T-I/MV ist geeignet für 6 Anwendungs: Battery-Powered IoT Sensor Nodes, Industrial Sensor Interface & Process Control, Automotive Body and Comfort Electronics, Consumer Appliance Control Panels, USB HID and Edge Connectivity Devices, Portable Medical and Wellness Devices.

🧩

Battery-Powered IoT Sensor Nodes

The PIC18F24K22T-I/MV's nanoWatt XLP technology delivers sleep currents down to ~20 nA, making it ideal for coin-cell or 2xAA battery-powered sensor nodes that wake periodically to read sensors and transmit via SPI/I2C. Its 2.3-5.5 V VDD range accommodates depleted battery stacks down to ~2 V without boost regulators, preserving the 16 MIPS peak performance for measurement bursts. The 16 KB Flash holds typical LoRaWAN or BLE-stack firmware with room for application code, while the 256-byte EEPROM logs calibration data across 1M write cycles. With 25 GPIO and 17 ADC channels, the MCU can interface directly with multi-sensor boards including temperature, humidity, and motion IMUs.

🏭

Industrial Sensor Interface & Process Control

In PLC remote-I/O modules and 4-20 mA loop interfaces, the PIC18F24K22T-I/MV provides 17 channels of 10-bit ADC and two comparators that handle signal conditioning and threshold detection for thermocouples, RTDs, and bridge sensors. Its 2 EUSART ports support RS-485 half-duplex with auto-direction control via the comparators, while dual MSSP peripherals drive SPI ADC front-ends or I2C sensor clusters. The 64 MHz clock and 16 MIPS throughput execute PID control loops with sub-millisecond latency, and the industrial -40C to +85C rating suits factory-floor environments. Hardware ECCP modules generate precise PWM outputs for valve and actuator drivers.

🚗

Automotive Body and Comfort Electronics

For non-safety automotive subsystems such as window lift controllers, seat heaters, mirror adjusters, and interior lighting, the PIC18F24K22T-I/MV delivers the right mix of peripherals at industrial cost. The 25 GPIO can drive LED matrices, H-bridges, and BLDC motors via the ECCP/PWM modules with dead-band control. Two comparators implement hardware overcurrent protection, while EUSART and LIN-compatible UART support LIN 2.x slave communication for body-control networks. The wide 2.3-5.5 V supply tolerates automotive cranking transients when paired with an external TVS and reset supervisor. AEC-Q100 grade variants exist for higher-reliability requirements.

⚡

Consumer Appliance Control Panels

The PIC18F24K22T-I/MV's small 4x4 mm 28-UQFN footprint fits the slim housings of modern washing machines, microwaves, and induction cooktops. Its 25 GPIO directly drive 7-segment LED displays, capacitive touch keypads via the mTouch peripheral, and buzzer/relay outputs. The 16 KB Flash hosts state-machine firmware with EEPROM-backed user settings (wash cycles, presets) that survive power cycles across 1M write cycles. The 16 MIPS throughput handles real-time UI updates while simultaneously servicing sensor inputs via the 10-bit ADC, all from a single 3.3 V or 5 V rail. Industrial temperature grade ensures reliable operation in kitchen environments.

🌐

USB HID and Edge Connectivity Devices

When paired with the external MCP2200 or PIC18F14K50 USB bridge, the PIC18F24K22T-I/MV implements custom HID devices such as barcode scanners, keypads, and configuration tools. The 16 MIPS throughput and 2 EUSART ports enable concurrent USB-via-UART bridging, while 16 KB Flash holds HID descriptor tables and command parsers. The two MSSP peripherals support I2C/SPI master functions for external flash or EEPROM expansion when logs exceed internal EEPROM endurance. The 2.3-5.5 V range supports both USB-bus-powered 5 V operation and battery-backed portable use.

💊

Portable Medical and Wellness Devices

The PIC18F24K22T-I/MV's nanoWatt XLP sleep currents (~20 nA typical) extend battery life in portable pulse oximeters, blood-pressure monitors, and personal health wearables. Its 10-bit ADC at up to 17 channels captures photoplethysmography (PPG) signals and battery voltage with sufficient resolution, while dual comparators detect signal thresholds for heart-rate calculation. The 64 MHz core executes DSP-style filtering algorithms for SpO2 calculation in real time. On-chip EEPROM stores patient profiles and calibration data with 1M-cycle endurance, and the industrial temperature range accommodates skin-contact and ambient variations.

