PIC18F23K22T-I/MV - 8KB Flash 64MHz 8-bit MCU | Microchip
MPN: PIC18F23K22T-I/MV ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3.42 | $3.42 |
| 10 | $3.08 | $30.80 |
| 100 | $2.74 | $274.00 |
| 500 | $2.46 | $1,230.00 |
| 1,000 | $2.18 | $2,180.00 |
PIC18F23K22T-I/MV Overview
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, non-volatile program memory (FLASH), working RAM, and a rich set of peripherals on one silicon die. PIC18F-series microcontrollers sit in the 8-bit PIC family (PIC -> 8-bit MCU -> microcontroller -> embedded IC -> semiconductor). They are used wherever deterministic, low-power, low-cost embedded control is needed.
Key features of the PIC18F23K22T-I/MV include nanoWatt XLP extreme-low-power technology with multiple sleep modes, a 10-bit ADC with up to 17 channels, multiple Enhanced USART, MSSP (SPI/I2C), and a 16-bit timer/counter array. The industrial -40C to +85C temperature grade and XLP technology target battery-powered, always-on, and portable designs where standby current is critical.
The architecture uses a Harvard RISC core with a hardware multiplier and 31-level stack, supporting C and assembly development with Microchip's MPLAB X IDE and XC8 toolchain. The 28-UQFN (4x4 mm) footprint plus exposed thermal pad makes it ideal for space-constrained boards that still need robust thermal performance.
Typical applications include IoT sensor nodes, industrial control modules, low-power remote controls, USB HID peripherals, and battery-powered instrumentation. The wide voltage range and XLP modes make it well-suited for wearables and always-on energy-harvesting products.
When designing with this part, ensure the exposed pad is soldered to a sufficient copper pour for thermal dissipation and that MPLAB X with the XC8 compiler is used for code development and debug via ICSP.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for PIC18F23K22T-I/MV — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC18F23K22T-I/MV (same form factor and footprint) — differing in Package, Operating Temperature, ADC, MSL Level, Program Memory (Flash).
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC18F23K22-I/MV
✅ Drop-In✓ In Stock
$1.42 / Unit
View Datasheet →PIC18F23K20T-I/MV
✅ Drop-In✓ In Stock
$1.92 / Unit
View Datasheet →PIC18F24K22-I/MV
✅ Drop-In✓ In Stock
$1.96 / Unit
View Datasheet →PIC18F23K22T-I/MV Maximum Ratings & Electrical Characteristics
| Core | PIC18 8-bit RISC |
| Program Memory (FLASH) | 8 KB (4K x 16) |
| Data SRAM | 768 bytes |
| Data EEPROM | 256 bytes |
| Maximum CPU Frequency | 64 MHz |
| Operating Voltage Range | 1.8 V to 5.5 V (2.5V/3.3V/5V compatible) |
| Supply Voltage (nominal) | 2.5 V / 3.3 V / 5 V |
| I/O Pins | 24 |
| ADC | 10-bit, up to 17 channels |
| Timers | 16-bit timer/counter array |
| Communication | EUSART, MSSP (SPI/I2C) |
| Low-Power Technology | nanoWatt XLP |
| Package | 28-pin UQFN (4x4 mm) with exposed thermal pad |
| Mounting Type | Surface Mount (Tape & Reel) |
| Operating Temperature | -40C to +85C (Industrial) |
| MSL Level | 1 |
| RoHS Status | Compliant |
PIC18F23K22T-I/MV Pin Configuration
| Pin 1 | RA2 — GPIO / analog input AN2 |
| Pin 2 | RA3 — GPIO / analog input AN3 / VREF+ |
| Pin 3 | RA4 — GPIO / analog input AN4 |
| Pin 4 | RA5 — GPIO / analog input AN5 / digital I/O |
| Pin 5 | VSS — Ground reference |
| Pin 6 | RA7 — GPIO / analog input AN6 |
| Pin 7 | RA6 — GPIO / analog input AN7 / OSC2 |
| Pin 8 | OSC1 — Crystal oscillator input / CLKIN |
| Pin 9 | RA1 — GPIO / analog input AN1 |
| Pin 10 | RA0 — GPIO / analog input AN0 |
| Pin 11 | VDD — Positive supply voltage |
| Pin 12 | RB5 — GPIO / digital I/O |
| Pin 13 | RB4 — GPIO / digital I/O |
| Pin 14 | RB3 — GPIO / digital I/O |
| Pin 15 | RB2 — GPIO / digital I/O |
| Pin 16 | RB1 — GPIO / digital I/O |
| Pin 17 | RB0 — GPIO / digital I/O / INT0 |