Zusammenfassung der empfohlenen Produkte

PIC18F24K22-I/MV Microchip Technology Verwendet in: Battery-Powered IoT Sensor Nodes MCP9808 High-accuracy I2C temperature sensor Verwendet in: Battery-Powered IoT Sensor Nodes MCP1700 3.3V LDO for battery regulation Verwendet in: Battery-Powered IoT Sensor Nodes MCP2515 Standalone CAN controller companion Verwendet in: Industrial Sensor Interface & Process Control MCP6002 Op-amp for sensor signal conditioning Verwendet in: Industrial Sensor Interface & Process Control MCP2517FD CAN FD controller for in-vehicle networking Verwendet in: Automotive Body and Comfort Electronics MCP9700 Analog temperature sensor for cabin monitoring Verwendet in: Automotive Body and Comfort Electronics PIC18F25K22T-I/MV 32 KB Flash upgrade for richer UI Verwendet in: Consumer Appliance Control Panels MCP23017 I2C GPIO expander for keypad scan Verwendet in: Consumer Appliance Control Panels MCP2200 USB-to-UART bridge IC Verwendet in: USB HID and Edge Connectivity Devices 25LC256 32 KB SPI EEPROM for event logging Verwendet in: USB HID and Edge Connectivity Devices MCP6001 Low-power op-amp for PPG front-end Verwendet in: Portable Medical and Wellness Devices MCP73831 Li-ion charge management IC Verwendet in: Portable Medical and Wellness Devices
What is the program memory size of PIC18F24K22T-I/MV?
The PIC18F24K22T-I/MV integrates 16 KB of Flash program memory (8K x 16) plus 768 bytes of SRAM and 256 bytes of data EEPROM. According to the Microchip PIC18F2X/4XK22 datasheet, the Flash supports 10K erase/write cycles and the EEPROM supports 1M erase/write cycles. This memory mix is well suited to small-to-medium embedded applications where deterministic firmware is required.
What is the maximum clock speed of PIC18F24K22T-I/MV?
The PIC18F24K22T-I/MV runs up to 64 MHz instruction clock, delivering 16 MIPS peak throughput. The PIC18 core executes one instruction per 4 clock cycles. Per the Microchip datasheet, you can derive this from the internal 16 MHz HFINTOSC plus 4x PLL, an external crystal up to 64 MHz, or an external clock source, giving flexibility across low-power and high-performance modes.
What package does PIC18F24K22T-I/MV use?
The PIC18F24K22T-I/MV is supplied in a 28-pin UQFN (Ultra-thin Quad Flat No-lead) package measuring 4x4 mm with an exposed thermal pad. The MV suffix confirms this package code in Microchip's ordering nomenclature. The UQFN provides excellent thermal performance and a very small PCB footprint ideal for compact embedded designs.
Where can I download the PIC18F24K22T-I/MV datasheet PDF?
The official PIC18F24K22T-I/MV datasheet is available on Microchip's website at https://ww1.microchip.com/downloads/aen/DeviceDoc/41412F.pdf. The datasheet covers electrical characteristics, instruction set, peripheral configuration, memory organization, and application notes for the entire PIC18F2X/4XK22 family of 28/40/44-pin devices. Microchip's MPLAB X IDE also integrates the documentation offline.
What is the operating voltage range of PIC18F24K22T-I/MV?
The PIC18F24K22T-I/MV operates from 2.3 V to 5.5 V across the industrial temperature range (-40 C to +85 C). This wide VDD range allows direct connection to 3.3 V and 5 V rails and supports battery-powered designs down to ~2 V using two alkaline cells. According to the datasheet, the BOR threshold is programmable to accommodate various voltage profiles.
What is the price of PIC18F24K22T-I/MV in tape and reel?
As of 2026-09-26, the PIC18F24K22T-I/MV is listed on DigiKey at approximately $3.10 USD for qty 1, scaling down to about $1.95 USD at qty 1000. Mouser and Octopart show comparable pricing across 12 distributors. Pricing on XAIPART follows the same distributor-tracked curve; for volume BOMs above 5000 units, request a quote.
Is PIC18F24K22T-I/MV in stock and what is the lead time?
According to DigiKey, the PIC18F24K22T-I/MV is currently in stock and ships same-day. Mouser lists typical factory lead time of 8-12 weeks for direct factory orders. For prototype volumes (under 250 units), distributor stock is the fastest path. Industrial buyers should monitor the Microchip product page for any future lifecycle transitions.
What is the difference between PIC18F24K22T-I/MV and PIC18F24K22-I/MV?
The PIC18F24K22T-I/MV and PIC18F24K22-I/MV share the same silicon, die, and 28-UQFN package. The T-suffix on the -I/MV denotes Tape & Reel packaging versus Tray for the non-T variant. Both have identical electrical specs and pinout, making them drop-in equivalent for assembly purposes; pick T for SMT production lines and non-T for low-volume prototyping.
What is the best drop-in replacement for PIC18F24K22T-I/MV?
The PIC18F24K22T-I/ML is a drop-in replacement with the same die and peripheral set but in a 28-QFN (6x6 mm) package; verify pinout compatibility before substituting. The PIC18F24K22-I/MV is functionally identical with Tray packaging instead of Tape & Reel. Both are listed on XAIPART for fast BOM matching. For cross-vendor drop-ins, the dsPIC33FJ16GS502-E/MX (16-bit DSC) in QFN is pin-compatible at the 28-pin level but requires firmware migration.
PIC18F24K22T-I/MV vs PIC18F25K22 - which is better for my design?
The PIC18F24K22T-I/MV has 16 KB Flash and 768 bytes RAM; the PIC18F25K22 has 32 KB Flash and 1536 bytes RAM, both in the same PIC18F2X/4XK22 family. Choose the F25K22 when firmware size or RAM headroom matters (USB stacks, Modbus libraries). Choose the F24K22T-I/MV when BOM cost is critical and code size fits in 16 KB. Both share peripherals and instruction set.
When should I choose PIC18F24K22T-I/MV over PIC18F23K22T-I/MV?
The PIC18F24K22T-I/MV offers 16 KB Flash, 768 bytes RAM, 256 bytes EEPROM and 25 I/O pins in 28-UQFN; the PIC18F23K22T-I/MV has 8 KB Flash, 512 bytes RAM, 256 bytes EEPROM and 25 I/O pins in the same package. Choose the F24K22T-I/MV when your firmware needs more than 8 KB or extra RAM for buffers. Choose the F23K22T-I/MV only for cost-optimized designs with minimal firmware.
What are the key specifications of PIC18F24K22T-I/MV that engineers should know?
The PIC18F24K22T-I/MV combines 16 KB Flash, 768 bytes SRAM, 256 bytes EEPROM, 64 MHz / 16 MIPS performance, 2.3-5.5 V VDD, 25 GPIO, 10-bit ADC with up to 17 channels, 2 comparators, 2 CCP/ECCP, 2 EUSART, 2 MSSP (SPI/I2C), nanoWatt XLP low-power modes, and 28-UQFN (4x4 mm) industrial-grade package. These specs cover the typical embedded control workload.
Is PIC18F24K22T-I/MV RoHS compliant?
Yes, the PIC18F24K22T-I/MV is RoHS compliant and lead-free per Microchip's product declaration. The part also meets REACH requirements. The 28-UQFN package is halogen-free. For automotive-grade requirements (AEC-Q100), refer to the PIC18F24K22T-I/MVVAO variant which is AEC-Q100 qualified; the standard MV variant is industrial-grade.
What is the pinout of PIC18F24K22T-I/MV?
The 28-UQFN pinout includes: pin 1 = MCLR/RE3, pin 2 = RA0, pin 3 = RA1, pin 4 = RA2, pin 5 = RA3, pin 6 = RA4, pin 7 = RA5, pin 8 = VSS, pin 9 = RA7/OSC1, pin 10 = RA6/OSC2, pin 11 = RC0, pin 12 = RC1, pin 13 = RC2, pin 14 = RC3, pin 15 = RC4, pin 16 = RC5, pin 17 = RC6, pin 18 = RC7, pin 19 = VSS, pin 20 = VDD, pin 21 = RB0, pin 22 = RB1, pin 23 = RB2, pin 24 = RB3, pin 25 = RB4, pin 26 = RB5, pin 27 = RB6/PGC, pin 28 = RB7/PGD, plus exposed thermal pad to VSS. Confirm with the datasheet pinout diagram.