| Pin 18 | RC7 — GPIO / digital I/O / RX/DT |
| Pin 19 | RC6 — GPIO / digital I/O / TX/CK |
| Pin 20 | RC5 — GPIO / digital I/O |
| Pin 21 | RC4 — GPIO / digital I/O |
| Pin 22 | RC3 — GPIO / digital I/O / SCL |
| Pin 23 | RC2 — GPIO / digital I/O / SDA |
| Pin 24 | RC1 — GPIO / digital I/O / CCP2 |
| Pin 25 | RC0 — GPIO / digital I/O |
| Pin 26 | RB7 — GPIO / digital I/O / ICSP DAT |
| Pin 27 | RB6 — GPIO / digital I/O / ICSP CLK |
| Pin 28 | VSS — Ground reference (second pad) |
Typical Applications
PIC18F23K22T-I/MV is suitable for 6 applications: Battery-Powered IoT Sensor Node, Industrial Control Module, USB HID Peripheral / Low-Speed HID Device, Wearable Fitness / Health Band, Smart Home Sensor / Edge Node, Battery Charger / Power Management Front-End.
Battery-Powered IoT Sensor Node
The PIC18F23K22T-I/MV's nanoWatt XLP technology delivers standby currents in the sub-microamp range, making it ideal for battery-powered IoT sensor nodes that must run for years on a single coin cell. Its 1.8V-5.5V VDD range means the same hardware can operate from a 3V CR2032, two AA cells, or a Li-ion pack without a separate regulator. The 10-bit ADC with up to 17 channels digitizes temperature, humidity, and battery-voltage telemetry, while the 64MHz/16 MIPS core handles sensor pre-processing, scheduling, and on-chip EUSART for UART communication to a radio co-processor. Compared with a discrete analog+BOM implementation, the integrated MCU shrinks the PCB to a coin-cell form factor.
Recommended
Industrial Control Module
The PIC18F23K22T-I/MV's industrial -40C to +85C temperature grade and 5V-tolerant I/O suit it for factory-floor control modules that must coexist with 24V sensor buses and motor drivers. The 28-UQFN (4x4 mm) with exposed thermal pad dissipates heat efficiently when driving optocouplers, MOSFET gates, and relay coils. Its EUSART and MSSP peripherals support RS-485, SPI sensor, and I2C EEPROM connectivity, while the 10-bit ADC reads 4-20 mA loop currents and bridge pressure sensors. The 8KB FLASH accommodates a small IEC-61131-style state machine and diagnostic firmware.
Recommended
USB HID Peripheral / Low-Speed HID Device
When paired with an external USB transceiver, the PIC18F23K22T-I/MV implements low-speed USB Human Interface Devices such as keyboards, mice, and custom HID controls. The 64MHz core handles HID report generation, debouncing up to 24 GPIO inputs, and LED drive without an extra peripheral MCU. The wide 1.8V-5.5V range lets designers run the device directly from USB 5V without a separate LDO. The exposed-pad 28-UQFN (4x4 mm) is small enough for ultra-thin keyboards and presenter remotes.
Recommended
Wearable Fitness / Health Band
The PIC18F23K22T-I/MV's nanoWatt XLP sleep modes (down to tens of nA) and small 28-UQFN footprint fit comfortably inside a wrist-worn fitness band. It handles BLE co-processor handshaking through its EUSART, reads optical heart-rate sensor analog output via the 10-bit ADC, and drives an I2C OLED display through MSSP. The 256-byte EEPROM stores user settings, while 768 bytes of SRAM handles small display frame buffers. The 64MHz performance runs step-counting and gesture algorithms in real time without taxing battery life.
Recommended
Smart Home Sensor / Edge Node
The PIC18F23K22T-I/MV anchors compact smart-home edge nodes - temperature, occupancy, and ambient-light sensors - that talk to gateways via UART, SPI, or low-power wireless modules. Its 24 GPIO drive capability interfaces directly with PIR motion sensors, reed switches, and PWM LED indicators. The industrial temperature grade suits attic or garage deployments, and the 8KB FLASH accommodates Zigbee/Z-Wave bridging firmware stacks. Compared with a Wi-Fi-SoC-only design, this PIC + co-processor split yields years of battery operation on two AA cells.