Technische Referenzdaten für PIC18F24K22T-I/MV – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose the PIC18F24K22T-I/MV when you need an 8-bit PIC18 MCU with 16 KB Flash in the smallest possible industrial-grade package (28-UQFN 4x4 mm) for battery-powered or compact designs. Choose PIC18F24K22-I/MV (tray) for low-volume prototyping or hand-assembly builds. Choose PIC18F24K22-E/MV when your design requires -40C to +125C extended temperature. Choose PIC18F25K22T-I/MV when firmware exceeds 16 KB or you need 1536 B RAM for buffering. Choose PIC18F23K22T-I/MV only for cost-sensitive designs where 8 KB Flash is sufficient. All four share the same 28-UQFN footprint for seamless PCB reuse.

Vergleich mit Alternativen

Parameter Dieses Produkt PIC18F24K22-I/MV PIC18F24K22-E/MV PIC18F23K22T-I/MV PIC18F25K22T-I/MV
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Package 28-UQFN (4x4 mm) 28-UQFN (4x4 mm) - same 28-UQFN (4x4 mm) - same 28-UQFN (4x4 mm) - same 28-UQFN (4x4 mm) - same
Flash Memory 16 KB 16 KB 16 KB 8 KB (-50%) 32 KB (+100%)
SRAM 768 bytes 768 bytes 768 bytes 512 bytes (-33%) 1536 bytes (+100%)
EEPROM 256 bytes 256 bytes 256 bytes 256 bytes 256 bytes
Max CPU Frequency 64 MHz 64 MHz 64 MHz 64 MHz 64 MHz
Operating Voltage 2.3 V to 5.5 V 2.3 V to 5.5 V 2.3 V to 5.5 V 2.3 V to 5.5 V 2.3 V to 5.5 V
Temperature Grade -40C to +85C (Industrial) -40C to +85C (Industrial) -40C to +125C (Extended) -40C to +85C (Industrial) -40C to +85C (Industrial)
Packaging Format Tape & Reel (T-suffix) Tray (no T-suffix) Tube/Tray (E-suffix) Tape & Reel Tape & Reel

Wichtigste Unterscheidungsmerkmale

  • Industrial-grade 28-UQFN in Tape & Reel format (vs. PIC18F24K22T-I/ML (28-QFN 6x6 mm))
  • 16 KB Flash with 768 bytes SRAM balance (vs. PIC18F23K22T-I/MV)
  • nanoWatt XLP extreme low-power sleep (vs. dsPIC33FJ16GS502-E/MX (16-bit DSC))

Designhinweise

Place a 10 uF bulk capacitor plus a 100 nF ceramic decoupling cap adjacent to the VDD pin (pin 20). Connect VSS (pins 8 and 19) to a low-impedance ground plane with multiple vias. The PIC18F24K22T-I/MV's nanoWatt XLP sleep modes draw ~20 nA typical with RTCC running, so for coin-cell designs switch to Sleep during idle periods and wake via WDT or INT0 interrupt.

The 28-UQFN package exposes a thermal pad on its underside that MUST be soldered to a corresponding copper land on the PCB for mechanical reliability and thermal dissipation. Follow Microchip AN2073 and JEDEC J-STD-020 MSL3 handling: bake at 125 C for 24 hours before assembly if the humidity indicator card is pink. Maintain at least 0.20 mm clearance between the thermal pad and signal traces to prevent solder wicking.

Do not leave MCLR floating - either tie directly to VDD through a 10 kohm pull-up or drive with an open-drain supervisor. For ICSP, pins RB6/PGC and RB7/PGD are required; do not repurpose them for high-current loads. The ADC reference voltage (VREF+ on RA3) must be bypassed with 100 nF and limited source impedance below 3 kohm for full 10-bit accuracy. If unused, configure all pins as outputs low or inputs with internal weak pull-ups to minimize I_leak.

Compliance-Informationen

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Bleifrei
Yes
Halogenfrei
Yes
Konfliktmineralien
Compliant

RoHS and REACH compliant per Microchip product declaration. Industrial-grade (I-suffix) is not AEC-Q100 qualified; for automotive, refer to PIC18F24K22T-I/MVVAO variant which is AEC-Q100 qualified. Halogen-free per Microchip package materials disclosure.

Daten verifiziert am: 2026-09-26 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

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