Recommended
Battery Charger / Power Management Front-End
The PIC18F23K22T-I/MV's 1.8V-5.5V VDD range and 10-bit ADC with multiple channels are well suited to battery-charger front-ends for Li-ion, NiMH, or lead-acid packs. The MCU monitors charge current, cell voltage, and temperature via the ADC, then drives MOSFET gates through GPIO to terminate charge safely. Its 5V-tolerant I/O simplifies interface to USB or solar-panel inputs. The exposed-pad 28-UQFN (4x4 mm) handles modest thermal loads when the system dissipates a few hundred mW.
Recommended
Recommended Products Summary
Engineering reference data for PIC18F23K22T-I/MV — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC18F23K22-I/MV | PIC18F23K20T-I/MV | PIC18F24K22-I/MV | PIC18F43K22-I/MV |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-UQFN (4x4 mm) | 28-UQFN (4x4 mm) - same | 28-UQFN (4x4 mm) - same | 28-UQFN (4x4 mm) - same | 40-UQFN (MV) - not pin-compatible |
| FLASH Program Memory | 8 KB | 8 KB | 8 KB | 16 KB (+100%) | 8 KB |
| Data SRAM | 768 B | 768 B | 512 B (-33%) | 768 B | 768 B |
| Maximum Clock Speed | 64 MHz (16 MIPS) | 64 MHz (16 MIPS) | 64 MHz (16 MIPS) | 64 MHz (16 MIPS) | 64 MHz (16 MIPS) |
| Operating Voltage | 1.8V to 5.5V | 1.8V to 5.5V | 1.8V to 5.5V | 1.8V to 5.5V | 1.8V to 5.5V |
| Automotive Grade (AEC-Q100) | No (Industrial) | No (Industrial) | No (Industrial) | Yes (AEC-Q100) | No (Industrial) |
| Low-Power Technology | nanoWatt XLP | nanoWatt XLP | nanoWatt XLP | nanoWatt XLP | nanoWatt XLP |
Key Differentiators
- Same UQFN-28 footprint, doubled FLASH for OTA firmware (vs PIC18F24K22-I/MV)
- Newer K22 sub-family with more peripherals than K20 (vs PIC18F23K20T-I/MV)
- Industrial-only qualification matches the part's intended use (vs PIC18F24K22-I/MV (automotive qualified))
Design Notes
Estimated: the 28-UQFN (MV) package relies on its exposed thermal pad for heat removal. At 64MHz/5V/24mA load the chip dissipates roughly 120mW; with the exposed pad soldered to a 1-square-inch copper pour the junction-to-ambient thermal resistance is around 35-40 C/W. Always solder the EP to the ground plane and use thermal vias to inner copper layers; do not leave the pad isolated or the device will overheat in enclosed industrial enclosures.
Place a 100nF decoupling capacitor as close as possible to the VDD pin (pin 11) and another bulk 1uF-10uF capacitor on the same net. The exposed thermal pad must be soldered to the ground plane using an array of 4-6 thermal vias (0.3mm drill) to maximize heat flow into inner layers. Keep the ICSP pins (RB6/RB7) accessible for in-circuit programming without routing high-speed signals under them.
Do not assume firmware portability between PIC18F23K22T-I/MV and PIC18F23K20T-I/MV: the K22 sub-family adds new peripherals and changes register addresses vs K20. Always recompile with the matching XC8 device header. Also confirm that the CONFIG words (fuses) match oscillator and watchdog settings, since migrating between K22/K20 may silently change default oscillator configurations on first power-up.
Route analog input traces (AN0-AN7) away from digital switching lines and high-current traces. If using the ADC for precision measurements add a small RC low-pass filter (1kohm + 100nF) at each analog input pin. Keep the 10-bit ADC reference (VREF+/VREF-) traces short and bypassed with 100nF capacitors to avoid reference noise dominating conversion accuracy.
Compliance Information
Industrial-grade part (not AEC-Q100 qualified). For automotive designs use PIC18F24K22-I/MV which is AEC-Q100 qualified.
